DIP Other Function Converters 291

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Manufacturers
    • Ams Ag
    • Analog Devices
    • Bias Power
    • Broadcom
    • Diodes Incorporated
    • Dymec
    • General Electric Solid State
    • Infineon Technologies
    • Maxim Integrated
    • Murata Manufacturing
    • NXP Semiconductors
    • New Japan Radio
    • Onsemi
    • Renesas Electronics
    • STMicroelectronics
    • Samsung
    • Telcom Semiconductor
    • Texas Instruments
    • Thine Electronics
    • Toshiba
    • XP Power
Converter Type
    • Analog to Digital Converter
    • Analog to Digital Converter, Delta-sigma
    • Converter
    • Digital to Analog Converter
Temperature Grade
    • Automotive
    • Commercial
    • Commercial Extended
    • Industrial
    • Military
    • Other
Terminal Form
    • Ball
    • Gull Wing
    • J Bend
    • No Lead
    • Through-Hole
No. of Terminals
    • 10
    • 100
    • 105
    • 112
    • 12
    • 14
    • 144
    • 16
    • 160
    • 18
    • 20
    • 22
    • 24
    • 28
    • 30
    • 32
    • 36
    • 38
    • 40
    • 42
    • 44
    • 48
    • 5
    • 56
    • 6
    • 64
    • 68
    • 72
    • 8
    • 80
    • 84
Package Code (1)
    • DIP
    • FBGA
    • HVQCCN
    • QCCJ
    • QCCN
    • QFP
    • SDIP
    • SON
    • SOP
    • SSOP
    • TSOP
    • TSSOP
Package Shape
    • Rectangular
    • Square
Package Body Material
    • Ceramic
    • Metal
    • Plastic/Epoxy
No. of Analog In Channels
    • 1
    • 10
    • 2
    • 3
    • 6
    • 8
Surface Mount
    • No
    • Yes
Maximum Supply Voltage
    • 12 V
    • 4.25 V
    • 5.5 V
Maximum Analog Input Voltage
    • 3 V
    • 3.6 V
    • 5.3 V
No. of Functions
    • 1
    • 12
    • 2
    • 3
    • 32
    • 4
    • 8
Technology
    • BICMOS
    • Bipolar
    • CMOS
    • Hybrid
    • MOS
Screening Level
    • 38535Q/M;38534H;883B
    • 38535V;38534K;883S
    • AEC-Q100
    • MIL-STD-883 Class B (Modified)
No. of Bits
    • 10
    • 11
    • 12
    • 14
    • 16
    • 18
    • 20
    • 24
    • 4
    • 5
    • 6
    • 8
Maximum Settling Time
    • 0.1 ns
    • 1 µs
    • 1.5 µs
    • 10 ns
    • 10 µs
    • 100 ns
    • 110 ns
    • 12 ns
    • 120 ns
    • 135 ns
    • 15 µs
    • 150 ns
    • 150 µs
    • 18 ns
    • 18 µs
    • 2 µs
    • 20 ns
    • 20 µs
    • 200 ns
    • 25 ns
    • 250 ns
    • 28 ns
    • 28.5 ns
    • 3 µs
    • 300 ns
    • 300 µs
    • 350 ns
    • 375 ns
    • 4 µs
    • 4.5 µs
    • 40 ns
    • 400 ns
    • 5 µs
    • 500 ns
    • 6 ns
    • 600 ns
    • 7 µs
    • 7.4 ns
    • 8 ns
    • 8 µs
    • 800 ns
    • 9 µs
    • 900 ns
Maximum Supply Current
    • 1 mA
