LBGA Digital-to-Analog Converters 30

Reset All
Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD5535BKBCZ

Analog Devices

Digital to Analog converter

Other

Ball

124

LBGA

Square

Plastic/Epoxy

224 V

Yes

1

CMOS

14

20 mA

Serial

5 V

Grid Array, Low Profile

BGA124,14X14,40

60 µs

0.039 in (1 mm)

85 °C (185 °F)

-10 °C (14 °F)

Tin Silver Copper

Bottom

S-PBGA-B124

3

0.067 in (1.7 mm)

0.591 in (15 mm)

e1

30 s

260 °C (500 °F)

1 V

0.591 in (15 mm)

Binary

DAC60096IZEB

Texas Instruments

Digital to Analog converter

Industrial

Ball

196

LBGA

Square

Plastic/Epoxy

10.5 V

Yes

15 kHz

1

12

65 µs

0.0244 %

Serial

12 V

-12 V

Grid Array, Low Profile

65 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

3

0.058 in (1.48 mm)

0.591 in (15 mm)

e1

30 s

260 °C (500 °F)

-10.5 V

0.591 in (15 mm)

2's Complement Binary

AD5535BKBC

Analog Devices

Digital to Analog converter

Other

Ball

124

LBGA

Square

Plastic/Epoxy

224 V

Yes

1

CMOS

14

20 mA

Serial

5 V

Grid Array, Low Profile

BGA124,14X14,40

60 µs

0.039 in (1 mm)

85 °C (185 °F)

-10 °C (14 °F)

Bottom

S-PBGA-B124

0.067 in (1.7 mm)

0.591 in (15 mm)

No

1 V

0.591 in (15 mm)

Binary

AD5516ABC-1

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

2.5 V

Yes

1

BICMOS

14

32 µs

0.0122 %

Serial

5 V

±4.75/±13.2,3/5,5 V

Grid Array, Low Profile

BGA74,11X11,40

Other Converters

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-2.5 V

0.472 in (12 mm)

Binary

AD5532ABCZ-3

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

14.5 V

Yes

1

14

0.39 %

Serial

10 V

Grid Array, Low Profile

22 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-14.5 V

0.472 in (12 mm)

Binary

AD5532ABC-1REEL

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

14.5 V

Yes

1

14

0.39 %

Serial

10 V

Grid Array, Low Profile

22 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-14.5 V

0.472 in (12 mm)

Binary

AD5517ABC-3

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

10 V

Yes

1

14

0.0488 %

Serial

5 V

Grid Array, Low Profile

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

-10 V

0.472 in (12 mm)

Binary

AD5532ABC-1

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

14.5 V

Yes

1

14

0.39 %

Serial

10 V

Grid Array, Low Profile

22 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-14.5 V

0.472 in (12 mm)

Binary

AD5535ABCZ

Analog Devices

Digital to Analog converter

Other

Ball

124

LBGA

Square

215 V

Yes

1

14

Serial

5 V

3/5,5 V

-5 V

Grid Array, Low Profile

BGA124,14X14,40

Other Converters

10 µs

0.039 in (1 mm)

85 °C (185 °F)

-10 °C (14 °F)

Tin Silver Copper

Bottom

S-XBGA-B124

3

0.067 in (1.7 mm)

0.591 in (15 mm)

No

e1

260 °C (500 °F)

2.5 V

0.591 in (15 mm)

Binary

MAX5879EXF+

Analog Devices

Digital to Analog converter

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

Yes

1

14

Parallel, Word

3.3 V

Grid Array, Low Profile

26 ns

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B256

0.067 in (1.7 mm)

0.669 in (17 mm)

0.669 in (17 mm)

Offset Binary

MAX5882EXF+D

Analog Devices

Digital to Analog converter

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

Yes

1

14

360 mA

Parallel, Word

3.3 V

Grid Array, Low Profile

BGA256,16X16,39

1 ns

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B256

0.067 in (1.7 mm)

0.669 in (17 mm)

0.669 in (17 mm)

Offset Binary

AD5516ABCZ-2

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

5 V

Yes

1

14

0.0122 %

Serial

5 V

Grid Array, Low Profile

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e1

260 °C (500 °F)

-5 V

0.472 in (12 mm)

