28 Other Function Converters 72

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Manufacturers
    • Ams Ag
    • Analog Devices
    • Bias Power
    • Broadcom
    • Diodes Incorporated
    • Dymec
    • General Electric Solid State
    • Infineon Technologies
    • Maxim Integrated
    • Murata Manufacturing
    • NXP Semiconductors
    • New Japan Radio
    • Onsemi
    • Renesas Electronics
    • STMicroelectronics
    • Samsung
    • Telcom Semiconductor
    • Texas Instruments
    • Thine Electronics
    • Toshiba
    • XP Power
Converter Type
    • Analog to Digital Converter
    • Analog to Digital Converter, Delta-sigma
    • Converter
    • Digital to Analog Converter
Temperature Grade
    • Automotive
    • Commercial
    • Commercial Extended
    • Industrial
    • Military
    • Other
Terminal Form
    • Ball
    • Gull Wing
    • J Bend
    • No Lead
    • Through-Hole
No. of Terminals (1)
    • 28
    • 10
    • 100
    • 105
    • 112
    • 12
    • 14
    • 144
    • 16
    • 160
    • 18
    • 20
    • 22
    • 24
    • 30
    • 32
    • 36
    • 38
    • 40
    • 42
    • 44
    • 48
    • 5
    • 56
    • 6
    • 64
    • 68
    • 72
    • 8
    • 80
    • 84
Package Code
    • DIP
    • FBGA
    • HVQCCN
    • QCCJ
    • QCCN
    • QFP
    • SDIP
    • SON
    • SOP
    • SSOP
    • TSOP
    • TSSOP
Package Shape
    • Rectangular
    • Square
Package Body Material
    • Ceramic
    • Metal
    • Plastic/Epoxy
No. of Analog In Channels
    • 1
    • 10
    • 2
    • 3
    • 6
    • 8
Surface Mount
    • No
    • Yes
Maximum Supply Voltage
    • 12 V
    • 4.25 V
    • 5.5 V
Maximum Analog Input Voltage
    • 3 V
    • 3.6 V
    • 5.3 V
No. of Functions
    • 1
    • 12
    • 2
    • 3
    • 32
    • 4
    • 8
Technology
    • BICMOS
    • Bipolar
    • CMOS
    • Hybrid
    • MOS
Screening Level
    • 38535Q/M;38534H;883B
    • 38535V;38534K;883S
    • AEC-Q100
    • MIL-STD-883 Class B (Modified)
No. of Bits
    • 10
    • 11
    • 12
    • 14
    • 16
    • 18
    • 20
    • 24
    • 4
    • 5
    • 6
    • 8
Maximum Settling Time
    • 0.1 ns
    • 1 µs
    • 1.5 µs
    • 10 ns
    • 10 µs
    • 100 ns
    • 110 ns
    • 12 ns
    • 120 ns
    • 135 ns
    • 15 µs
    • 150 ns
    • 150 µs
    • 18 ns
    • 18 µs
    • 2 µs
    • 20 ns
    • 20 µs
    • 200 ns
    • 25 ns
    • 250 ns
    • 28 ns
    • 28.5 ns
    • 3 µs
    • 300 ns
    • 300 µs
    • 350 ns
    • 375 ns
    • 4 µs
    • 4.5 µs
    • 40 ns
    • 400 ns
    • 5 µs
    • 500 ns
    • 6 ns
    • 600 ns
    • 7 µs
    • 7.4 ns
    • 8 ns
    • 8 µs
    • 800 ns
    • 9 µs
    • 900 ns
Maximum Supply Current
    • 1 mA