    • 1.2 mA
    • 1.4 mA
    • 1.5 mA
    • 1.8 mA
    • 10 mA
    • 10 μA
    • 100 μA
    • 105 mA
    • 11.6 mA
    • 11.69 mA
    • 12 mA
    • 125 μA
    • 13 mA
    • 15 mA
    • 15.5 mA
    • 150 mA
    • 155 mA
    • 16 mA
    • 160 mA
    • 18 mA
    • 183 mA
    • 188 mA
    • 2 mA
    • 2.5 mA
    • 2.6 mA
    • 2.7 mA
    • 20 mA
    • 220 mA
    • 23 mA
    • 230 μA
    • 24 mA
    • 25 mA
    • 250 mA
    • 26.3 mA
    • 260 μA
    • 27 mA
    • 275 mA
    • 28 mA
    • 280 μA
    • 290 mA
    • 3 mA
    • 3.2 mA
    • 3.5 mA
    • 300 mA
    • 330 mA
    • 340 mA
    • 35 mA
    • 358 mA
    • 391 mA
    • 4 mA
    • 40 mA
    • 400 μA
    • 410 μA
    • 42 mA
    • 450 μA
    • 49 mA
    • 5 mA
    • 5.2 mA
    • 5.6 mA
    • 50 mA
    • 580 mA
    • 6 mA
    • 60 mA
    • 600 μA
    • 65 mA
    • 700 μA
    • 72 mA
    • 8.33 mA
    • 80 mA
    • 85 mA
    • 9 μA
    • 9.3 mA
    • 900 μA
Maximum Linearity Error (EL)
    • 0.0003 %
    • 0.0012 %
    • 0.0022 %
    • 0.003 %
    • 0.006 %
    • 0.0061 %
    • 0.01 %
    • 0.012 %
    • 0.0125 %
    • 0.015 %
    • 0.017 %
    • 0.018 %
    • 0.02 %
    • 0.024 %
    • 0.03 %
    • 0.032 %
    • 0.036 %
    • 0.042 %
    • 0.048 %
    • 0.049 %
    • 0.05 %
    • 0.06 %
    • 0.097 %
    • 0.0976 %
    • 0.098 %
    • 0.1 %
    • 0.12 %
    • 0.15 %
    • 0.19 %
    • 0.195 %
    • 0.2 %
    • 0.2148 %
    • 0.24 %
    • 0.31 %
    • 0.39 %
    • 0.4 %
    • 0.429 %
    • 0.45 %
    • 0.58 %
    • 0.59 %
    • 0.78 %
    • 0.8 %
    • 0.9 %
    • 0.98 %
    • 1.17 %
    • 1.61 %
    • 3.9 %
Input Format
    • Parallel, 8 Bits
Nominal Supply Voltage
    • 1.8 V
    • 12 V
    • 15 V
    • 3 V
    • 3.3 V
    • 5 V
Power Supplies (V)
    • -15 V
    • -3,3/5,5,8 V
    • -4,5,10 V
    • -5.2 V
    • 1,3.3 V
    • 1.8,1.8/3.3 V
    • 1.8,3.3 V
    • 1.8/3.3 V
    • 1.8/3.6 V
    • 12 V
    • 12/15 V
    • 12/15, GND/-5 V
    • 12/15,-0.3 V
    • 12/15,-5 V
    • 12/15,GND/-0.3 V
    • 12/15,GND/-12/-15 V
    • 15 V
    • 2.5/5.5 V
    • 2.7/5,5 V
    • 2/5,3/5 V
    • 3 V
    • 3,5 V
    • 3.3 V
    • 3.3,3.3/5 V
    • 3.3,5 V
    • 3/3.3 V
    • 3/3.3,-7.5,15 V
    • 3/5 V
    • 3/5,5 V
    • 3/5,5,10.5 V
    • 3/5,±12/±15 V
    • 3/5,±12/±16.5 V
    • 5 V
    • 5,-12 V
    • 5,-15 V
    • 5,-5.2 V
    • 5,13 V
    • 5,15 V
    • 5,±12/±15 V
    • 5,±15 V
    • 5/15 V
    • 5/15,-15 V
    • 5/±5 V
    • ±10/±15 V
    • ±12/±15 V
    • ±15 V
    • ±5 V
    • ±5,3/5 V
Nominal Negative Supply Voltage
    • -15 V
    • -5 V
    • -5.2 V
Package Style (Meter)
    • Chip Carrier
    • Chip Carrier, Heat Sink/Slug, Very Thin Profile
    • Flatpack
