Through-Hole Digital-to-Analog Converters 2,400+

Reset All
Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

DAC100CCQ5/883C

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

Hybrid

38535Q/M;38534H;883B

10

375 ns

8.33 mA

0.2 %

15 V

±15 V

-15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Complementary Binary

DAC8413AT/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

BICMOS

38535Q/M;38534H;883B

12

12 mA

0.0183 %

Parallel, Word

15 V

5/±15 V

-15 V

In-Line

DIP28,.6

Other Converters

6 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Binary

LTC1446LCN8

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

2.54 V

No

2

CMOS

12

0.1221 %

Serial

3 V

In-Line

14 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T8

1

0.15 in (3.809 mm)

0.3 in (7.62 mm)

No

e0

2.46 V

Binary

DAC8420FQ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

2.5 V

No

4

BICMOS

12

0.0977 %

Serial

5 V

±5/±15 V

-5 V

In-Line

DIP16,.3

Other Converters

8 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-2.5 V

0.75 in (19.05 mm)

Binary

5962-01-364-9362

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

12

4 µs

0.018 %

±12/±15 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

1

No

Complementary Binary, Complementary Offset Binary

AD7531JN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

0.2 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

500 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T18

0.18 in (4.58 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.865 mm)

Binary

AD7541SQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

1 µs

2 mA

0.024 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

PM7548BR

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

15 V

No

1

CMOS

12

1 µs

3 mA

0.012 %

Parallel, 8 Bits

15 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

Binary, Offset Binary

LTC8143FN#PBF

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

2 mA

0.0244 %

Serial

5 V

In-Line

250 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T16

1

0.15 in (3.81 mm)

0.3 in (7.62 mm)

No

e3

Binary, Offset Binary

5962-9091101MXA

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

Bipolar

MIL-STD-883

12

183 mA

0.0427 %

Parallel, Word

5 V

-5.2 V

-5.2 V

In-Line

DIP28,.6

Other Converters

22 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Binary

PM7545FPZ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

15 V

No

1

CMOS

12

1 µs

2 mA

0.012 %

Parallel, Word

15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

0 V

0.992 in (25.2 mm)

Binary, 2's Complement Binary

DAC10BX

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

5.5 V

No

1

Bipolar

10

135 ns

15 mA

0.5 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP18,.3

Other Converters

85 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-5.5 V

Binary, Offset Binary

5962-8770101RX

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

MIL-STD-883

8

Parallel, 8 Bits

5 V

In-Line

180 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

0.953 in (24.195 mm)

Binary, Offset Binary

5962-8965701LB

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

12

2 mA

Parallel, Word

15 V

In-Line

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

AD562KD/BIN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Bipolar

12

25 mA

0.0122 %

Parallel, Word

5 V

5/15,-15 V

-15 V

In-Line

DIP24,.6

Other Converters

1.5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-10 V

1.2 in (30.48 mm)

Binary

AD563JN/BIN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

5/15,-15 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T24

No

e0

Binary, Offset Binary

5962-8851001XC

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

11 V

No

4

CMOS

38535Q/M;38534H;883B

12

15 µs

35 mA

0.0183 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-11 V

Binary

PM7541BX/883C

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

1 µs

2 mA

0.024 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

LTC1595BCN8#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

CMOS

16

0.0031 %

Serial

5 V

In-Line

1 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T8

0.3 in (7.62 mm)

e3

-10 V

0.4 in (10.16 mm)

Binary, Offset Binary

DAC1508A-8Q

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

.5 V

No

1

Bipolar

8

0.19 %

Parallel, 8 Bits

5 V

5,-15 V

-15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T16

No

e0

-5 V

Binary

DAC08SQ5/38510

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

Bipolar

8

0 ns

7.8 mA

0.19 %

Parallel, 8 Bits

15 V

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary

HDS-1240EM

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Metal

No

1

Bipolar

12

50 ns

110 mA

0.0125 %

15 V

±15 V

-15 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

100 °C (212 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-MDIP-T24

No

e0

Complementary Binary, Complementary Offset Binary

ADV7121JN50

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

10

125 mA

0.293 %

Parallel, 8 Bits

5 V

5 V

In-Line

DIP40,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T40

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

Binary

AD7111LNZ

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

BICMOS

8

4 mA

Parallel, 8 Bits

5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T16

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

0.793 in (20.13 mm)