    • 1.2 mA
    • 1.4 mA
    • 1.5 mA
    • 1.8 mA
    • 10 mA
    • 10 μA
    • 100 μA
    • 105 mA
    • 11.6 mA
    • 11.69 mA
    • 12 mA
    • 125 μA
    • 13 mA
    • 15 mA
    • 15.5 mA
    • 150 mA
    • 155 mA
    • 16 mA
    • 160 mA
    • 18 mA
    • 183 mA
    • 188 mA
    • 2 mA
    • 2.5 mA
    • 2.6 mA
    • 2.7 mA
    • 20 mA
    • 220 mA
    • 23 mA
    • 230 μA
    • 24 mA
    • 25 mA
    • 250 mA
    • 26.3 mA
    • 260 μA
    • 27 mA
    • 275 mA
    • 28 mA
    • 280 μA
    • 290 mA
    • 3 mA
    • 3.2 mA
    • 3.5 mA
    • 300 mA
    • 330 mA
    • 340 mA
    • 35 mA
    • 358 mA
    • 391 mA
    • 4 mA
    • 40 mA
    • 400 μA
    • 410 μA
    • 42 mA
    • 450 μA
    • 49 mA
    • 5 mA
    • 5.2 mA
    • 5.6 mA
    • 50 mA
    • 580 mA
    • 6 mA
    • 60 mA
    • 600 μA
    • 65 mA
    • 700 μA
    • 72 mA
    • 8.33 mA
    • 80 mA
    • 85 mA
    • 9 μA
    • 9.3 mA
    • 900 μA
Maximum Linearity Error (EL)
    • 0.0003 %
    • 0.0012 %
    • 0.0022 %
    • 0.003 %
    • 0.006 %
    • 0.0061 %
    • 0.01 %
    • 0.012 %
    • 0.0125 %
    • 0.015 %
    • 0.017 %
    • 0.018 %
    • 0.02 %
    • 0.024 %
    • 0.03 %
    • 0.032 %
    • 0.036 %
    • 0.042 %
    • 0.048 %
    • 0.049 %
    • 0.05 %
    • 0.06 %
    • 0.097 %
    • 0.0976 %
    • 0.098 %
    • 0.1 %
    • 0.12 %
    • 0.15 %
    • 0.19 %
    • 0.195 %
    • 0.2 %
    • 0.2148 %
    • 0.24 %
    • 0.31 %
    • 0.39 %
    • 0.4 %
    • 0.429 %
    • 0.45 %
    • 0.58 %
    • 0.59 %
    • 0.78 %
    • 0.8 %
    • 0.9 %
    • 0.98 %
    • 1.17 %
    • 1.61 %
    • 3.9 %
Input Format
    • Parallel, 8 Bits
Nominal Supply Voltage
    • 1.8 V
    • 12 V
    • 15 V
    • 3 V
    • 3.3 V
    • 5 V
Power Supplies (V)
    • -15 V
    • -3,3/5,5,8 V
    • -4,5,10 V
    • -5.2 V
    • 1,3.3 V
    • 1.8,1.8/3.3 V
    • 1.8,3.3 V
    • 1.8/3.3 V
    • 1.8/3.6 V
    • 12 V
    • 12/15 V
    • 12/15, GND/-5 V
    • 12/15,-0.3 V
    • 12/15,-5 V
    • 12/15,GND/-0.3 V
    • 12/15,GND/-12/-15 V
    • 15 V
    • 2.5/5.5 V
    • 2.7/5,5 V
    • 2/5,3/5 V
    • 3 V
    • 3,5 V
    • 3.3 V
    • 3.3,3.3/5 V
    • 3.3,5 V
    • 3/3.3 V
    • 3/3.3,-7.5,15 V
    • 3/5 V
    • 3/5,5 V
    • 3/5,5,10.5 V
    • 3/5,±12/±15 V
    • 3/5,±12/±16.5 V
    • 5 V
    • 5,-12 V
    • 5,-15 V
    • 5,-5.2 V
    • 5,13 V
    • 5,15 V
    • 5,±12/±15 V
    • 5,±15 V
    • 5/15 V
    • 5/15,-15 V
    • 5/±5 V
    • ±10/±15 V
    • ±12/±15 V
    • ±15 V
    • ±5 V
    • ±5,3/5 V
Nominal Negative Supply Voltage
    • -15 V
    • -5 V
    • -5.2 V
Package Style (Meter)
    • Chip Carrier
    • Chip Carrier, Heat Sink/Slug, Very Thin Profile
    • Flatpack