    • Grid Array, Fine Pitch
    • In-Line
    • In-Line, Shrink Pitch
    • Small Outline
    • Small Outline, Shrink Pitch
    • Small Outline, Thin Profile
    • Small Outline, Thin Profile, Shrink Pitch
Package Equivalence Code
    • BGA105,11X11,25
    • BGA12,3X4,20
    • DIE OR CHIP
    • DIP14,.3
    • DIP16,.3
    • DIP18,.3
    • DIP20,.3
    • DIP22,.3
    • DIP22,.4
    • DIP24(UNSPEC)
    • DIP24,.3
    • DIP24,.4
    • DIP24,.6
    • DIP28,.6
    • DIP30,1.8
    • DIP32,.9
    • DIP40,.6
    • DIP42,.6
    • DIP8,.3
    • LCC16,.12SQ,20
    • LCC20,.35SQ
    • LCC28,.45SQ
    • LCC32,.2SQ,20
    • LCC36,.25SQ,20
    • LCC40,.24SQ,20
    • LCC48,.27SQ,20
    • LCC56,.31SQ,20
    • LCC64,.35SQ,20
    • LCC68,.4SQ,20
    • LCC72,.39SQ,20
    • LDCC20,.4SQ
    • LDCC28,.5SQ
    • LDCC44,.7SQ
    • LDCC84,1.2SQ
    • QFP144,1.2SQ
    • QFP160,1.2SQ
    • QFP44,.5SQ,32
    • QFP48,.35SQ,20
    • QFP48,.5X.66,32
    • QFP64,.47SQ,20
    • QFP64,.7X.95,40
    • QFP80,.55SQ,20
    • SDIP24,.3
    • SDIP28,.4
    • SDIP30,.4
    • SOLCC10,.08,20
    • SOLCC10,.11,20
    • SOLCC10,.12,20
    • SOLCC14,.12,20
    • SOLCC8,.12,25
    • SOP16,.25
    • SOP16,.3
    • SOP16,.4
    • SOP20,.3
    • SOP20,.4
    • SOP24,.3
    • SOP24,.3,32
    • SOP24,.4
    • SOP28,.3
    • SOP28,.4
    • SOP28,.5
    • SOP36,.3,32
    • SOP8,.25
    • SSOP16,.25
    • SSOP20,.25
    • SSOP24,.3
    • SSOP28,.3
    • TQFP100,.63SQ
    • TQFP32,.35SQ,32
    • TQFP48,.35SQ
    • TQFP64,.47SQ
    • TQFP64,.63SQ,32
    • TQFP80,.55SQ
    • TSOP5/6,.11,37
    • TSOP6,.11,37
    • TSSOP10,.19,20
    • TSSOP14,.25
    • TSSOP16,.19,20
    • TSSOP16,.25
    • TSSOP20,.25
    • TSSOP28,.25
    • TSSOP38,.25,20
    • TSSOP6,.08
    • TSSOP8,.1
    • TSSOP8,.19
    • TSSOP8,.25
    • WAFER
Minimum Supply Voltage
    • 2.7 V
    • 3 V
    • 4.75 V
Terminal Pitch
    • 0.02 in (0.5 mm)
    • 0.025 in (0.635 mm)
    • 0.026 in (0.65 mm)
    • 0.031 in (0.8 mm)
    • 0.037 in (0.95 mm)
    • 0.039 in (1 mm)
    • 0.05 in (1.27 mm)
    • 0.07 in (1.78 mm)
    • 0.1 in (2.54 mm)
Maximum Operating Temperature
    • 105 °C (221 °F)
    • 115 °C (239 °F)
    • 125 °C (257 °F)
    • 25 °C (77 °F)
    • 60 °C (140 °F)
    • 70 °C (158 °F)
    • 80 °C (176 °F)
    • 85 °C (185 °F)
Minimum Operating Temperature
    • -10 °C (14 °F)
    • -15 °C (5 °F)
    • -20 °C (-4 °F)
    • -25 °C (-13 °F)
    • -30 °C (-22 °F)
    • -40 °C (-40 °F)
    • -55 °C (-67 °F)
    • 0 °C (32 °F)
    • 25 °C (77 °F)
Terminal Finish
    • Gold
    • Matte Tin
    • Matte Tin - annealed
    • Nickel Gold Palladium Silver
    • Nickel Palladium Gold
    • Tin Bismuth
    • Tin Lead
