Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Maximum Analog Output Voltage | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | No. of Bits | Maximum Settling Time | Maximum Supply Current | Maximum Linearity Error (EL) | Input Format | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Nominal Settling Time (tstl) | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Minimum Analog Output Voltage | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Dymec |
Digital to Analog converter |
Commercial |
Pin/Peg |
26 |
Square |
10 V |
No |
1 |
14 |
15 V |
-15 V |
Microelectronic Assembly |
500 ns |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
S-XDMA-P26 |
0.4 in (10.16 mm) |
2 in (50.8 mm) |
-10 V |
2 in (50.8 mm) |
Complementary Offset Binary |
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Texas Instruments |
Digital to Analog converter |
Commercial |
Pin/Peg |
84 |
PGA |
Square |
Ceramic |
No |
3 |
CMOS |
4 |
12 ns |
295 mA |
0.78 % |
5 V |
5 V |
Grid Array |
PGA84,12X12 |
Other Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Perpendicular |
S-XPGA-P84 |
No |
Binary |
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Texas Instruments |
Digital to Analog converter |
Commercial |
Pin/Peg |
84 |
PGA |
Square |
Ceramic |
No |
3 |
CMOS |
4 |
12 ns |
295 mA |
0.78 % |
5 V |
5 V |
Grid Array |
PGA84,12X12 |
Other Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Perpendicular |
S-XPGA-P84 |
No |
Binary |
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Texas Instruments |
Digital to Analog converter |
Commercial |
Pin/Peg |
84 |
PGA |
Square |
Ceramic |
No |
3 |
CMOS |
8 |
8 ns |
420 mA |
0.39 % |
5 V |
5 V |
Grid Array |
PGA84,12X12 |
Other Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Perpendicular |
S-XPGA-P84 |
No |
Binary |
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Texas Instruments |
Digital to Analog converter |
Commercial |
Pin/Peg |
84 |
PGA |
Square |
Ceramic |
No |
3 |
CMOS |
8 |
12 ns |
420 mA |
0.39 % |
5 V |
5 V |
Grid Array |
PGA84,12X12 |
Other Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Perpendicular |
S-XPGA-P84 |
No |
Binary |
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Texas Instruments |
Digital to Analog converter |
Commercial |
Pin/Peg |
84 |
PGA |
Square |
Ceramic |
No |
3 |
CMOS |
8 |
12 ns |
400 mA |
0.39 % |
5 V |
5 V |
Grid Array |
PGA84,12X12 |
Other Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Perpendicular |
S-XPGA-P84 |
No |
Binary |
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Texas Instruments |
Digital to Analog converter |
Commercial |
Pin/Peg |
84 |
PGA |
Square |
Ceramic |
No |
3 |
CMOS |
4 |
8 ns |
330 mA |
0.78 % |
5 V |
5 V |
Grid Array |
PGA84,12X12 |
Other Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Perpendicular |
S-XPGA-P84 |
No |
Binary |
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Texas Instruments |
Digital to Analog converter |
Commercial |
Pin/Peg |
84 |
PGA |
Square |
Ceramic |
No |
3 |
CMOS |
8 |
12 ns |
400 mA |
0.39 % |
5 V |
5 V |
Grid Array |
PGA84,12X12 |
Other Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Perpendicular |
S-XPGA-P84 |
No |
Binary |
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Texas Instruments |
Digital to Analog converter |
Commercial |
Pin/Peg |
84 |
PGA |
Square |
Ceramic |
No |
3 |
CMOS |
4 |
9 ns |
330 mA |
0.78 % |
5 V |
5 V |
Grid Array |
PGA84,12X12 |
Other Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Perpendicular |
S-XPGA-P84 |
No |
Binary |
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Texas Instruments |
Digital to Analog converter |
Commercial |
Pin/Peg |
84 |
PGA |
Square |
Ceramic |
No |
3 |
CMOS |
4 |
8 ns |
340 mA |
0.78 % |
5 V |
5 V |
Grid Array |
PGA84,12X12 |