    • Grid Array, Fine Pitch
    • In-Line
    • In-Line, Shrink Pitch
    • Small Outline
    • Small Outline, Shrink Pitch
    • Small Outline, Thin Profile
    • Small Outline, Thin Profile, Shrink Pitch
Package Equivalence Code
    • BGA105,11X11,25
    • BGA12,3X4,20
    • DIE OR CHIP
    • DIP14,.3
    • DIP16,.3
    • DIP18,.3
    • DIP20,.3
    • DIP22,.3
    • DIP22,.4
    • DIP24(UNSPEC)
    • DIP24,.3
    • DIP24,.4
    • DIP24,.6
    • DIP28,.6
    • DIP30,1.8
    • DIP32,.9
    • DIP40,.6
    • DIP42,.6
    • DIP8,.3
    • LCC16,.12SQ,20
    • LCC20,.35SQ
    • LCC28,.45SQ
    • LCC32,.2SQ,20
    • LCC36,.25SQ,20
    • LCC40,.24SQ,20
    • LCC48,.27SQ,20
    • LCC56,.31SQ,20
    • LCC64,.35SQ,20
    • LCC68,.4SQ,20
    • LCC72,.39SQ,20
    • LDCC20,.4SQ
    • LDCC28,.5SQ
    • LDCC44,.7SQ
    • LDCC84,1.2SQ
    • QFP144,1.2SQ
    • QFP160,1.2SQ
    • QFP44,.5SQ,32
    • QFP48,.35SQ,20
    • QFP48,.5X.66,32
    • QFP64,.47SQ,20
    • QFP64,.7X.95,40
    • QFP80,.55SQ,20
    • SDIP24,.3
    • SDIP28,.4
    • SDIP30,.4
    • SOLCC10,.08,20
    • SOLCC10,.11,20
    • SOLCC10,.12,20
    • SOLCC14,.12,20
    • SOLCC8,.12,25
    • SOP16,.25
    • SOP16,.3
    • SOP16,.4
    • SOP20,.3
    • SOP20,.4
    • SOP24,.3
    • SOP24,.3,32
    • SOP24,.4
    • SOP28,.3
    • SOP28,.4
    • SOP28,.5
    • SOP36,.3,32
    • SOP8,.25
    • SSOP16,.25
    • SSOP20,.25
    • SSOP24,.3
    • SSOP28,.3
    • TQFP100,.63SQ
    • TQFP32,.35SQ,32
    • TQFP48,.35SQ
    • TQFP64,.47SQ
    • TQFP64,.63SQ,32
    • TQFP80,.55SQ
    • TSOP5/6,.11,37
    • TSOP6,.11,37
    • TSSOP10,.19,20
    • TSSOP14,.25
    • TSSOP16,.19,20
    • TSSOP16,.25
    • TSSOP20,.25
    • TSSOP28,.25
    • TSSOP38,.25,20
    • TSSOP6,.08
    • TSSOP8,.1
    • TSSOP8,.19
    • TSSOP8,.25
    • WAFER
Minimum Supply Voltage
    • 2.7 V
    • 3 V
    • 4.75 V
Terminal Pitch
    • 0.02 in (0.5 mm)
    • 0.025 in (0.635 mm)
    • 0.026 in (0.65 mm)
    • 0.031 in (0.8 mm)
    • 0.037 in (0.95 mm)
    • 0.039 in (1 mm)
    • 0.05 in (1.27 mm)
    • 0.07 in (1.78 mm)
    • 0.1 in (2.54 mm)
Maximum Operating Temperature
    • 105 °C (221 °F)
    • 115 °C (239 °F)
    • 125 °C (257 °F)
    • 25 °C (77 °F)
    • 60 °C (140 °F)
    • 70 °C (158 °F)
    • 80 °C (176 °F)
    • 85 °C (185 °F)
Minimum Operating Temperature
    • -10 °C (14 °F)
    • -15 °C (5 °F)
    • -20 °C (-4 °F)
    • -25 °C (-13 °F)
    • -30 °C (-22 °F)
    • -40 °C (-40 °F)
    • -55 °C (-67 °F)
    • 0 °C (32 °F)
    • 25 °C (77 °F)
Terminal Finish
    • Gold
    • Matte Tin
    • Matte Tin - annealed
    • Nickel Gold Palladium Silver
    • Nickel Palladium Gold
    • Tin Bismuth
