Rectangular Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

LTC1595CCN8#PBF

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

16

0.0061 %

Serial

5 V

In-Line

1 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T8

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

Binary, Offset Binary

LTC2000ACY-14#PBF

Analog Devices

Digital to Analog converter

Commercial

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

14

0.0122 %

Serial, Parallel, Word

1.86 V

Grid Array, Low Profile, Fine Pitch

2.2 ns

0.031 in (0.8 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B170

3

0.067 in (1.69 mm)

0.354 in (9 mm)

e1

-1 V

0.591 in (15 mm)

2's Complement Binary

LTC2000AIY-14#PBF

Analog Devices

Digital to Analog converter

Industrial

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

14

0.0122 %

Serial, Parallel, Word

1.86 V

Grid Array, Low Profile, Fine Pitch

2.2 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B170

3

0.067 in (1.69 mm)

0.354 in (9 mm)

e1

-1 V

0.591 in (15 mm)

2's Complement Binary

LTC2605CGN

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

16

0.0977 %

Serial

5 V

Small Outline, Shrink Pitch

10 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

1

0.068 in (1.727 mm)

0.154 in (3.9 mm)

No

e0

0 V

0.193 in (4.89 mm)

Binary

LTC2605CGN#TR

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

0.0977 %

Serial

5 V

Small Outline, Shrink Pitch

10 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e0

0 V

0.193 in (4.8895 mm)

Binary

LTC2605CGN-1#TR

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

0.0977 %

Serial

5 V

Small Outline, Shrink Pitch

10 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e0

0 V

0.193 in (4.8895 mm)

Binary

LTC8043ES8

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

500 μA

0.0122 %

Serial

5 V

Small Outline

250 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

20 s

235 °C (455 °F)

0.193 in (4.9 mm)

Binary, Offset Binary

MAX5154ACPE+

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

2

CMOS

12

650 μA

0.0122 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

16 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.755 in (19.175 mm)

Binary

MAX5154ACPE

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

2

CMOS

12

650 μA

0.0122 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

16 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

0.755 in (19.175 mm)

Binary

MAX517BCPA

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

5 V

No

1

BICMOS

8

3 mA

Serial

5 V

5 V

In-Line

DIP8,.3

Other Converters

6 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

0 V

0.369 in (9.375 mm)

Binary

MAX517BCPA+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

5 V

No

1

BICMOS

8

3 mA

Serial

5 V

5 V

In-Line

DIP8,.3

Other Converters

6 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.369 in (9.375 mm)

Binary

MAX5253AEAP

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

3 V

Yes

1

CMOS

12

980 μA

0.0122 %

Serial

3 V

3.3 V

Small Outline, Shrink Pitch

SSOP20,.3

Other Converters

16 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G20

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e0

0 V

0.283 in (7.2 mm)

Binary, Offset Binary

MAX5253AEAP+

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

3 V

Yes

1

CMOS

12

980 μA

0.0122 %

Serial

3 V

3.3 V

Small Outline, Shrink Pitch

SSOP20,.3

Other Converters

16 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G20

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.283 in (7.2 mm)

Binary, Offset Binary

MAX5253AEAP-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

3 V

Yes

1

CMOS

12

980 μA

0.0122 %

Serial

3 V

3.3 V

Small Outline, Shrink Pitch

SSOP20,.3

Other Converters

16 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G20

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e0

0 V

0.283 in (7.2 mm)

Binary, Offset Binary

MAX5253AEAP+T

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

3 V

Yes

1

CMOS

12

980 μA

0.0122 %

Serial

3 V

3.3 V

Small Outline, Shrink Pitch

SSOP20,.3

Other Converters

16 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G20

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

0 V

0.283 in (7.2 mm)

Binary, Offset Binary

MAX528CWG

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

24

SSOP

Rectangular

Plastic/Epoxy

2.25 V

Yes

8

BICMOS

8

2 µs

9 mA

0.3906 %

Serial

12 V

12,GND/-5 V

-5 V

Small Outline, Shrink Pitch

SOP24,.4

Other Converters

1 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G24

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e0

245 °C (473 °F)

