Maxim Integrated Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

MAX5351BEUA

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

3.3 V

Yes

1

CMOS

13

400 μA

0.0244 %

Serial

3.3 V

3.3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

16 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0 V

0.118 in (3 mm)

Binary

MX7542JP+

Maxim Integrated

Digital to Analog converter

12

Matte Tin

1

e3

Binary

MAX5251BCAP-T

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

1.9 V

Yes

4

CMOS

10

980 μA

0.0977 %

Serial

3.3 V

3.3 V

Small Outline, Shrink Pitch

SSOP20,.3

Other Converters

12 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G20

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e0

0 V

0.283 in (7.2 mm)

Binary

MX7523KCWE+T

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

8

200 ns

100 μA

0.0977 %

Parallel, 8 Bits

15 V

15 V

Small Outline

SOP16,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.406 in (10.3 mm)

Binary, Offset Binary

MAX555CCB

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

64

HTFQFP

Square

Plastic/Epoxy

Yes

1

Bipolar

12

0.05 %

Parallel, Word

-5.2 V

-5.2 V

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

TQFP64,.47SQ

Other Converters

4 ns

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G64

3

0.047 in (1.2 mm)

0.394 in (10 mm)

No

e0

245 °C (473 °F)

0.394 in (10 mm)

Binary

5962-9234502M2C

Maxim Integrated

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883

12

1 µs

500 μA

0.0244 %

Serial

5 V

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

1

No

e0

245 °C (473 °F)

Binary

MAX533ACEE

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

4

CMOS

8

1.3 mA

0.3906 %

Serial

3 V

3/3.3 V

Small Outline, Shrink Pitch

SSOP16,.25

Other Converters

6 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.068 in (1.73 mm)

0.154 in (3.9 mm)

No

e0

245 °C (473 °F)

0 V

0.193 in (4.89 mm)

Binary

MX7545ALP+T

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.0122 %

Parallel, Word

5 V

Chip Carrier

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.965 mm)

No

e3

0.353 in (8.965 mm)

Binary, 2's Complement Binary

MAX5158EPE+

Maxim Integrated

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

5.5 V

No

2

CMOS

10

600 μA

0.0977 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

16 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.755 in (19.175 mm)

Binary

MAX5290AEUE

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

3.6 V

Yes

1

BICMOS

12

6 µs

2 mA

0.0244 %

Serial

3 V

2/3.3,3/3.3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

3 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e0

0 V

0.197 in (5 mm)

Binary

MAX527DENG+

Maxim Integrated

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

4

CMOS

12

18 mA

0.0244 %

Parallel, Word

5 V

±5 V

-5 V

In-Line

DIP24,.3

Other Converters

5 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.203 in (30.545 mm)

Binary

MAX509AEAP

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

5 V

Yes

4

8

10 mA

0.024 %

Serial

5 V

5/±5 V

-5 V

Small Outline, Shrink Pitch

SSOP20,.3

Other Converters

6 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G20

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e0

245 °C (473 °F)

-5 V

0.283 in (7.2 mm)

Binary

MAX5580AEUP

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

20

HTSSOP

Rectangular

Plastic/Epoxy

5.25 V

Yes

1

BICMOS

12

6 µs

4 mA

0.0244 %

Serial

5 V

2/5,3/5 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

TSSOP20,.25

Other Converters

3 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G20

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e0

245 °C (473 °F)

0 V

0.256 in (6.5 mm)

Binary

MX7248SE

Maxim Integrated

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

5 V

Yes

1

BICMOS

12

5 µs

12 mA

0.0244 %

Parallel, Word

15 V

12/15,GND/-12/-15 V

-15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Gold Over Nickel

Quad

S-CQCC-N20

1

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e4

-5 V

0.35 in (8.89 mm)

Binary

MX566AKN

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

Bipolar

12

0 ns

20 mA

0.012 %

Parallel, Word

-15 V

-15 V

In-Line

DIP24,.6

Other Converters

250 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

1

0.225 in (5.72 mm)

0.3 in (7.62 mm)

