Industrial Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

DAC101S101CIMM/NOPB

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1.8 MHz

1

CMOS

10

7.5 µs

332 μA

0.2734 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC101S101CIMMX

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

7.5 µs

332 μA

0.2734 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

5 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.09 mm)

0.118 in (3 mm)

No

e0

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC101S101CIMMX/NOPB

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

7.5 µs

332 μA

0.2734 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

5 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC8831ICRGYTG4

Texas Instruments

Digital to Analog converter

Industrial

No Lead

14

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

Bipolar

16

20 μA

0.0015 %

Serial

3 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC14/18,.14SQ,20

Other Converters

1 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N14

2

0.039 in (1 mm)

0.138 in (3.5 mm)

No

e4

30 s

260 °C (500 °F)

-2.5 V

0.138 in (3.5 mm)

Binary

LTC1448IS8#TRPBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

2

12

700 μA

0.1343 %

Serial

3 V

Small Outline

14 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.9 mm)

Binary

LTC2611IDD

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

14

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

9 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

0 V

0.118 in (3 mm)

Binary

LTC2611IDD#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

14

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

9 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2611IDD-1#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

14

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

9 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2611IDD-1#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

14

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

9 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MAX5134AGTG+T

Analog Devices

Digital to Analog converter

Industrial

No Lead

24

QCCN

Square

Plastic/Epoxy

Yes

4

BICMOS

16

3.6 mA

0.015 %

3/5 V

Chip Carrier

LCC24,.16SQ,20

Other Converters

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N24

1

No

e3

30 s

260 °C (500 °F)

Binary

MAX5135GTG+T

Analog Devices

Digital to Analog converter

Industrial

No Lead

24

QCCN

Square

Plastic/Epoxy

Yes

4

BICMOS

12

3.6 mA

0.024 %

3/5 V

Chip Carrier

LCC24,.16SQ,20

Other Converters

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N24

1

No

e3

30 s

260 °C (500 °F)

Binary

MAX525AEPP

Maxim Integrated

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

5 V

No

1

CMOS

12

980 μA

0.0122 %

Serial

5 V

5 V

In-Line

DIP20,.3

Other Converters

12 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

0 V

1.03 in (26.16 mm)

Binary, Offset Binary

MAX525AEPP+

Maxim Integrated

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

5 V

No

1

CMOS

12

980 μA

0.0122 %

Serial

5 V

5 V

In-Line

DIP20,.3

Other Converters

12 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

1.03 in (26.16 mm)

Binary, Offset Binary

TLV5619IPWR

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

2.9 V

Yes

1 MHz

1

CMOS

12

3 µs

3 mA

0.0977 %

Parallel, Word

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP20,.25

Other Converters

1 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-G20

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.256 in (6.5 mm)

Binary

AD421BNZ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

16

0.01 %

Serial

3 V

In-Line

8 ms

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T16

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

0.793 in (20.13 mm)

Binary

AD5313RBCPZ-RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

5.005 V

Yes

1

CMOS

10

7 µs

1.3 mA

0.0488 %

Serial

3 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

Other Converters

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N16

3

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5337ARM-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

8

8 µs

375 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

6 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

240 °C (464 °F)

.001 V

0.118 in (3 mm)

Binary

AD5378ABCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

108

BGA

Square

Plastic/Epoxy

5 V

Yes

1

Bipolar

14

30 µs

0.0183 %

Serial, Parallel, Word

5 V

3/5,±12/±15 V

Grid Array

BGA108,12X12,40

Other Converters

20 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B108

3

0.073 in (1.85 mm)

0.512 in (13 mm)

No

e1

30 s

260 °C (500 °F)

-3.5 V

0.512 in (13 mm)

Binary

AD5640BRJZ-1500RL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

LSSOP

Rectangular

Plastic/Epoxy

3.3 V

Yes

1

CMOS

14

10 µs

650 μA

0.0244 %

Serial

3 V

3 V

Small Outline, Low Profile, Shrink Pitch

TSSOP8,.1

Other Converters

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.057 in (1.45 mm)

0.063 in (1.6 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

AD5667RBRMZ-2REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

7 µs

0.0183 %

Serial

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

4 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5693RBRMZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.005 V

Yes

1

16

0.0046 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5694BCPZ-RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

5.5 V

Yes

1

CMOS

12

7 µs

700 μA

0.0244 %

Serial

5 V

2/5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

Other Converters

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N16

3

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5765CSUZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

32

TQFP

Square

Plastic/Epoxy

4.3 V

Yes

4

CMOS

16

10 µs

2.25 mA

0.0015 %

Serial

5 V

±5,3/5 V

-5 V

Flatpack, Thin Profile

TQFP32,.35SQ,32

Other Converters

8 µs

0.031 in (0.8 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G32

3

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

-4.3 V

0.276 in (7 mm)

Offset Binary, 2's Complement Binary

AD7547KPZ

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

CMOS

12

2 µs

0.0122 %

Parallel, Word

12 V

Chip Carrier

800 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J28

3

0.18 in (4.57 mm)

0.453 in (11.506 mm)

No

e3

260 °C (500 °F)

0.453 in (11.506 mm)

Binary

AD7564AR-B

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

4

BICMOS

12

10 μA

0.0244 %

Serial

5 V

3.3/5 V

Small Outline

SOP28,.4

Other Converters

3.5 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

0.705 in (17.9 mm)

Binary

AD7564BRS-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

Yes

4

BICMOS

12

10 μA

0.0122 %

Serial

5 V

5 V

Small Outline, Shrink Pitch

SSOP28,.3

Other Converters

550 ns

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

240 °C (464 °F)

0.402 in (10.2 mm)