    • Tin Silver Copper
    • Tin Silver Copper Nickel
    • Tin/Lead
    • Tin/Lead (Sn63Pb37)
    • Tin/Lead (Sn85Pb15)
    • Tin/Lead - hot dipped
    • Tin/Silver
Terminal Position
    • Bottom
    • Dual
    • Quad
JESD-30 Code
    • R-MDIP-T24
    • R-MDIP-T32
    • R-PBGA-B12
    • R-PDIP-T14
    • R-PDIP-T16
    • R-PDIP-T20
    • R-PDIP-T22
    • R-PDIP-T24
    • R-PDIP-T28
    • R-PDIP-T30
    • R-PDIP-T40
    • R-PDIP-T42
    • R-PDIP-T8
    • R-PDSO-G10
    • R-PDSO-G14
    • R-PDSO-G16
    • R-PDSO-G20
    • R-PDSO-G24
    • R-PDSO-G28
    • R-PDSO-G36
    • R-PDSO-G38
    • R-PDSO-G5
    • R-PDSO-G6
    • R-PDSO-G8
    • R-PDSO-N10
    • R-PDSO-N14
    • R-PDSO-N8
    • R-PQFP-G48
    • R-PQFP-G64
    • R-XDIP-T14
    • R-XDIP-T16
    • R-XDIP-T18
    • R-XDIP-T20
    • R-XDIP-T22
    • R-XDIP-T24
    • R-XDIP-T28
    • R-XDIP-T30
    • R-XDIP-T32
    • R-XDIP-T40
    • S-MQFP-G160
    • S-PBGA-B105
    • S-PBGA-B112
    • S-PQCC-J20
    • S-PQCC-J28
    • S-PQCC-J44
    • S-PQCC-J84
    • S-PQCC-N16
    • S-PQCC-N32
    • S-PQCC-N36
    • S-PQCC-N40
    • S-PQCC-N48
    • S-PQCC-N56
    • S-PQCC-N64
    • S-PQCC-N68
    • S-PQCC-N72
    • S-PQFP-G100
    • S-PQFP-G160
    • S-PQFP-G32
    • S-PQFP-G44
    • S-PQFP-G48
    • S-PQFP-G64
    • S-PQFP-G80
    • S-XQCC-N16
    • S-XQCC-N20
    • S-XQCC-N28
    • S-XQFP-G144
    • X-PQFP-G80
Moisture Sensitivity Level (MSL)
    • 1
    • 3
Maximum Seated Height
    • 0.039 in (1 mm)
    • 0.078 in (1.99 mm)
    • 0.096 in (2.45 mm)
Width
    • 0.049 in (1.25 mm)
    • 0.118 in (3 mm)
    • 0.208 in (5.29 mm)
    • 0.394 in (10 mm)
Qualification
    • No
JESD-609 Code
    • e0
    • e1
    • e2
    • e3
    • e4
    • e6
Maximum Time At Peak Reflow Temperature (s)
    • 10 s
    • 20 s
    • 30 s
    • 40 s
Peak Reflow Temperature (C)
    • 240 °C (464 °F)
    • 245 °C (473 °F)
    • 260 °C (500 °F)
Length
    • 0.079 in (2 mm)
    • 0.118 in (3 mm)
    • 0.394 in (10 mm)
    • 0.402 in (10.2 mm)
Input Bit Code
    • 2's Complement
    • Binary
    • Binary Coded Decimal
    • Binary, 2'S Complement Binary
    • Binary, Complementary Binary
    • Binary, Complementary Binary, Offset Binary, 2's Complement Binary, 1's Complement Binary, Modified 1's Complement Binary
    • Binary, Offset Binary
    • Binary, Offset Binary, 2's Complentary Binary
    • Binary,Offset Binary
    • Complementary Binary
    • Complementary Binary Coded Decimal
    • Complementary Binary, Complementary Offset Binary
    • Offset Binary
    • Offset Binary, 2's Complement Binary
    • Signed Magnitude
Reset All
Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD7541SQ/883

