Through-Hole Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

DAC100BBQ5/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

11.1 V

No

1

MIL-STD-883 Class B

10

0.1 %

Parallel, Word

15 V

-15 V

In-Line

375 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

10 V

0.75 in (19.05 mm)

Complementary Binary

AD9712BBN

Analog Devices

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

12

183 mA

0.0427 %

Parallel, Word

-5.2 V

-5.2 V

In-Line

DIP28,.6

Other Converters

27 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

Binary

AD7247JN/883B

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

5 V

No

2

CMOS

MIL-STD-883 Class B

12

0.1221 %

Parallel, Word

15 V

-15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDIP-T24

0.3 in (7.62 mm)

No

-5 V

1.227 in (31.165 mm)

Offset Binary

AD7847AQ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

2

BICMOS

12

10 mA

0.0244 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP24,.3

Other Converters

3 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

e0

-10 V

Binary, Offset Binary

AD7521UD

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

12

0.0488 %

Parallel, Word

15 V

In-Line

500 ns

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T

e0

Binary

AD7549AQ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 µs

5 mA

0.0244 %

Parallel, 4 Bits

15 V

15 V

In-Line

DIP20,.3

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T20

0.175 in (4.45 mm)

0.3 in (7.62 mm)

No

e0

1.062 in (26.972 mm)

Binary, Offset Binary

DAC8412FT

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

BICMOS

12

12 mA

0.0244 %

Parallel, Word

15 V

5/±15 V

-15 V

In-Line

DIP28,.6

Other Converters

6 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Binary

AD7533BD

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

10

0.1 %

Parallel, Word

15 V

15 V

In-Line

DIP16,.3

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T16

0.3 in (7.62 mm)

No

e0

0.79 in (20.07 mm)

Binary, Offset Binary

AD7522SD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

10

0.2 %

5,15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T28

No

e0

Binary

DAC8800BR/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

2.5 V

No

8

CMOS

8

2 mA

0.1953 %

Serial

12 V

-5 V

In-Line

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

-2.5 V

Binary

AD7543TD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

0.012 %

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary

AD7548BQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

8

3 mA

1.1719 %

Parallel, Word

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

1.5 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-PDIP-T20

0.197 in (5 mm)

0.3 in (7.62 mm)

No

e0

0.953 in (24.195 mm)

Offset Binary

AD7522TD

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

10

0.0977 %

Serial, Parallel, Word

15 V

5,15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.6 in (15.24 mm)

No

e0

1.397 in (35.49 mm)

Binary

AD1861N-J

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

3.12 V

No

1

BICMOS

18

15 mA

Serial

5 V

±5 V

-5 V

In-Line

DIP16,.3

Other Converters

1.5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T16

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

-2.88 V

0.793 in (20.13 mm)

2's Complement Binary

DAC8408BIFP

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

4

CMOS

8

0.1953 %

Parallel, 8 Bits

5 V

In-Line

190 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

Binary, Offset Binary

AD7542BD

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

12

2 µs

2.5 mA

0.0122 %

Parallel, Word

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary, Offset Binary

AD7226TD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

4

BICMOS

38535Q/M;38534H;883B

8

20 µs

24 mA

0.39 %

12/15, GND/-5 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T20

No

e0

Binary

5962-01-321-0904

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

ECL

MIL-STD-883 Class B (Modified)

4

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

LTC1448IN8

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

5.5 V

No

2

12

0.1343 %

Serial

3 V

In-Line

14 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T8

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e0

0 V

Binary

5962-01-327-9899

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

BICMOS

38535Q/M;38534H;883B

8

5 µs

6 mA

0.2 %

12/15, GND/-5 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

Binary

PM7533EQ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

15 V

No

2

CMOS

10

1 µs

2 mA

0.05 %

Parallel, Word

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-CDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.75 in (19.05 mm)

Binary, Offset Binary

AD8802AN

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

12

CMOS

8

4 mA

0.5859 %

Serial

3 V

3/5 V

In-Line

DIP20,.3

Other Converters

600 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.992 in (25.2 mm)

Binary

AD7228ACNZ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

5 V

No

8

BICMOS

8

5 µs

20 mA

0.195 %

Parallel, 8 Bits

15 V

5/15,GND/-5 V

-5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

-5 V

1.2 in (30.48 mm)