0 V

0.323 in (8.2 mm)

Binary

MAX528CWG+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

24

SSOP

Rectangular

Plastic/Epoxy

2.25 V

Yes

8

BICMOS

8

2 µs

9 mA

0.3906 %

Serial

12 V

12,GND/-5 V

-5 V

Small Outline, Shrink Pitch

SOP24,.4

Other Converters

1 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G24

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.323 in (8.2 mm)

Binary

MAX539AEPA

Maxim Integrated

Digital to Analog converter

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

5.1 V

No

1

CMOS

12

300 μA

0.0122 %

Serial

5 V

5 V

0 V

In-Line

DIP8,.3

Other Converters

25 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

0 V

0.369 in (9.375 mm)

Binary

MAX539AEPA+

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

5.1 V

No

1

CMOS

12

300 μA

0.0122 %

Serial

5 V

5 V

0 V

In-Line

DIP8,.3

Other Converters

25 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.369 in (9.375 mm)

Binary

MAX5805BAUB+T

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

BICMOS

12

410 μA

0.0244 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

6.3 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MCP47FEB08-20E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

8

3 mA

0.1953125 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP20,.25

7.8 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G20

0.047 in (1.2 mm)

0.173 in (4.4 mm)

0.256 in (6.5 mm)

Binary

MCP47FEB12A1-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

5.46 V

Yes

1

TS 16949

10

700 μA

0.1464 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

.01 V

0.173 in (4.4 mm)

Binary

MCP47FEB12A2-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

5.46 V

Yes

1

TS 16949

10

700 μA

0.1464 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

.01 V

0.173 in (4.4 mm)

Binary

PCM1681PWPR

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

28

HTSSOP

Rectangular

Plastic/Epoxy

3.75 V

Yes

1

CMOS

24

80 mA

Serial

5 V

3.3,5 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-G28

3

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.382 in (9.7 mm)

2's Complement Binary

PCM1681TPWPQ1G4

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

28

HTSSOP

Rectangular

Plastic/Epoxy

3.75 V

Yes

1

CMOS

AEC-Q100

24

80 mA

Serial

5 V

3.3,5 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-G28

4

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.382 in (9.7 mm)

2's Complement Binary

PCM1792ADB

Texas Instruments

Digital to Analog converter

Commercial Extended

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

24

40 mA

Serial

5 V

3.3,5 V

Small Outline, Shrink Pitch

SSOP28,.3

Other Converters

0.026 in (0.65 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Nickel Palladium Gold

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e4

30 s

260 °C (500 °F)

0.402 in (10.2 mm)

2's Complement Binary

PCM1792ADBG4

Texas Instruments

Digital to Analog converter

Commercial Extended

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

24

40 mA

Serial

5 V

3.3,5 V

Small Outline, Shrink Pitch

SSOP28,.3

Other Converters

0.026 in (0.65 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Nickel Palladium Gold

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e4

30 s

260 °C (500 °F)

0.402 in (10.2 mm)

2's Complement Binary

PCM1792ADBRG4

Texas Instruments

Digital to Analog converter

Commercial Extended

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

24

40 mA

Serial

5 V

3.3,5 V

Small Outline, Shrink Pitch

SSOP28,.3

Other Converters

0.026 in (0.65 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Nickel Palladium Gold

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e4

30 s

260 °C (500 °F)

0.402 in (10.2 mm)

2's Complement Binary

PCM1795DB

Texas Instruments

Digital to Analog converter

Other

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

32

23 mA

Serial

5 V

3.3,5 V

Small Outline, Shrink Pitch

SSOP28,.3

Other Converters

0.026 in (0.65 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Nickel Palladium Gold

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e4

30 s

260 °C (500 °F)

0.402 in (10.2 mm)

2's Complement Binary

TC1320EOA

Microchip Technology

Digital to Analog converter

Industrial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

4.3 V

Yes

1

TS 16949

8

500 μA

0.7812 %

Serial

3.3 V

3/5 V

Small Outline

SOP8,.23

Other Converters

10 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

260 °C (500 °F)