Other Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Perpendicular |
S-XPGA-P84 |
No |
Binary |
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Texas Instruments |
Digital to Analog converter |
Commercial |
Pin/Peg |
84 |
PGA |
Square |
Ceramic |
No |
3 |
CMOS |
8 |
12 ns |
435 mA |
0.39 % |
5 V |
5 V |
Grid Array |
PGA84,12X12 |
Other Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Perpendicular |
S-XPGA-P84 |
No |
Binary |
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Texas Instruments |
Digital to Analog converter |
Commercial |
Pin/Peg |
84 |
PGA |
Square |
Ceramic |
No |
3 |
CMOS |
4 |
8 ns |
340 mA |
0.78 % |
5 V |
5 V |
Grid Array |
PGA84,12X12 |
Other Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Perpendicular |
S-XPGA-P84 |
No |
Binary |
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Texas Instruments |
Digital to Analog converter |
Commercial |
Pin/Peg |
84 |
PGA |
Square |
Ceramic |
No |
3 |
CMOS |
8 |
8 ns |
435 mA |
0.39 % |
5 V |
5 V |
Grid Array |
PGA84,12X12 |
Other Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Perpendicular |
S-XPGA-P84 |
No |
Binary |
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Analog Devices |
Digital to Analog converter |
Pin/Peg |
72 |
Rectangular |
Plastic/Epoxy |
No |
12 |
Microelectronic Assembly |
Gold |
Dual |
R-PDMA-P72 |
No |
e4 |
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Analog Devices |
Digital to Analog converter |
Industrial |
Pin/Peg |
44 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
1 |
CMOS |
16 |
3 mA |
0.0015 % |
Serial, Parallel, Word |
5 V |
5 V |
Grid Array |
PGA44,8X8 |
Other Converters |
6 µs |
0.1 in (2.54 mm) |
100 °C (212 °F) |
-40 °C (-40 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P44 |
0.25 in (6.35 mm) |
0.8 in (20.32 mm) |
No |
e0 |
-10 V |
0.8 in (20.32 mm) |
Binary, Offset Binary, 2's Complement Binary |
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Analog Devices |
Digital to Analog converter |
Military |
Pin/Peg |
24 |
QIP |
Rectangular |
Ceramic, Glass-Sealed |
10 V |
No |
1 |
Bipolar |
12 |
0.0244 % |
Parallel, Word |
15 V |
-15 V |
In-Line |
400 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-GDIP-P24 |
0.6 in (15.24 mm) |
No |
-10 V |
1.2 in (30.48 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Military |
Pin/Peg |
24 |
QIP |
Rectangular |
Ceramic, Glass-Sealed |
10 V |
No |
1 |
Bipolar |
12 |
400 ns |
0.0244 % |
Parallel, Word |
-15 V |
-15 V |
In-Line |
DIP24,.6 |
Other Converters |
200 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-P24 |
0.6 in (15.24 mm) |
No |
e0 |
-1.5 V |
1.2 in (30.48 mm) |
Binary, Offset Binary, 2's Complement Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Pin/Peg |
24 |
DIP |
Rectangular |
Metal |
10 V |
No |
1 |
Bipolar |
16 |
10 µs |
55 mA |
0.003 % |
Parallel, Word |
15 V |
5,±15 V |
-15 V |
Microelectronic Assembly |
DIP24,.6 |
Other Converters |
5 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-MDMA-P24 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
0 V |
Complementary Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Pin/Peg |
24 |
DIP |
Rectangular |
Metal |
0 V |
No |
1 |
ECL |
8 |
10 ns |
360 mA |
Parallel, 8 Bits |
-5.2 V |
-5.2 V |
In-Line |
DIP24,.6 |
Other Converters |
8 ns |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-MDIP-P24 |
0.6 in (15.24 mm) |
No |
e0 |
-.6375 V |
1.272 in (32.3205 mm) |
Complementary Binary |
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Analog Devices |
Digital to Analog converter |
Commercial |
Pin/Peg |
28 |
Rectangular |
10 V |
No |
1 |
12 |
Parallel, Word |
15 V |
-15 V |
Microelectronic Assembly |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
R-XDMA-P28 |
No |
-10 V |
Complementary Offset Binary |
