Automotive Digital-to-Analog Converters 1,826

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

MAX5715AWC+T

Analog Devices

Digital to Analog converter

Automotive

Ball

12

FBGA

Rectangular

Plastic/Epoxy

Yes

4

BICMOS

12

1.5 mA

0.024 %

3/5 V

Grid Array, Fine Pitch

BGA12,3X4,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B12

1

No

e2

30 s

260 °C (500 °F)

Offset Binary

MAX5725AWP+T

Analog Devices

Digital to Analog converter

Automotive

Ball

20

FBGA

Rectangular

Plastic/Epoxy

Yes

8

BICMOS

12

2.5 mA

0.024 %

3/5 V

Grid Array, Fine Pitch

BGA20,4X5,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B20

1

No

e2

30 s

260 °C (500 °F)

Offset Binary

MAX5705BATB+

Analog Devices

Digital to Analog converter

Automotive

No Lead

10

HVSON

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

BICMOS

12

410 μA

0.0244 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.08,20

6.3 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-N10

1

0.031 in (0.8 mm)

0.079 in (2 mm)

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Offset Binary

MAX5714AUD+T

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

14

TSSOP

Rectangular

Plastic/Epoxy

Yes

4

BICMOS

10

1.5 mA

0.049 %

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP14,.25

Other Converters

0.025 in (0.635 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G14

1

No

e3

30 s

260 °C (500 °F)

Offset Binary

MAX5741AUB+T

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

BICMOS

10

10 µs

420 μA

0.3906 %

Serial

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

4 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MAX5815BAUD+T

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

14

TSSOP

Rectangular

Plastic/Epoxy

Yes

4

BICMOS

12

1.4 mA

0.024 %

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP14,.25

Other Converters

0.025 in (0.635 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G14

1

No

e3

30 s

260 °C (500 °F)

Binary

MAX5725AWP+

Analog Devices

Digital to Analog converter

Automotive

Ball

20

FBGA

Rectangular

Plastic/Epoxy

Yes

8

BICMOS

12

2.5 mA

0.024 %

3/5 V

Grid Array, Fine Pitch

BGA20,4X5,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B20

1

No

e2

30 s

260 °C (500 °F)

Offset Binary

MAX5815AWC+T

Analog Devices

Digital to Analog converter

Automotive

Ball

12

FBGA

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

12

1.4 mA

0.024 %

3/5 V

Grid Array, Fine Pitch

BGA12,3X4,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B12

1

No

e2

30 s

260 °C (500 °F)

Binary

MAX5741AUB+

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

BICMOS

10

10 µs

420 μA

0.3906 %

Serial

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

4 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MAX5802BATB+T

Analog Devices

Digital to Analog converter

Automotive

No Lead

10

SON

Rectangular

Plastic/Epoxy

Yes

2

BICMOS

12

900 μA

0.024 %

3/5 V

Small Outline

SOLCC10,.12,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-N10

1

No

e3

30 s

260 °C (500 °F)

Binary

MAX5705BATB+T

Analog Devices

Digital to Analog converter

Automotive

No Lead

10

SON

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

12

410 μA

0.024 %

3/5 V

Small Outline

SOLCC10,.08,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-N10

1

No

e4

30 s

260 °C (500 °F)

Offset Binary

MAX5711AUT+

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

6

LSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

BICMOS

10

10 µs

187 μA

0.3906 %

Serial

5 V

Small Outline, Low Profile, Shrink Pitch

TSOP6,.11,37

4 µs

0.037 in (0.95 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G6

1

0.057 in (1.45 mm)

0.064 in (1.625 mm)

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

MAX5712AUT+

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

6

LSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

BICMOS

12

0.3906 %

Serial

5 V

Small Outline, Low Profile, Shrink Pitch

4 µs

0.037 in (0.95 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G6

1

0.057 in (1.45 mm)

0.064 in (1.625 mm)

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

MAX5823AWP+

Analog Devices

Digital to Analog converter

Automotive

Ball

20

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

BICMOS

8

2.5 mA

0.09765 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA20,4X5,20

2.2 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B20

1

0.027 in (0.69 mm)

0.089 in (2.255 mm)

e2

30 s

260 °C (500 °F)

0 V

0.099 in (2.505 mm)

Binary

MAX5805BATB+

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

10

SON

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

BICMOS

12

410 μA

0.0244 %

Serial

3 V

Small Outline

SOLCC10,.08,20

6.3 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-N10

1

0.031 in (0.8 mm)

0.079 in (2 mm)

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MAX5825AWP+

Analog Devices

Digital to Analog converter

Automotive

Ball

20

FBGA

Rectangular

Plastic/Epoxy

Yes

8

BICMOS

12

2.5 mA

0.024 %

3/5 V

Grid Array, Fine Pitch

BGA20,4X5,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B20

1

No

e2

30 s

260 °C (500 °F)

Binary

MAX5705BAUB+

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

12

410 μA

0.024 %

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G10

1

No

e3

30 s

260 °C (500 °F)

Offset Binary

MAX5823AWP+T

Analog Devices

Digital to Analog converter

Automotive

Ball

20

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

BICMOS

8

2.5 mA

0.09765 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA20,4X5,20

2.2 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B20

1

0.027 in (0.69 mm)