Binary

AD5532ABCZ-1

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

14.5 V

Yes

1

14

0.39 %

Serial

10 V

Grid Array, Low Profile

22 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-14.5 V

0.472 in (12 mm)

Binary

AD5532ABC-3REEL

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

14.5 V

Yes

1

14

0.39 %

Serial

10 V

Grid Array, Low Profile

22 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-14.5 V

0.472 in (12 mm)

Binary

AD5532ABCZ-2

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

14.5 V

Yes

1

14

0.39 %

Serial

10 V

Grid Array, Low Profile

30 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-14.5 V

0.472 in (12 mm)

Binary

AD5516ABCZ-1

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

2.5 V

Yes

1

14

0.0122 %

Serial

5 V

Grid Array, Low Profile

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-2.5 V

0.472 in (12 mm)

Binary

AD5516ABC-3

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

10 V

Yes

1

BICMOS

14

32 µs

0.0122 %

Serial

5 V

±4.75/±13.2,3/5,5 V

Grid Array, Low Profile

BGA74,11X11,40

Other Converters

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-10 V

0.472 in (12 mm)

Binary

AD5532ABC-3

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

14.5 V

Yes

1

14

0.39 %

Serial

10 V

Grid Array, Low Profile

22 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-14.5 V

0.472 in (12 mm)

Binary

AD5532HSABC

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

2.5 V

Yes

1

BICMOS

14

10 µs

0.39 %

Serial

5 V

±4.75/±12,5,3/5 V

Grid Array, Low Profile

BGA74,11X11,40

Other Converters

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-2.5 V

0.472 in (12 mm)

Binary

AD5532BBC-1

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

13 V

Yes

1

14

0.39 %

Serial

5 V

Grid Array, Low Profile

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-13 V

0.472 in (12 mm)

Binary

AD5532ABC-5REEL

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

14.5 V

Yes

1

14

0.39 %

Serial

10 V

Grid Array, Low Profile

22 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-14.5 V

0.472 in (12 mm)

Binary

AD5532HSABCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

2.5 V

Yes

1

14

0.39 %

Serial

5 V

Grid Array, Low Profile

10 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-2.5 V

0.472 in (12 mm)

Binary

AD5532ABCZ-1REEL

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

14.5 V

Yes

1

14

0.39 %

Serial

10 V

Grid Array, Low Profile

22 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-14.5 V

0.472 in (12 mm)

Binary

AD5532ABC-2

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

14.5 V

Yes

1

14

0.39 %

Serial

10 V

Grid Array, Low Profile

30 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-14.5 V

0.472 in (12 mm)

Binary

AD5532BBCZ-1

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

13 V

Yes

1

14

0.39 %

Serial

5 V

Grid Array, Low Profile

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-13 V

0.472 in (12 mm)

Binary

AD5535ABC

Analog Devices

Digital to Analog converter

Other

Ball

124

LBGA

Square

215 V

Yes

1

14

Serial

5 V

3/5,5 V

-5 V

Grid Array, Low Profile

BGA124,14X14,40

Other Converters

10 µs

0.039 in (1 mm)

85 °C (185 °F)

-10 °C (14 °F)

Tin Lead

Bottom

S-XBGA-B124

3

0.067 in (1.7 mm)

0.591 in (15 mm)

No

e0

240 °C (464 °F)

2.5 V

0.591 in (15 mm)

Binary

AD5517ABC-2

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

5 V

Yes

1

14

0.0488 %

Serial

5 V

Grid Array, Low Profile

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

-5 V

0.472 in (12 mm)

Binary

AD5517ABC-1

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

2.5 V

Yes

1

14

0.0488 %

Serial

5 V

Grid Array, Low Profile

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

-2.5 V

0.472 in (12 mm)

Binary

AD5516ABC-2

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

14

32 µs

0.0122 %

Serial

5 V

±4.75/±13.2,3/5,5 V

Grid Array, Low Profile

BGA74,11X11,40

Other Converters

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-5 V

0.472 in (12 mm)

Binary

AD5516ABCZ-3

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

10 V

Yes

1

14

0.0122 %

Serial

5 V

Grid Array, Low Profile

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-10 V

0.472 in (12 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.