No

e0

-10 V

Binary

MAX5304EUA-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

1

10

0.3906 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

10 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0.118 in (3 mm)

Offset Binary

MAX521BCAG

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

24

SSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

20 mA

0.78 %

Serial

5 V

5 V

Small Outline, Shrink Pitch

SSOP24,.3

Other Converters

6 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G24

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e0

20 s

240 °C (464 °F)

0 V

0.323 in (8.2 mm)

Binary

MAX545BMJD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

14

DIP

Rectangular

Ceramic, Glass-Sealed

3 V

No

1

CMOS

14

1.1 mA

0.0031 %

Serial

5 V

5 V

In-Line

DIP14,.3

Other Converters

1 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T14

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.765 in (19.43 mm)

Offset Binary

MX7248JP+T

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

12

5 µs

12 mA

0.0244 %

Parallel, Word

15 V

12/15,GND/-12/-15 V

-15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.965 mm)

No

e3

-5 V

0.353 in (8.965 mm)

Binary

MX7533LP+T

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

10

800 ns

2 mA

0.05 %

Parallel, Word

15 V

15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.965 mm)

No

e3

0.353 in (8.965 mm)

Binary, Offset Binary

MX7520KCWE

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

10

2 mA

0.1 %

Parallel, Word

15 V

Small Outline

SOP16,.4

500 ns

1.969 in (50 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G16

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.406 in (10.3 mm)

Binary, Offset Binary

MX7542TD-T

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2.5 mA

0.0122 %

Parallel, 4 Bits

5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MX7528SQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

8

400 ns

1 mA

0.3906 %

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

MX7248JP+

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

12

5 µs

12 mA

0.0244 %

Parallel, Word

15 V

12/15,GND/-12/-15 V

-15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.965 mm)

No

e3

250 °C (482 °F)

-5 V

0.353 in (8.965 mm)

Binary

MAX544BCSA

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

3 V

Yes

1

CMOS

14

1.1 mA

0.0031 %

Serial

5 V

5 V

Small Outline

SOP8,.25

Other Converters

1 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

245 °C (473 °F)

0 V

0.193 in (4.9 mm)

Offset Binary

MX7537TQ/883B

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883 Class B

12

0.0122 %

Parallel, Word

15 V

In-Line

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

MAX550AEUA

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

10 μA

0.39 %

Serial

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

4 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0 V

0.118 in (3 mm)

Binary

MX7541AKN

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

2 mA

0.0122 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

600 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T18

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.86 mm)

Binary, Offset Binary

MAX520AEAP

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

20 μA

0.39 %

Serial

5 V

5 V

Small Outline, Shrink Pitch

SSOP20,.3

Other Converters

2 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G20

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e0

245 °C (473 °F)

0 V

0.283 in (7.2 mm)

Binary

MX7536AQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T28

1

0.23 in (5.842 mm)

0.6 in (15.24 mm)

No

e0

1.45 in (36.83 mm)

Offset Binary

MX7541AJC/D

Maxim Integrated

Digital to Analog converter

Commercial

No Lead

18

DIE

Rectangular

Yes

1

CMOS

12

2 mA

0.024 %

Parallel, Word

15 V

15 V

Uncased Chip

DIE OR CHIP

Other Converters

600 ns

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N18

No

e0

Binary, Offset Binary

MAX547BEQH-TD

Maxim Integrated

Digital to Analog converter

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

4.5 V

Yes

1

13

0.0488 %

Parallel, Word

5 V

±5 V

-5 V

Chip Carrier

LDCC44,.7SQ

Other Converters

5 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J44

2

0.18 in (4.57 mm)

0.653 in (16.585 mm)

No

e0

-4.5 V

0.653 in (16.585 mm)

Offset Binary

5962-8876701LA

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

MIL-STD-883

12

5 µs

10 mA

0.0122 %

Parallel, Word

12 V

±12/±15 V

-12 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

1

No

e0

Binary, Offset Binary

MAX507ACNG

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

12

5 µs

12 mA

0.018 %

Parallel, Word

12 V

12/±15 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

0 V

1.25 in (31.75 mm)