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Analog Devices |
Digital to Analog converter |
Military |
Pin/Peg |
18 |
DIP |
Rectangular |
Metal |
No |
1 |
Bipolar |
38535Q/M;38534H;883B |
12 |
3 µs |
1 mA |
0.012 % |
Parallel, Word |
5 V |
5 V |
In-Line |
DIP18,.3 |
Other Converters |
3 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-MDIP-P18 |
0.234 in (5.9436 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary, Offset Binary |
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Analog Devices |
Digital to Analog converter |
Military |
Pin/Peg |
24 |
Rectangular |
Metal |
.512 V |
No |
1 |
10 |
Parallel, Word |
Microelectronic Assembly |
25 ns |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-MDMA-P24 |
No |
e0 |
-.512 V |
Binary, Offset Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Pin/Peg |
24 |
DIP |
Rectangular |
Metal |
10 V |
No |
1 |
Bipolar |
16 |
10 µs |
55 mA |
0.003 % |
Parallel, Word |
15 V |
5,±15 V |
-15 V |
Microelectronic Assembly |
DIP24,.6 |
Other Converters |
5 µs |
0.1 in (2.54 mm) |
100 °C (212 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-MDMA-P24 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
0 V |
Complementary Binary |
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Analog Devices |
Digital to Analog converter |
Commercial |
Pin/Peg |
24 |
QIP |
Rectangular |
Ceramic, Glass-Sealed |
10 V |
No |
1 |
Bipolar |
12 |
400 ns |
0.0732 % |
Parallel, Word |
-15 V |
-15 V |
In-Line |
DIP24,.6 |
Other Converters |
200 ns |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin/Lead |
Dual |
R-GDIP-P24 |
0.6 in (15.24 mm) |
No |
e0 |
-1.5 V |
1.2 in (30.48 mm) |
Binary, Offset Binary, 2's Complement Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Pin/Peg |
24 |
DIP |
Rectangular |
Metal |
10 V |
No |
1 |
Bipolar |
16 |
3 µs |
55 mA |
0.003 % |
Parallel, Word |
15 V |
5,±15 V |
-15 V |
Microelectronic Assembly |
DIP24,.6 |
Other Converters |
3 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-MDMA-P24 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
0 V |
Complementary Binary |
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Analog Devices |
Digital to Analog converter |
Commercial |
Pin/Peg |
17 |
Rectangular |
1.2 V |
No |
1 |
12 |
0.0244 % |
Parallel, Word |
15 V |
-15 V |
Microelectronic Assembly |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
R-XDMA-P17 |
No |
-1.2 V |
Binary, Offset Binary |
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Analog Devices |
Digital to Analog converter |
Commercial |
Pin/Peg |
72 |
Rectangular |
10 V |
No |
1 |
16 |
0.003 % |
15 V |
-15 V |
Microelectronic Assembly |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
R-XDMA-P72 |
0.409 in (10.4 mm) |
2.012 in (51.1 mm) |
-10 V |
4.02 in (102.1 mm) |
Complementary Offset Binary |
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Analog Devices |
Digital to Analog converter |
Industrial |
Pin/Peg |
44 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
1 |
CMOS |
16 |
3 mA |
0.0015 % |
Serial, Parallel, Word |
5 V |
5 V |
Grid Array |
PGA44,8X8 |
Other Converters |
6 µs |
0.1 in (2.54 mm) |
100 °C (212 °F) |
-40 °C (-40 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P44 |
0.25 in (6.35 mm) |
0.8 in (20.32 mm) |
No |
e0 |
-10 V |
0.8 in (20.32 mm) |
Binary, Offset Binary, 2's Complement Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Pin/Peg |
24 |
DIP |
Rectangular |
Metal |
10 V |
No |
1 |
Bipolar |
16 |
3 µs |
55 mA |
0.003 % |
Parallel, Word |
15 V |
5,±15 V |
-15 V |
Microelectronic Assembly |
DIP24,.6 |
Other Converters |
3 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-MDMA-P24 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
0 V |
Complementary Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Pin/Peg |