Binary

AD7801BRUZ-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

2 µs

2.5 mA

0.3906 %

Parallel, 8 Bits

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP20,.25

Other Converters

1.2 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G20

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.256 in (6.5 mm)

Binary

AD7847BRZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

2

BICMOS

12

10 mA

0.0122 %

Parallel, Word

15 V

±15 V

-15 V

Small Outline

SOP24,.4

Other Converters

3 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G24

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

260 °C (500 °F)

-10 V

0.606 in (15.4 mm)

Binary, Offset Binary

DAC38J84IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

2500 MHz

1

CMOS

16

Parallel, Word

.9 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38J84IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

2500 MHz

1

CMOS

16

Parallel, Word

.9 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC8420ES

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

4

BICMOS

12

0.0732 %

Serial

5 V

±5/±15 V

-5 V

Small Outline

SOP16,.4

Other Converters

8 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G16

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

-2.5 V

0.406 in (10.3 mm)

Binary

DAC8420FS-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

4

BICMOS

12

0.0977 %

Serial

5 V

±5/±15 V

-5 V

Small Outline

SOP16,.4

Other Converters

8 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Dual

R-PDSO-G16

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

30 s

240 °C (464 °F)

-2.5 V

0.406 in (10.3 mm)

Binary

DAC8512FS-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

4.095 V

Yes

1

CMOS

12

0.0488 %

Serial

5 V

Small Outline

16 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

0 V

0.193 in (4.9 mm)

Complementary Offset Binary

DAC8534IPWG4

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

93 kHz

1

16

10 µs

1.6 mA

0.0987 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

10 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

DAC904UG4

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1.25 V

Yes

1

CMOS

14

30 mA

0.0153 %

Parallel, Word

5 V

5 V

Small Outline

SOP28,.4

Other Converters

30 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-G28

2

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e4

30 s

260 °C (500 °F)

-1 V

0.705 in (17.9 mm)

Binary

DAC9881SRGET

Texas Instruments

Digital to Analog converter

Industrial

No Lead

24

HVQCCN

Square

Plastic/Epoxy

5.5 V

Yes

200 kHz

1

18

5 µs

1.5 mA

0.0011 %

Serial

5 V

2.7/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC24,.16SQ,20

Other Converters

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N24

2

0.039 in (1 mm)

0.157 in (4 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary, 2's Complement Binary

LTC1448IS8

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

2

12

0.1343 %

Serial

3 V

Small Outline

14 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G8

1

0.069 in (1.752 mm)

0.154 in (3.899 mm)

No

e0

0 V

0.193 in (4.9025 mm)

Binary

LTC2000AIY-14#PBF

Analog Devices

Digital to Analog converter

Industrial

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

14

0.0122 %

Serial, Parallel, Word

1.86 V

Grid Array, Low Profile, Fine Pitch

2.2 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B170

3

0.067 in (1.69 mm)

0.354 in (9 mm)

e1

-1 V

0.591 in (15 mm)

2's Complement Binary

LTC2642AIMS-16#TRPBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

2.5 V

Yes

1

16

0.0015 %

Serial

3 V

Small Outline

1 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

-2.5 V

0.118 in (3 mm)

Offset Binary

LTC8043ES8

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

500 μA

0.0122 %

Serial

5 V

Small Outline

250 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

20 s

235 °C (455 °F)

0.193 in (4.9 mm)

Binary, Offset Binary

MAX5253AEAP

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

3 V

Yes

1

CMOS

12

980 μA

0.0122 %

Serial

3 V

3.3 V

Small Outline, Shrink Pitch

SSOP20,.3

Other Converters

16 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G20

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e0

0 V

0.283 in (7.2 mm)

Binary, Offset Binary

MAX5253AEAP+

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

3 V

Yes

1

CMOS

12

980 μA

0.0122 %

Serial

3 V

3.3 V

Small Outline, Shrink Pitch

SSOP20,.3

Other Converters

16 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G20

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.283 in (7.2 mm)

Binary, Offset Binary

MAX5253AEAP-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

3 V

Yes

1

CMOS

12

980 μA

0.0122 %

Serial

3 V

3.3 V

Small Outline, Shrink Pitch

SSOP20,.3

Other Converters

16 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G20

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e0

0 V

0.283 in (7.2 mm)

Binary, Offset Binary

MAX5253AEAP+T

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

3 V

Yes

1

CMOS

12

980 μA

0.0122 %

Serial

3 V

3.3 V

Small Outline, Shrink Pitch

SSOP20,.3

Other Converters

16 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G20

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

0 V

0.283 in (7.2 mm)

Binary, Offset Binary

MAX539AEPA

Maxim Integrated

Digital to Analog converter

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

5.1 V

No

1

CMOS

12

300 μA

0.0122 %

Serial

5 V

5 V

0 V

In-Line

DIP8,.3

Other Converters

25 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

0 V

0.369 in (9.375 mm)

Binary

MAX539AEPA+

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

5.1 V

No

1

CMOS

12

300 μA

0.0122 %

Serial

5 V

5 V

0 V

In-Line

DIP8,.3

Other Converters

25 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.369 in (9.375 mm)

Binary

PCM1681PWPR

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

28

HTSSOP

Rectangular

Plastic/Epoxy

3.75 V

Yes

1

CMOS

24

80 mA

Serial

5 V

3.3,5 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-G28

3

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.382 in (9.7 mm)

2's Complement Binary

PCM1681TPWPQ1G4

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

28

HTSSOP

Rectangular

Plastic/Epoxy

3.75 V

Yes

1

CMOS

AEC-Q100

24

80 mA

Serial

5 V

3.3,5 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-G28

4

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.382 in (9.7 mm)

2's Complement Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.