Binary

AD7245AD

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

5 V

No

1

CMOS

12

0.0488 %

Parallel, Word

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

-5 V

Binary

LTC1452IN8

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

4.115 V

No

1

CMOS

12

0.0977 %

Serial

5 V

In-Line

14 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T8

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e0

0 V

Binary

5962-01-219-5097

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

8

3 µs

25 mA

0.2 %

5/15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T16

No

Binary

ADDAC85C-CCD-I

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Hybrid

12

0.0122 %

Parallel, Word

15 V

5,±15 V

-15 V

In-Line

DIP24,.6

Other Converters

5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

0 V

Binary Coded Decimal

PMADV7120KN30

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

8

100 mA

0.39 %

5 V

5 V

In-Line

DIP40,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T40

No

e0

Binary

AD7544SD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

Binary

AD7846JN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

CMOS

16

9 µs

0.0244 %

Parallel, Word

15 V

5,±15 V

-15 V

In-Line

DIP28,.6

Other Converters

7 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

-10 V

1.425 in (36.203 mm)

Binary, Offset Binary

DAC8043EZ

Analog Devices

Digital to Analog converter

Automotive

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

15 V

No

1

CMOS

12

1 µs

500 μA

0.0122 %

Serial

5 V

5 V

In-Line

DIP8,.3

Other Converters

250 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

Offset Binary

PM7224EX

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

12.5 V

No

1

CMOS

8

5 µs

6 mA

0.195 %

Parallel, 8 Bits

12/15, GND/-5 V

-5 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

Binary

JM38510/12101BJA

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

12

25 mA

0.0061 %

Parallel, Word

15 V

-15 V

In-Line

1.5 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Binary

DAC8043GPZ

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

15 V

No

1

CMOS

12

1 µs

500 μA

0.0122 %

Serial

5 V

5 V

In-Line

DIP8,.3

Other Converters

250 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T8

0.18 in (4.57 mm)

0.3 in (7.62 mm)

No

e3

0 V

0.365 in (9.27 mm)

Offset Binary

AD9712BSQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

Bipolar

12

183 mA

0.0488 %

Parallel, Word

-5.2 V

-5.2 V

In-Line

DIP28,.6

Other Converters

27 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Binary

5962-8770003EX

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883

8

0.1953 %

Parallel, 8 Bits

5 V

In-Line

100 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

0.75 in (19.05 mm)

Binary

DAC08EPZ

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

18 V

No

1

8

0 ns

0.19 %

Parallel, 8 Bits

15 V

-15 V

In-Line

85 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T16

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

-10 V

0.793 in (20.13 mm)

Binary

AD7534BD

Analog Devices

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

14

1.5 µs

3 mA

0.0061 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP20,.3

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T20

0.3 in (7.62 mm)

No

e0

1 in (25.4 mm)

Binary

HDM-1210-SDB

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1.024 V

No

1

Bipolar

MIL-STD-883 Class B (Modified)

12

170 ns

72 mA

0.0244 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP24,.6

Other Converters

120 ns

0.1 in (2.54 mm)

100 °C (212 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

0 V

Binary

5962-01-160-3245

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

25 mA

0.006 %

5/15,-15 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

Binary, Offset Binary

5962-01-250-4838

Analog Devices

Digital to Analog converter

Other

Through-Hole

14

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

6

2 mA

5/15 V

In-Line

DIP14,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-XDIP-T14

No

Binary

AD7111TD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

8

4 mA

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Complementary Binary

AD7837SQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

2

BICMOS

MIL-STD-883 Class B

12

0.0244 %

Parallel, Word

15 V

-15 V

In-Line

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

e0

-10 V

Binary, Offset Binary

PM7542AQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

15 V

No

2

CMOS

12

1 µs

2 mA

0.012 %

Parallel, 4 Bits

5 V

5 V

In-Line

DIP16,.3

Other Converters

250 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.75 in (19.05 mm)

Binary, Offset Binary

AD7244JN

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

2

BICMOS

14

4 µs

27 mA

0.0122 %

Serial

5 V

±5 V

-5 V

In-Line

DIP24,.3

Other Converters

2.5 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

0.3 in (7.62 mm)

No

e0

1.2 in (30.48 mm)

Binary

PM7541FX

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

15 V

No

1

CMOS

12

1 µs

2 mA

0.024 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

Binary, Offset Binary

AD395SM

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Metal

10 V

No

4

CMOS

MIL-STD-883 Class B

12

15 µs

28 mA

0.0732 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-MDIP-T28

0.205 in (5.21 mm)

0.6 in (15.24 mm)

No

e0

-10 V

1.57 in (39.88 mm)

Binary

AD7533KN/+

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

10

800 ns

2 mA

0.1 %

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDIP-T16

e0

Binary, Offset Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.