24 |
DIP |
Rectangular |
Metal |
10 V |
No |
1 |
Bipolar |
16 |
3 µs |
55 mA |
0.003 % |
Parallel, Word |
15 V |
5,±15 V |
-15 V |
Microelectronic Assembly |
DIP24,.6 |
Other Converters |
3 µs |
0.1 in (2.54 mm) |
100 °C (212 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-MDMA-P24 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
0 V |
Complementary Binary |
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Analog Devices |
Digital to Analog converter |
Military |
Pin/Peg |
24 |
DIP |
Rectangular |
No |
1 |
Hybrid |
MIL-PRF-38534 Class H |
12 |
0.0366 % |
Parallel, Word |
15 V |
-15 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-XDIP-P24 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.272 in (32.32 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Pin/Peg |
24 |
DIP |
Rectangular |
Metal |
10 V |
No |
1 |
Bipolar |
16 |
3 µs |
55 mA |
0.003 % |
Parallel, Word |
15 V |
5,±15 V |
-15 V |
Microelectronic Assembly |
DIP24,.6 |
Other Converters |
3 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-MDMA-P24 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
-10 V |
Complementary Offset Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Pin/Peg |
24 |
DIP |
Rectangular |
Metal |
10 V |
No |
1 |
Hybrid |
16 |
10 µs |
55 mA |
0.003 % |
Parallel, Word |
15 V |
5,±15 V |
-15 V |
Microelectronic Assembly |
DIP24,.6 |
Other Converters |
5 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-MDMA-P24 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
-10 V |
Complementary Offset Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Pin/Peg |
24 |
DIP |
Rectangular |
Metal |
10 V |
No |
1 |
Bipolar |
16 |
3 µs |
55 mA |
0.003 % |
Parallel, Word |
15 V |
5,±15 V |
-15 V |
Microelectronic Assembly |
DIP24,.6 |
Other Converters |
3 µs |
0.1 in (2.54 mm) |
100 °C (212 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-MDMA-P24 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
-10 V |
Complementary Offset Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Pin/Peg |
24 |
DIP |
Rectangular |
Metal |
10 V |
No |
1 |
Bipolar |
16 |
3 µs |
55 mA |
0.003 % |
Parallel, Word |
15 V |
5,±15 V |
-15 V |
Microelectronic Assembly |
DIP24,.6 |
Other Converters |
3 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-MDMA-P24 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
-10 V |
Complementary Offset Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Pin/Peg |
24 |
DIP |
Rectangular |
Metal |
10 V |
No |
1 |
Hybrid |
16 |
10 µs |
55 mA |
0.003 % |
Parallel, Word |
15 V |
5,±15 V |
-15 V |
Microelectronic Assembly |
DIP24,.6 |
Other Converters |
5 µs |
0.1 in (2.54 mm) |
100 °C (212 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-MDMA-P24 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
-10 V |
Complementary Offset Binary |
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Analog Devices |
Digital to Analog converter |
Commercial |
Pin/Peg |
72 |
Rectangular |
10 V |
No |
1 |
18 |
0.0004 % |
Parallel, Word |
15 V |
-15 V |
Microelectronic Assembly |
140 µs |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-XDMA-P72 |
No |
e0 |
-10 V |
Complementary Binary, Complementary Offset Binary |
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Analog Devices |
Digital to Analog converter |
Military |
Pin/Peg |
24 |
QIP |
Rectangular |
Ceramic, Glass-Sealed |
10 V |
No |
1 |
Bipolar |
MIL-STD-883 Class B |
12 |
0.0732 % |
Parallel, Word |
-15 V |
In-Line |
200 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-GDIP-P24 |
0.6 in (15.24 mm) |
No |
-1.5 V |
1.2 in (30.48 mm) |
Binary, Offset Binary, 2's Complement Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Pin/Peg |
24 |
DIP |
Rectangular |
Metal |
10 V |
No |
1 |
Bipolar |
16 |
3 µs |
55 mA |