Binary

AD568SQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

.512 V

No

1

Bipolar

12

32 mA

0.0183 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP24,.3

Other Converters

50 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-.512 V

Binary, Offset Binary

AD7111TQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

8

1 mA

Parallel, 8 Bits

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary

DAC-10BX/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

Bipolar

38535Q/M;38534H;883B

10

165 ns

15 mA

0.0488 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP18,.3

Other Converters

85 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

5962-01-014-3120

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

10

2 mA

0.2 %

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T16

No

Binary, Offset Binary

AD396TD

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

CMOS

14

15 µs

28 mA

0.0122 %

Parallel, 8 Bits

15 V

±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Offset Binary

5962-01-068-7830

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

10

2 mA

0.2 %

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T16

No

Binary, Offset Binary

HDG-0407BW

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

Bipolar

4

15 ns

225 mA

Parallel, 4 Bits

5 V

5 V

In-Line

DIP24,.6

Other Converters

8 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T24

0.215 in (5.457 mm)

0.6 in (15.24 mm)

No

e0

1.295 in (32.89 mm)

Binary

AD7112BN

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

8

2 mA

Parallel, 8 Bits

5 V

5 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.992 in (25.2 mm)

Binary

5962-01-382-6117

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Ceramic

No

2

CMOS

8

400 ns

2.5 mA

0.2 %

12/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-XDIP-T20

No

Binary, Offset Binary

AD7524SQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883 Class B

8

0 ns

2 mA

0.1953 %

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP16,.3

Other Converters

100 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary

5962-8851003XA

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

0 V

No

1

MIL-PRF-38534

12

0.0244 %

Parallel, Word

15 V

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-PDIP-T28

0.226 in (5.75 mm)

0.6 in (15.24 mm)

No

-10 V

1.575 in (40 mm)

Binary

AD7240SD

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

12

900 ns

2 mA

-0.0488 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T18

0.17 in (4.32 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.865 mm)

Binary

AD7305BNZ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

5 V

No

1

8

0.3906 %

Parallel, 8 Bits

5 V

-5 V

In-Line

1 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

-5 V

0.992 in (25.2 mm)

Binary

DAC8043AZ

Analog Devices

Digital to Analog converter

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

15 V

No

1

CMOS

12

1 µs

500 μA

0.0122 %

Serial

5 V

5 V

In-Line

DIP8,.3

Other Converters

250 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

Offset Binary

5962-9176402MXA

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

9.9853 V

No

4

BICMOS

MIL-STD-883

12

15 µs

13 mA

0.0366 %

Parallel, Word

15 V

5/±15 V

-15 V

In-Line

DIP28,.6

Other Converters

6 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

Yes

e0

-9.9902 V

Binary

AD767SD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Bipolar

MIL-STD-883

12

4 µs

0.0122 %

Serial

15 V

-15 V

In-Line

DIP24,.3

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.3 in (7.62 mm)

No

e0

-10 V

1.2 in (30.48 mm)

Binary, Offset Binary, 2's Complement Binary

5962-8851002XB

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

11 V

No

4

CMOS

12

0.0122 %

Parallel, Word

15 V

-15 V

In-Line

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-11 V

Binary

PMADV7121JN80

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

10

125 mA

0.3 %

5 V

5 V

In-Line

DIP40,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T40

No

e0

Binary

AD7237JN/883B

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

5 V

No

2

CMOS

MIL-STD-883 Class B

12

0.1221 %

Parallel, Word

15 V

-15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDIP-T24

0.3 in (7.62 mm)

No

-5 V

1.227 in (31.165 mm)

Offset Binary

AD568AD

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

12

40 mA

0.018 %

±12/±15 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

Binary, Offset Binary

DAC8222BIEW

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

12

2 mA

0.0122 %

Parallel, Word

5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

AD7118KN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

6

2 mA

Parallel, Word

5 V

5/15 V

In-Line

DIP14,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T16

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.793 in (20.13 mm)

Binary

PM7541AX/883C

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

1 µs

2 mA

0.012 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

AD395TM

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Metal

10 V

No

4

CMOS

MIL-STD-883 Class B

12

15 µs

28 mA

0.0244 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-MDIP-T28

0.205 in (5.21 mm)

0.6 in (15.24 mm)

No

e0

-10 V

1.57 in (39.88 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.