Binary, Offset Binary

MAX19792ETX+

Maxim Integrated

Digital to Analog converter

No Lead

36

HVQCCN

Square

Yes

1

BICMOS

10

Serial

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

Matte Tin

Quad

S-XQCC-N36

1

0.031 in (0.8 mm)

0.236 in (6 mm)

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

Binary

MX7528JC/D

Maxim Integrated

Digital to Analog converter

Commercial

No Lead

20

DIE

Rectangular

Yes

2

CMOS

8

400 ns

1 mA

0.3906 %

Parallel, 8 Bits

5 V

5/15 V

Uncased Chip

DIE OR CHIP

Other Converters

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N20

No

e0

Binary

MAX555CCB+D

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

64

HTFQFP

Square

Plastic/Epoxy

Yes

1

Bipolar

12

0.05 %

Parallel, Word

-5.2 V

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

4 ns

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G64

3

0.047 in (1.2 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

0.394 in (10 mm)

Binary

MAX5290BEUD-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

14

TSSOP

Rectangular

Plastic/Epoxy

3 V

Yes

1

BICMOS

12

6 µs

0.0977 %

Serial

3 V

2/3.3,3/3.3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP14,.25

Other Converters

3 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G14

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e0

20 s

240 °C (464 °F)

0 V

0.197 in (5 mm)

Binary

MAX527CCWG-T

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

Yes

4

CMOS

12

18 mA

0.0122 %

Parallel, Word

5 V

±5 V

-5 V

Small Outline

SOP24,.4

Other Converters

5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G24

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.606 in (15.4 mm)

Binary

MAX5230BEEE-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

3 V

Yes

1

BICMOS

12

475 μA

0.0244 %

Serial

3 V

3/3.3 V

Small Outline, Shrink Pitch

SSOP16,.25

Other Converters

10 µs

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.068 in (1.73 mm)

0.154 in (3.9 mm)

No

e0

0 V

0.193 in (4.89 mm)

Binary

MAX5581BEUP

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

20

HTSSOP

Rectangular

Plastic/Epoxy

5.25 V

Yes

1

BICMOS

12

6 µs

4 mA

0.0977 %

Serial

5 V

2/5,3/5 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

TSSOP20,.25

Other Converters

3 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G20

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e0

245 °C (473 °F)

0 V

0.256 in (6.5 mm)

Binary

MAX533BCEE-T

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

4

CMOS

8

1.3 mA

0.7812 %

Serial

3 V

3/3.3 V

Small Outline, Shrink Pitch

SSOP16,.25

Other Converters

6 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.068 in (1.73 mm)

0.154 in (3.9 mm)

No

e0

245 °C (473 °F)

0 V

0.193 in (4.89 mm)

Binary

MX7534TQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

CMOS

14

1.5 µs

3 mA

0.0061 %

Parallel, 8 Bits

12/15,GND/-0.3 V

In-Line

DIP20,.3

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-10 V

Binary, Offset Binary

MX7248SQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

5 V

No

1

BICMOS

12

5 µs

12 mA

0.0244 %

Parallel, Word

15 V

12/15,GND/-12/-15 V

-15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-5 V

Binary

MX7535JP-T

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,GND/-0.3 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e0

-10 V

0.453 in (11.505 mm)

Binary, Offset Binary

MAX5580AETP-T

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

20

HVQCCN

Square

5.25 V

Yes

1

BICMOS

12

6 µs

4 mA

0.0244 %

Serial

5 V

2/5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.20SQ,25

Other Converters

3 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N20

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

0 V

0.197 in (5 mm)

Binary

MX7536SQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

1

0.23 in (5.842 mm)

0.6 in (15.24 mm)

No

e0

1.45 in (36.83 mm)

Offset Binary

MX7645BEJP

Maxim Integrated

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

0.0122 %

Parallel, Word

5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.03 in (26.16 mm)

Binary, 2's Complement Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.