0.003 % |
Parallel, Word |
15 V |
5,±15 V |
-15 V |
Microelectronic Assembly |
DIP24,.6 |
Other Converters |
3 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-MDMA-P24 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
0 V |
Complementary Binary |
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Analog Devices |
Digital to Analog converter |
Military |
Pin/Peg |
24 |
DIP |
Rectangular |
No |
1 |
Hybrid |
MIL-PRF-38534 Class H |
12 |
35 ns |
54 mA |
0.0366 % |
Parallel, Word |
15 V |
±15 V |
-15 V |
In-Line |
DIP24,.6 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-P24 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
1.272 in (32.32 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Commercial |
Pin/Peg |
24 |
QIP |
Rectangular |
Ceramic, Glass-Sealed |
10 V |
No |
1 |
Bipolar |
12 |
400 ns |
0.0244 % |
Parallel, Word |
-15 V |
-15 V |
In-Line |
DIP24,.6 |
Other Converters |
200 ns |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin/Lead |
Dual |
R-GDIP-P24 |
0.6 in (15.24 mm) |
No |
e0 |
-1.5 V |
1.2 in (30.48 mm) |
Binary, Offset Binary, 2's Complement Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
Pin/Peg |
24 |
DIP |
Rectangular |
Metal |
10 V |
No |
1 |
Hybrid |
16 |
10 µs |
55 mA |
0.003 % |
Parallel, Word |
15 V |
5,±15 V |
-15 V |
Microelectronic Assembly |
DIP24,.6 |
Other Converters |
5 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-MDMA-P24 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
-10 V |
Complementary Offset Binary |
||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Pin/Peg |
24 |
DIP |
Rectangular |
Metal |
.512 V |
No |
1 |
Bipolar |
10 |
0.0488 % |
Parallel, Word |
15 V |
-15 V |
In-Line |
DIP24,.6 |
Other Converters |
300 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-MDIP-P24 |
0.175 in (4.45 mm) |
0.6 in (15.24 mm) |
No |
e0 |
-.512 V |
1.272 in (32.32 mm) |
Binary, Offset Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Pin/Peg |
24 |
DIP |
Rectangular |
No |
1 |
Hybrid |
MIL-PRF-38534 Class H |
12 |
0.0366 % |
Parallel, Word |
15 V |
-15 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Gold |
Dual |
R-XDIP-P24 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e4 |
1.272 in (32.32 mm) |
Binary |
|||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Pin/Peg |
72 |
Rectangular |
Plastic/Epoxy |
No |
12 |
Microelectronic Assembly |
Gold |
Dual |
R-PDMA-P72 |
No |
e4 |
||||||||||||||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Pin/Peg |
24 |
QIP |
Rectangular |
Ceramic, Glass-Sealed |
10 V |
No |
1 |
Bipolar |
MIL-STD-883 Class B |
12 |
0.0244 % |
Parallel, Word |
15 V |
-15 V |
In-Line |
400 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-GDIP-P24 |
0.6 in (15.24 mm) |
No |
-10 V |
1.2 in (30.48 mm) |
Binary |
||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Pin/Peg |
24 |
DIP |
Rectangular |
Metal |
.512 V |
No |
1 |
Bipolar |
8 |
0.0977 % |
Parallel, 8 Bits |
15 V |
-15 V |
In-Line |
DIP24,.6 |
Other Converters |
200 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-MDIP-P24 |
0.175 in (4.45 mm) |
0.6 in (15.24 mm) |
No |
e0 |
-.512 V |
1.272 in (32.32 mm) |
Binary, Offset Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Pin/Peg |
24 |
DIP |
Rectangular |
Metal |
.512 V |
No |
1 |
Hybrid |
12 |
35 ns |
54 mA |
0.0366 % |
Parallel, Word |
15 V |
±15 V |
-15 V |
In-Line |
DIP24,.6 |
Other Converters |
35 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-MDIP-P24 |
0.6 in (15.24 mm) |
No |
e0 |
-.512 V |
1.272 in (32.3205 mm) |
Binary, Offset Binary |
Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.
DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.
DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.
DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.