    • Tin Lead
    • Tin Silver Copper
    • Tin Silver Copper Nickel
    • Tin/Lead
    • Tin/Lead (Sn63Pb37)
    • Tin/Lead (Sn85Pb15)
    • Tin/Lead - hot dipped
    • Tin/Silver
Terminal Position
    • Bottom
    • Dual
    • Quad
JESD-30 Code
    • R-MDIP-T24
    • R-MDIP-T32
    • R-PBGA-B12
    • R-PDIP-T14
    • R-PDIP-T16
    • R-PDIP-T20
    • R-PDIP-T22
    • R-PDIP-T24
    • R-PDIP-T28
    • R-PDIP-T30
    • R-PDIP-T40
    • R-PDIP-T42
    • R-PDIP-T8
    • R-PDSO-G10
    • R-PDSO-G14
    • R-PDSO-G16
    • R-PDSO-G20
    • R-PDSO-G24
    • R-PDSO-G28
    • R-PDSO-G36
    • R-PDSO-G38
    • R-PDSO-G5
    • R-PDSO-G6
    • R-PDSO-G8
    • R-PDSO-N10
    • R-PDSO-N14
    • R-PDSO-N8
    • R-PQFP-G48
    • R-PQFP-G64
    • R-XDIP-T14
    • R-XDIP-T16
    • R-XDIP-T18
    • R-XDIP-T20
    • R-XDIP-T22
    • R-XDIP-T24
    • R-XDIP-T28
    • R-XDIP-T30
    • R-XDIP-T32
    • R-XDIP-T40
    • S-MQFP-G160
    • S-PBGA-B105
    • S-PBGA-B112
    • S-PQCC-J20
    • S-PQCC-J28
    • S-PQCC-J44
    • S-PQCC-J84
    • S-PQCC-N16
    • S-PQCC-N32
    • S-PQCC-N36
    • S-PQCC-N40
    • S-PQCC-N48
    • S-PQCC-N56
    • S-PQCC-N64
    • S-PQCC-N68
    • S-PQCC-N72
    • S-PQFP-G100
    • S-PQFP-G160
    • S-PQFP-G32
    • S-PQFP-G44
    • S-PQFP-G48
    • S-PQFP-G64
    • S-PQFP-G80
    • S-XQCC-N16
    • S-XQCC-N20
    • S-XQCC-N28
    • S-XQFP-G144
    • X-PQFP-G80
Moisture Sensitivity Level (MSL)
    • 1
    • 3
Maximum Seated Height
    • 0.039 in (1 mm)
    • 0.078 in (1.99 mm)
    • 0.096 in (2.45 mm)
Width
    • 0.049 in (1.25 mm)
    • 0.118 in (3 mm)
    • 0.208 in (5.29 mm)
    • 0.394 in (10 mm)
Qualification
    • No
JESD-609 Code
    • e0
    • e1
    • e2
    • e3
    • e4
    • e6
Maximum Time At Peak Reflow Temperature (s)
    • 10 s
    • 20 s
    • 30 s
    • 40 s
Peak Reflow Temperature (C)
    • 240 °C (464 °F)
    • 245 °C (473 °F)
    • 260 °C (500 °F)
Length
    • 0.079 in (2 mm)
    • 0.118 in (3 mm)
    • 0.394 in (10 mm)
    • 0.402 in (10.2 mm)
Input Bit Code
    • 2's Complement
    • Binary
    • Binary Coded Decimal
    • Binary, 2'S Complement Binary
    • Binary, Complementary Binary
    • Binary, Complementary Binary, Offset Binary, 2's Complement Binary, 1's Complement Binary, Modified 1's Complement Binary
    • Binary, Offset Binary
    • Binary, Offset Binary, 2's Complentary Binary
    • Binary,Offset Binary
    • Complementary Binary
    • Complementary Binary Coded Decimal
    • Complementary Binary, Complementary Offset Binary
    • Offset Binary
    • Offset Binary, 2's Complement Binary
    • Signed Magnitude
Reset All
Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

