Microchip Technology Digital-to-Analog Converters 196

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

MCP47CVB01-E/MG

Microchip Technology

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

Yes

1

8

620 μA

0.0391 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N16

0.031 in (0.8 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CVB11-E/MF

Microchip Technology

Digital to Analog converter

Automotive

No Lead

10

HVSON

Square

Plastic/Epoxy

Yes

1

10

620 μA

0.0244 %

Serial

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N10

0.039 in (1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CVB28-E/ML

Microchip Technology

Digital to Analog converter

No Lead

20

HVQCCN

Square

Plastic/Epoxy

Yes

1

12

1.38 mA

0.024414 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.16SQ,20

4 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N20

0.039 in (1 mm)

0.157 in (4 mm)

0.157 in (4 mm)

Binary

MCP4725A3T-E/MAY

Microchip Technology

Digital to Analog converter

Automotive

No Lead

6

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

TS 16949

12

400 μA

0.354 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

TSSOP6,.08

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-N6

0.035 in (0.9 mm)

0.079 in (2 mm)

e4

0 V

0.079 in (2 mm)

Binary

MCP4728A5T-E/UN

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

12

1.4 mA

0.3174 %

Serial

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

6 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MCP47CMB01-E/MF

Microchip Technology

Digital to Analog converter

Automotive

No Lead

10

HVSON

Square

Plastic/Epoxy

Yes

1

8

620 μA

0.0391 %

Serial

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N10

0.039 in (1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CMB02-E/UN

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

1

8

720 μA

0.0391 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-G8

0.043 in (1.1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CMB11-E/MG

Microchip Technology

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

Yes

1

10

620 μA

0.0244 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N16

0.031 in (0.8 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CMB12-E/MG

Microchip Technology

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

Yes

1

10

720 μA

0.0244 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N16

0.031 in (0.8 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CVB28-20E/ST

Microchip Technology

Digital to Analog converter

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

12

1.38 mA

0.024414 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP20,.25

4 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G20

0.047 in (1.2 mm)

0.173 in (4.4 mm)

0.256 in (6.5 mm)

Binary

MCP47CVD22T-E/MF

Microchip Technology

Digital to Analog converter

MCP47CVD22T-E/MG

Microchip Technology

Digital to Analog converter

MCP47CVD22T-E/UN

Microchip Technology

Digital to Analog converter

MCP47FEB01A1-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

5.46 V

Yes

1

TS 16949

8

500 μA

0.1953 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

.01 V

0.173 in (4.4 mm)

Binary

MCP47FEB21A2-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

5.46 V

Yes

1

TS 16949

12

500 μA

0.1464 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

.01 V

0.173 in (4.4 mm)

Binary

MCP4802T-E/SN

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

4.176 V

Yes

1

TS 16949

8

750 μA

0.39 %

Serial

5 V

3/5 V

Small Outline

SOP8,.23

Other Converters

4.5 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

3

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.9 mm)

Binary

MCP4716A2T-E/MAY

Microchip Technology

Digital to Analog converter

Automotive

No Lead

6

HVSON

Square

Plastic/Epoxy

Yes

1

TS 16949

10

400 μA

0.354 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

TSSOP6,.08

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-N6

1

0.035 in (0.9 mm)

0.079 in (2 mm)

e4

40 s

260 °C (500 °F)

0.079 in (2 mm)

Binary

MCP47A1T-A0E/LT

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

6

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

TS 16949

6

220 μA

1.56 %

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP6,.08

Other Converters

15 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G6

0.043 in (1.1 mm)

0.049 in (1.25 mm)

No

e3

0 V

0.079 in (2 mm)

Binary

MCP47CVB21-E/MG

Microchip Technology

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

Yes

1

12

620 μA

0.0244 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N16

0.031 in (0.8 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CVB22-E/MG

Microchip Technology

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

Yes

1

12

720 μA

0.0244 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N16

0.031 in (0.8 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CVB28T-20E/ST

Microchip Technology

Digital to Analog converter

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

12

1.38 mA

0.024414 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP20,.25

4 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G20

0.047 in (1.2 mm)

0.173 in (4.4 mm)

0.256 in (6.5 mm)

Binary

MCP47CVB28T-E/ML

Microchip Technology

Digital to Analog converter

No Lead

20

HVQCCN

Square

Plastic/Epoxy

Yes

1

12

1.38 mA

0.024414 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.16SQ,20

4 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N20

0.039 in (1 mm)

0.157 in (4 mm)

0.157 in (4 mm)

