FBGA Digital-to-Analog Converters 36

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD9171BBPZ

Analog Devices

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

Yes

1

16

1.07 A

Parallel

1 V

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.067 in (1.71 mm)

0.394 in (10 mm)

0.394 in (10 mm)

2's Complement

AD9171BBPZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

Yes

1

16

1.07 A

Parallel

1 V

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.067 in (1.71 mm)

0.394 in (10 mm)

0.394 in (10 mm)

2's Complement

DAC38RF86IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC39J84IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

.6 V

Yes

2800 MHz

1

CMOS

16

Parallel, Word

3.3 V

Grid Array, Fine Pitch

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF96IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF89IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

8400 MHz

1

14

1.25 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF85IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF85IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF80IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.76 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF93IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF82IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.25 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF82IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.25 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF87IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

6200 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

PDAC38RF89AAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

1

14

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.076 in (1.94 mm)

0.394 in (10 mm)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF84IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF83IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF97IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

6200 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF83IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF80IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.76 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF86IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC39J84IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

.6 V

Yes

2800 MHz

1

CMOS

16

Parallel, Word

3.3 V

Grid Array, Fine Pitch

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF87IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

6200 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF97IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

6200 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF96IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF84IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

PDAC38RF82AAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

1

14

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.076 in (1.94 mm)

0.394 in (10 mm)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF90IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF90IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF93IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF89IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

8400 MHz

1

14

1.25 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

MAX5715AWC+T

Analog Devices

Digital to Analog converter

Automotive

Ball

12

FBGA

Rectangular

Plastic/Epoxy

Yes

4

BICMOS

12

1.5 mA

0.024 %

3/5 V

Grid Array, Fine Pitch

BGA12,3X4,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B12

1

No

e2

30 s

260 °C (500 °F)

Offset Binary

MAX5725AWP+T

Analog Devices

Digital to Analog converter

Automotive

Ball

20

FBGA

Rectangular

Plastic/Epoxy

Yes

8

BICMOS

12

2.5 mA

0.024 %

3/5 V

Grid Array, Fine Pitch

BGA20,4X5,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B20

1

No

e2

30 s

260 °C (500 °F)

Offset Binary

MAX5725AWP+

Analog Devices

Digital to Analog converter

Automotive

Ball

20

FBGA

Rectangular

Plastic/Epoxy

Yes

8

BICMOS

12

2.5 mA

0.024 %

3/5 V

Grid Array, Fine Pitch

BGA20,4X5,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B20

1

No

e2

30 s

260 °C (500 °F)

Offset Binary

MAX5815AWC+T

Analog Devices

Digital to Analog converter

Automotive

Ball

12

FBGA

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

12

1.4 mA

0.024 %

3/5 V

Grid Array, Fine Pitch

BGA12,3X4,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B12

1

No

e2

30 s

260 °C (500 °F)

Binary

MAX5825AWP+

Analog Devices

Digital to Analog converter

Automotive

Ball

20

FBGA

Rectangular

Plastic/Epoxy

Yes

8

BICMOS

12

2.5 mA

0.024 %

3/5 V

Grid Array, Fine Pitch

BGA20,4X5,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B20

1

No

e2

30 s

260 °C (500 °F)

Binary

MAX5715AWC+

Analog Devices

Digital to Analog converter

Automotive

Ball

12

FBGA

Rectangular

Plastic/Epoxy

Yes

4

BICMOS

12

1.5 mA

0.024 %

3/5 V

Grid Array, Fine Pitch

BGA12,3X4,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B12

1

No

e2

30 s

260 °C (500 °F)

Offset Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.