DAC870VL/MIL

Texas Instruments

Digital to Analog Converter

Military

No Lead

28

QCCN

Square

Ceramic

Yes

1

Bipolar

38535Q/M;38534H;883B

12

7 µs

60 mA

0.012 %

15 V

±15 V

-15 V

Chip Carrier

LCC28,.45SQ

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

Complementary Binary, Complementary Offset Binary

5962-9091102MXA

Analog Devices

Digital to Analog Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

Bipolar

38535Q/M;38534H;883B

12

183 mA

0.042 %

-5.2 V

-5.2 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead - hot dipped

Dual

R-XDIP-T28

No

e0

Binary

5962-9306201M3A

Analog Devices

Digital to Analog Converter

Military

No Lead

28

QCCN

Square

Ceramic

Yes

1

38535Q/M;38534H;883B

10

290 mA

0.2 %

-5.2 V

-5.2 V

Chip Carrier

LCC28,.45SQ

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N28

No

Binary

AD9700SEB

Analog Devices

Digital to Analog Converter

Military

No Lead

28

QCCN

Square

Ceramic

Yes

1

Bipolar

MIL-STD-883 Class B (Modified)

8

12 ns

155 mA

0.2 %

-5.2 V

-5.2 V

Chip Carrier

LCC28,.45SQ

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQCC-N28

No

e0

Complementary Binary

AD7848LP

Analog Devices

Digital to Analog Converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

1

BICMOS

12

4 µs

13 mA

0.012 %

5 V

±5 V

-5 V

Chip Carrier

LDCC28,.5SQ

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J28

No

e0

2's Complement

DAC8408HP

Analog Devices

Digital to Analog Converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

4

CMOS

8

250 ns

1.5 mA

0.19 %

5 V

5 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

Binary

5962-9306202MXA

Analog Devices

Digital to Analog Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

38535Q/M;38534H;883B

10

300 mA

0.2 %

5,-5.2 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T28

No

Binary

AD9707ARUZ

Analog Devices

Digital to Analog Converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

14

1.8/3.3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G28

No

Binary, 2'S Complement Binary

5962-01-345-1141

Analog Devices

Digital to Analog Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

4

Hybrid

38535Q/M;38534H;883B

12

15 µs

28 mA

0.024 %

15 V

±15 V

-15 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T28

No

Offset Binary

5962-01-388-9645

Analog Devices

Digital to Analog Converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

1

BICMOS

14

1.5 µs

4 mA

0.006 %

12/15,GND/-0.3 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T28

No

Offset Binary

DS4201

Analog Devices

Digital to Analog Converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

2

16

3.3,3.3/5 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

No

e0

2's Complement

DAC8408HPC

Analog Devices

Digital to Analog Converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

4

CMOS

8

250 ns

1.5 mA

0.19 %

5 V

5 V

Chip Carrier

LDCC28,.5SQ

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J28

No

e0

Binary

PMADV476KN35

Analog Devices

Digital to Analog Converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

6

220 mA

0.78 %

5 V

5 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

AD396TD/883B

Analog Devices

Digital to Analog Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

4

Hybrid

38535Q/M;38534H;883B

14

28 mA

0.012 %

15 V

±15 V

-15 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

Offset Binary

5962-9091101M3A

Analog Devices

Digital to Analog Converter

Military

No Lead

28

QCCN

Square

Ceramic

Yes

1

Bipolar

38535Q/M;38534H;883B

12

183 mA

0.049 %

-5.2 V

-5.2 V

Chip Carrier

LCC28,.45SQ

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead - hot dipped

Quad

S-XQCC-N28

No

e0

Binary

AD7848SQ

Analog Devices

Digital to Analog Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

BICMOS

12

4 µs

13 mA

0.024 %

5 V

±5 V

-5 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

2's Complement

AD79015JP

Analog Devices

Digital to Analog Converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

3 V

BICMOS

12

5 V

±5 V

-5 V

Chip Carrier

LDCC28,.5SQ

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J28

No

e0

AD395SD/883B