0.089 in (2.255 mm)

e2

30 s

260 °C (500 °F)

0 V

0.099 in (2.505 mm)

Binary

MAX5702BAUB+T

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Rectangular

Plastic/Epoxy

Yes

2

BICMOS

12

900 μA

0.024 %

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G10

1

No

e3

30 s

260 °C (500 °F)

Offset Binary

MAX5112GTJ+

Analog Devices

Digital to Analog converter

Automotive

No Lead

32

HVQCCN

Square

2.3 V

Yes

1

14

600 μA

0.0488 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

15 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

MAX5742AUB+T

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

BICMOS

12

0.3906 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

4 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MAX5715AWC+

Analog Devices

Digital to Analog converter

Automotive

Ball

12

FBGA

Rectangular

Plastic/Epoxy

Yes

4

BICMOS

12

1.5 mA

0.024 %

3/5 V

Grid Array, Fine Pitch

BGA12,3X4,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B12

1

No

e2

30 s

260 °C (500 °F)

Offset Binary

MAX5816ATB+

Analog Devices

Digital to Analog converter

Automotive

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

4

BICMOS

12

1.4 mA

0.0244 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

4.5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5453YUJ-REEL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

8

VSSOP

Square

Plastic/Epoxy

Yes

1

CMOS

14

110 ns

10 μA

0.0122 %

Serial

3.5 V

3/5 V

Small Outline, Very Thin Profile, Shrink Pitch

TSSOP8,.1

Other Converters

16 ns

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.039 in (1 mm)

0.063 in (1.6 mm)

No

e0

240 °C (464 °F)

0.114 in (2.9 mm)

Binary

LTC2634HUD-HZ10#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

4.096 V

Yes

1

CMOS

10

0.0977 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.2 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2630HSC6-HM8#PBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

6

VSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

8

0.1953 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

3.7 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G6

1

0.039 in (1 mm)

0.049 in (1.25 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

LTC2631HTS8-LM12#TRMPBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

0.061 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

4.1 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

LTC2631AHTS8-HM10#TRMPBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

10

0.0977 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

4.2 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

0 V

0.114 in (2.9 mm)

Binary

AD5440YRUZ-REEL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

24

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

120 ns

10 μA

0.0244 %

Parallel, Word

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP24,.25

Other Converters

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G24

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0.307 in (7.8 mm)

Binary

LTC2632AHTS8-HZ12#TRPBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

700 μA

0.036 %

Parallel, Word

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.1

4.9 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

LTC2636HMS-LMX8#PBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

8

0.1953 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

3.4 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.159 in (4.039 mm)

Binary

LTC2634HUD-HMI10#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

4.096 V

Yes

1

CMOS

10

0.0977 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.2 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2635HUD-LMO10#PBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

0.0977 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.1 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2637HMS-HZ10#TRPBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

8

CMOS

10

0.0977 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

4.3 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.159 in (4.039 mm)

Binary

AD5439YRUZ-REEL

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

10

120 ns

10 μA

0.0488 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

80 ns

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

AD7398BRU-REEL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5 V

Yes

1

CMOS

12

2.7 mA

0.0366 %

Serial

5 V

3/5/±5 V

-5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e0

240 °C (464 °F)

0 V

0.197 in (5 mm)

Binary

LTC2630HSC6-HZ12#TRMPBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

6

VSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

12

0.0488 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

4.8 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G6

1

0.039 in (1 mm)

0.049 in (1.25 mm)

No

e3

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

LTC2637HDE-LMX8#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

8

0.1953 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

3.5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2635HUD-HMI12#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

4.096 V

Yes

1

CMOS

12

0.061 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2633HTS8-LO12#TRPBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.061 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

4.5 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

LTC2635HUD-LZ10#PBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

0.0977 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.1 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5424YRUZ

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5 V

Yes

1

CMOS

8

60 ns

5 μA

0.0977 %

Parallel, 8 Bits

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

30 ns

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

.4 V

0.197 in (5 mm)

Binary

LTC2634HUD-LMI10#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

10

0.0977 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

3.8 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2635HUD-LMO12#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

0.061 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.4 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5611AKS

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

6

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

0.0488 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

8 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G6

0.043 in (1.1 mm)

0.049 in (1.25 mm)

No

e0

0 V

0.079 in (2 mm)

Binary

LTC2631HTS8-LM10#TRPBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

10

0.0977 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

3.8 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

AD5662ARJ-1REEL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

8

LSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

10 µs

250 μA

0.0488 %

Serial

3 V

3/5 V

Small Outline, Low Profile, Shrink Pitch

TSSOP8,.1

Other Converters

8 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G8

1

0.057 in (1.45 mm)

0.063 in (1.6 mm)

No

e0

240 °C (464 °F)

0 V

0.114 in (2.9 mm)

Binary

AD5060BRJ-2500RL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

8

LSSOP

Rectangular

Plastic/Epoxy

4.046 V

Yes

1

CMOS

16

0.0015 %

Serial

5 V

5 V

Small Outline, Low Profile, Shrink Pitch

TSSOP8,.1

Other Converters

10 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G8

0.057 in (1.45 mm)

0.063 in (1.6 mm)

No

e0

0 V

0.114 in (2.9 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.