0 V

0.193 in (4.9 mm)

Binary

TLV5637IDR

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

2.9 V

Yes

278 kHz

1

CMOS

10

5.5 µs

7 mA

0.0977 %

Serial

3 V

3/5 V

Small Outline

SOP8,.25

Other Converters

800 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.193 in (4.9 mm)

Binary

TLV5637IDRG4

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

2.9 V

Yes

1

CMOS

10

5.5 µs

7 mA

0.0977 %

Serial

3 V

3/5 V

Small Outline

SOP8,.25

Other Converters

2.8 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.193 in (4.9 mm)

Binary

5962-8770204RX

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

Parallel, Word

5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

e0

Binary

AD1866RZ-REEL

Analog Devices

Digital to Analog converter

Other

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

16

14 mA

Serial

5 V

5 V

Small Outline

SOP16,.4

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-35 °C (-31 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.299 in (7.6 mm)

No

e3

30 s

260 °C (500 °F)

-1 V

0.406 in (10.3 mm)

2's Complement Binary

AD390TD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

MIL-STD-883 Class B

12

8 µs

0.0122 %

Parallel, Word

15 V

-15 V

In-Line

4 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e4

-10 V

1.4 in (35.56 mm)

Binary

AD5317BRUZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.499 V

Yes

1

CMOS

10

9 µs

900 μA

0.2441 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

7 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

.001 V

0.197 in (5 mm)

Binary

AD5428YRUZ-REEL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

5 V

Yes

1

CMOS

8

30 ns

10 μA

0.0977 %

Parallel, 8 Bits

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP20,.25

Other Converters

30 ns

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G20

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

260 °C (500 °F)

.4 V

0.256 in (6.5 mm)

Binary

AD5546BRUZ

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

16

10 μA

0.0031 %

Parallel, Word

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

500 ns

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G28

3

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.382 in (9.7 mm)

Binary

AD565ASD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Bipolar

38535Q/M;38534H;883B

12

250 ns

18 mA

0.018 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP24,.6

Other Converters

250 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary

AD5660BRJ-2REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

LSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

10 µs

1 mA

0.0244 %

Serial

5 V

3/5 V

Small Outline, Low Profile, Shrink Pitch

TSSOP8,.1

Other Converters

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G8

1

0.057 in (1.45 mm)

0.063 in (1.6 mm)

No

e0

240 °C (464 °F)

0 V

0.114 in (2.9 mm)

Binary

AD5665RBRUZ-1

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

14

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

7 µs

1.16 mA

0.0244 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP14,.25

4 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G14

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

AD5685RBRUZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.005 V

Yes

1

CMOS

14

8 µs

1.3 mA

0.0061 %

Serial

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

5 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

AD5689BRUZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

16

8 µs

700 μA

0.0046 %

Serial

5 V

2/5,3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

5 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G16

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

0 V

0.197 in (5 mm)

Binary

AD5689RARUZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.005 V

Yes

1

16

8 µs

1.3 mA

0.0122 %

Serial

5 V

2/5,3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

5 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

AD5821BCBZ-REEL

Analog Devices

Digital to Analog converter

Industrial

Ball

9

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

4 mA

0.3906 %

Serial

3.6 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA9,3X3,20

Other Converters

250 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B9

1

0.026 in (0.65 mm)

0.06 in (1.515 mm)

No

e1

260 °C (500 °F)

.6 V

0.067 in (1.69 mm)

Binary

AD7545AUQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883 Class B

12

1 µs

2 mA

0.012 %

Parallel, Word

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.953 in (24.195 mm)

Binary, 2's Complement Binary

AD766SD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

3.12 V

No

1

BICMOS

MIL-STD-883 Class B

16

Serial

5 V

-5 V

In-Line

1.5 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-2.88 V

0.75 in (19.05 mm)

2's Complement Binary

AD8803ARZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

8

CMOS

8

4 mA

0.5859 %

Serial

3 V

3/5 V

Small Outline

SOP16,.25

Other Converters

600 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0.39 in (9.9 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.