Analog Devices

Digital to Analog Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

4

Hybrid

38535Q/M;38534H;883B

12

35 mA

0.018 %

15 V

±15 V

-15 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

Binary

AD7845SE

Analog Devices

Digital to Analog Converter

Military

No Lead

28

QCCN

Square

Ceramic

Yes

1

BICMOS

12

5 µs

10 mA

0.048 %

15 V

±15 V

-15 V

Chip Carrier

LCC28,.45SQ

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQCC-N28

No

e0

Binary, Offset Binary

AD7845UE

Analog Devices

Digital to Analog Converter

Military

No Lead

28

QCCN

Square

Ceramic

Yes

1

BICMOS

12

5 µs

10 mA

15 V

±15 V

-15 V

Chip Carrier

LCC28,.45SQ

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQCC-N28

No

e0

Binary, Offset Binary

AD7242JR-REEL

Analog Devices

Digital to Analog Converter

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

2

BICMOS

12

3 µs

27 mA

0.024 %

5 V

±5 V

-5 V

Small Outline

SOP28,.4

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G28

No

e0

2's Complement

5962-01-360-2949

Analog Devices

Digital to Analog Converter

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic

No

4

Hybrid

12

15 µs

28 mA

0.012 %

15 V

±15 V

-15 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T28

No

Offset Binary

AD7242KR-REEL

Analog Devices

Digital to Analog Converter

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

2

BICMOS

12

3 µs

27 mA

0.012 %

5 V

±5 V

-5 V

Small Outline

SOP28,.4

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G28

No

e0

2's Complement

AD395TD/883B

Analog Devices

Digital to Analog Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

4

Hybrid

38535Q/M;38534H;883B

12

35 mA

0.012 %

15 V

±15 V

-15 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

Binary

PMADV476KN66

Analog Devices

Digital to Analog Converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

6

220 mA

0.78 %

5 V

5 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

AD7845TE

Analog Devices

Digital to Analog Converter

Military

No Lead

28

QCCN

Square

Ceramic

Yes

1

BICMOS

12

5 µs

10 mA

0.024 %

15 V

±15 V

-15 V

Chip Carrier

LCC28,.45SQ

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQCC-N28

No

e0

Binary, Offset Binary

5962-9091103M3A

Analog Devices

Digital to Analog Converter

Military

No Lead

28

QCCN

Square

Ceramic

Yes

1

Bipolar

38535Q/M;38534H;883B

12

188 mA

0.049 %

5,-5.2 V

Chip Carrier

LCC28,.45SQ

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead - hot dipped

Quad

S-XQCC-N28

No

e0

Binary

5962-01-433-9163

Analog Devices

Digital to Analog Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

Bipolar

38535Q/M;38534H;883B

12

188 mA

0.049 %

5,-5.2 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T28

No

Binary

5962-01-433-1692

Analog Devices

Digital to Analog Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

Bipolar

38535Q/M;38534H;883B

12

183 mA

0.049 %

-5.2 V

-5.2 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T28

No

Binary

AD7535BD/+

Analog Devices

Digital to Analog Converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

BICMOS

14

1.5 µs

4 mA

0.006 %

12/15,GND/-0.3 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T28

e0

Binary, Offset Binary

DAC8408BTMDX

Analog Devices

Digital to Analog Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

4

CMOS

38535Q/M;38534H;883B

8

5 V

5 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

Binary

DAC8408ATMDX

Analog Devices

Digital to Analog Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

4

CMOS

38535Q/M;38534H;883B

8

5 V

5 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

Binary

DAC8408ATMDB

Analog Devices

Digital to Analog Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

4

CMOS

38535Q/M;38534H;883B

8

5 V

5 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

Binary

LT2428IG

Analog Devices

Analog to Digital Converter, Delta-sigma

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

8

Yes

5.5 V

1

20

5 V

Small Outline, Shrink Pitch

SOP28,.3

2.7 V

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G28

0.078 in (1.99 mm)

0.208 in (5.29 mm)

245 °C (473 °F)

0.402 in (10.2 mm)