Binary

MCP47FVB11A0-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

10

500 μA

0.1465 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

MCP47FVB12A0T-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

10

700 μA

0.1465 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

MCP47FVB12A1T-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

10

700 μA

0.1465 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

MCP47FVB12A2-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

10

700 μA

0.1465 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

MCP47FVB12A2T-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

10

700 μA

0.1465 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

MCP47FVB12A3-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

10

700 μA

0.1465 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

MCP47FVB12A3T-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

12

700 μA

0.1465 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

MCP47FVB21A1-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

12

500 μA

0.1465 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

MCP47FVB28-E/MQ

Microchip Technology

Digital to Analog converter

Automotive

No Lead

20

HVQCCN

Square

Plastic/Epoxy

Yes

1

12

3 mA

0.146484375 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.20SQ,25

7.8 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N20

0.039 in (1 mm)

0.197 in (5 mm)

0.197 in (5 mm)

Binary

MCP48FVB11T-E/UN

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

Yes

1

TS 16949

10

1.7 mA

0.0488 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

7.8 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

2

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.118 in (3 mm)

Binary

MCP4706A1T-E/MAY

Microchip Technology

Digital to Analog converter

Automotive

No Lead

6

HVSON

Square

Plastic/Epoxy

Yes

1

TS 16949

8

400 μA

0.3543 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

TSSOP6,.08

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-N6

0.035 in (0.9 mm)

0.079 in (2 mm)

e4

0.079 in (2 mm)

Binary

MCP4716A3T-E/CH

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

6

LSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

10

400 μA

0.354 %

Serial

3 V

3/5 V

Small Outline, Low Profile, Shrink Pitch

TSOP6,.11,37

Other Converters

6 µs

0.037 in (0.95 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G6

1

0.057 in (1.45 mm)

0.061 in (1.55 mm)

No

e3

260 °C (500 °F)

0.114 in (2.9 mm)

Binary

MCP4728A7T-E/UN

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

12

1.4 mA

0.3174 %

Serial

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

6 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MCP47CMB21-E/UN

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

Yes

1

TS 16949

12

700 μA

0.0244 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-G10

0.043 in (1.1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CVD11T-E/UN

Microchip Technology

Digital to Analog converter

MCP47FVB02A1-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

8

700 μA

0.1953 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

MCP4911-E/P

Microchip Technology

Digital to Analog converter

Automotive

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

4.096 V

No

1

10

350 μA

0.34179 %

Serial

5 V

3/5 V

In-Line

DIP8,.3

Other Converters

4.5 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T8

0.17 in (4.32 mm)

0.3 in (7.62 mm)

No

e3

0 V

0.372 in (9.46 mm)

Binary

MCP4706A2T-E/CH

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

6

LSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

8

400 μA

0.3543 %

Serial

3 V

3/5 V

Small Outline, Low Profile, Shrink Pitch

TSOP6,.11,37

Other Converters

6 µs

0.037 in (0.95 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G6

1

0.057 in (1.45 mm)

0.061 in (1.55 mm)

No

e3

260 °C (500 °F)

0.114 in (2.9 mm)

Binary

MCP4706A2T-E/MAY

Microchip Technology

Digital to Analog converter

Automotive

No Lead

6

HVSON

Square

Plastic/Epoxy

Yes

1

TS 16949

8

400 μA

0.3543 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

TSSOP6,.08

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-N6

1

0.035 in (0.9 mm)

0.079 in (2 mm)

e4

40 s

260 °C (500 °F)

0.079 in (2 mm)

Binary

MCP4911-E/SN

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

10

350 μA

0.34179 %

Serial

5 V

3/5 V

Small Outline

SOP8,.23

Other Converters

4.5 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.9 mm)

Binary

MCP4911T-E/MS

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

SOP

Square

Plastic/Epoxy

4.096 V

Yes

1

10

350 μA

0.34179 %

Serial

5 V

3/5 V

Small Outline

SOP8,.19

Other Converters

4.5 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

40 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MCP4901-E/SN

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

8

350 μA

0.3906 %

Serial

5 V

3/5 V

Small Outline

SOP8,.23

Other Converters

4.5 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.9 mm)

Binary

MCP47CMB12-E/UN

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

1

10

720 μA

0.0244 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-G8

0.043 in (1.1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CMB22-E/UN

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

1

12

720 μA

0.0244 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-G8

0.043 in (1.1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47FVB02A2T-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

8

700 μA

0.1953 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

MCP47FVB21A0T-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

12

500 μA

0.1465 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.