AD7845LP

Analog Devices

Digital to Analog Converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

1

BICMOS

12

5 µs

10 mA

15 V

±15 V

-15 V

Chip Carrier

LDCC28,.5SQ

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J28

No

e0

Binary, Offset Binary

AD7848LN

Analog Devices

Digital to Analog Converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

1

BICMOS

12

4 µs

13 mA

0.012 %

5 V

±5 V

-5 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

2's Complement

LT2428CG

Analog Devices

Analog to Digital Converter, Delta-sigma

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

8

Yes

5.5 V

1

20

5 V

Small Outline, Shrink Pitch

SOP28,.3

2.7 V

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDSO-G28

0.078 in (1.99 mm)

0.208 in (5.29 mm)

245 °C (473 °F)

0.402 in (10.2 mm)

V62/12663-01XB

Analog Devices

Digital to Analog Converter

Military

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

Yes

4

CMOS

16

9 μA

0.0022 %

3/5 V

Small Outline, Shrink Pitch

SSOP28,.3

0.025 in (0.635 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-PDSO-G28

Binary

AD396SD/883B

Analog Devices

Digital to Analog Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

4

Hybrid

38535Q/M;38534H;883B

14

28 mA

0.024 %

15 V

±15 V

-15 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

Offset Binary

DAC8408BTMDA

Analog Devices

Digital to Analog Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

4

CMOS

38535Q/M;38534H;883B

8

5 V

5 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

Binary

AD1864P-K

Analog Devices

Digital to Analog Converter

Other

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

18

28 mA

5 V

±5 V

-5 V

Chip Carrier

LDCC28,.5SQ

0.05 in (1.27 mm)

70 °C (158 °F)

-25 °C (-13 °F)

Tin/Lead

Quad

S-PQCC-J28

No

e0

2's Complement

AD7535SD/883B

Analog Devices

Digital to Analog Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

BICMOS

38535Q/M;38534H;883B

14

1.5 µs

4 mA

0.012 %

12/15,GND/-0.3 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

Binary, Offset Binary

AD9762AR-REEL

Analog Devices

Digital to Analog Converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

0.097 %

5 V

5 V

Small Outline

SOP28,.4

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

No

e0

240 °C (464 °F)

Binary

DAC8408BTMDB

Analog Devices

Digital to Analog Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

4

CMOS

38535Q/M;38534H;883B

8

5 V

5 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

Binary

5962-01-418-7214

Analog Devices

Digital to Analog Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

4

Hybrid

38535Q/M;38534H;883B

12

15 µs

28 mA

0.024 %

15 V

±15 V

-15 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T28

No

Offset Binary

AD9707ARUZRL7

Analog Devices

Digital to Analog Converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

14

1.8/3.3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G28

No

Binary, 2'S Complement Binary

AD5342BRUZ-REEL7

Analog Devices

Digital to Analog Converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

Yes

2

CMOS

12

10 µs

450 μA

0.39 %

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

0.025 in (0.635 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G28

1

No

e3

30 s

260 °C (500 °F)

Binary

DAC8408ATMDA

Analog Devices

Digital to Analog Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

4

CMOS

38535Q/M;38534H;883B

8

5 V

5 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

Binary
Other Function Converters

Other function converters are specialized electronic devices that perform signal conversion and processing for specific applications. These converters are designed to provide a specific function or task, such as frequency-to-voltage conversion, voltage-to-frequency conversion, or power-to-frequency conversion.

Frequency-to-voltage converters (FVCs) are electronic devices that convert an input frequency signal into an output voltage signal. FVCs are used in applications such as tachometers, speedometers, and frequency counters. Voltage-to-frequency converters (VFCs) are electronic devices that convert an input voltage signal into an output frequency signal. VFCs are used in applications such as waveform generators, signal conditioning circuits, and measurement systems.

Power-to-frequency converters (PFCs) are electronic devices that convert an input power signal into an output frequency signal. PFCs are used in applications such as power monitoring, energy harvesting, and renewable energy systems.

Other function converters may include specialized converters, such as temperature-to-frequency converters, current-to-frequency converters, or phase-locked loop (PLL) frequency synthesizers. These converters are designed to perform specific signal conversion and processing tasks, depending on the application and the required performance.