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

1 µs

2 mA

0.024 %

15 V

15 V

In-Line

DIP18,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

AD7521SQ/883

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 mA

0.2 %

15 V

15 V

In-Line

DIP18,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

AD7541ABD

Maxim Integrated

Digital to Analog Converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 mA

0.012 %

15 V

15 V

In-Line

DIP18,.3

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T18

e0

Binary, Offset Binary

AD7543SQ/883

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

2.5 mA

0.024 %

5 V

5 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary

MAX530AMRG

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

12

0.024 %

5/±5 V

In-Line

DIP24(UNSPEC)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

e0

20 s

240 °C (464 °F)

Binary, Offset Binary

AD7541AAD

Maxim Integrated

Digital to Analog Converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 mA

0.024 %

15 V

15 V

In-Line

DIP18,.3

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T18

e0

Binary, Offset Binary

AD7541TQ/883

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

1 µs

2 mA

0.012 %

15 V

15 V

In-Line

DIP18,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

AD7542GTQ/883

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

2.5 mA

0.012 %

5 V

5 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary

MX7524JN+2

Maxim Integrated

Digital to Analog Converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

8

500 ns

2 mA

0.2 %

5/15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T16

No

e3

Binary, Offset Binary

AD7520UQ/883

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

10

2 mA

0.05 %

15 V

15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

MAX530BMRG

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

12

0.048 %

5/±5 V

In-Line

DIP24(UNSPEC)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

e0

20 s

240 °C (464 °F)

Binary, Offset Binary

AD7543TQ/883

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

2.5 mA

0.012 %

5 V

5 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary

AD7543GTQ/883

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

2.5 mA

0.012 %

5 V

5 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary

AD7524UQ/883

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

8

500 ns

2 mA

0.05 %

5/15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

MX7528KN+4

Maxim Integrated

Digital to Analog Converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

2

CMOS

8

400 ns

1 mA

0.2 %

5/15 V

In-Line

DIP20,.3

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T20

e3

Binary, Offset Binary

MX7528LN-4

Maxim Integrated

Digital to Analog Converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

2

CMOS

8

400 ns

1 mA

0.2 %

5/15 V

In-Line

DIP20,.3

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T20

e0

Binary, Offset Binary

UPD6335C

Renesas Electronics

Digital to Analog Converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

4

CMOS

6

10 µs

5,15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDIP-T16

No

e0

M62353P#TF0J

Renesas Electronics

Digital to Analog Converter

Other

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

8

CMOS

8

300 µs

2.5 mA

0.59 %

5 V

5 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Dual

R-PDIP-T16

No

Binary

M62334P#TF5J

Renesas Electronics

Digital to Analog Converter

Other

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

No

4

CMOS

8

3 mA

0.58 %

5 V

5 V

In-Line

DIP8,.3

0.1 in (2.54 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Dual

R-PDIP-T8

No

Binary

HI3-562A-5

Renesas Electronics

Digital to Analog Converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

12

5,-15 V

In-Line

DIP24,.6

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T24

No

e0

Binary, Offset Binary

UPD6901C

Renesas Electronics

Digital to Analog Converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

6

50 mA

0.78 %

5 V

5 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

70 °C (158 °F)

-20 °C (-4 °F)

Tin/Lead

Dual

R-PDIP-T16

No

e0

Binary

UPC624D

Renesas Electronics

Digital to Analog Converter

Commercial Extended

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

Bipolar

8

150 ns

11.6 mA

0.19 %

15 V

±15 V

-15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

80 °C (176 °F)

-20 °C (-4 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

UPC610D

Renesas Electronics

Digital to Analog Converter

Commercial Extended

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

Bipolar

11

15 V

±15 V

-15 V

In-Line

DIP18,.3

0.1 in (2.54 mm)

80 °C (176 °F)

-20 °C (-4 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

Binary

M62399FP#DF0Q

Renesas Electronics

Digital to Analog Converter

Other

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

8

CMOS

8

0.59 %

5,13 V

In-Line

DIP20,.3

0.1 in (2.54 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Dual

R-PDIP-T20

No

Binary

UPC603D

Renesas Electronics

Digital to Analog Converter

Commercial Extended

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

Bipolar

6

In-Line

DIP18,.3

0.1 in (2.54 mm)

80 °C (176 °F)

-20 °C (-4 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

AD7523SD/HR

Renesas Electronics

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

MIL-STD-883 Class B (Modified)

8

200 ns

2.5 mA

0.2 %

15 V

15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

HI-565ATD/BIN/883B

Renesas Electronics

Digital to Analog Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

MIL-STD-883 Class B (Modified)

12

500 ns

15.5 mA

0.01 %

15 V

±15 V

-15 V

In-Line

DIP24,.6

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

Binary, Offset Binary, 2's Complentary Binary

UPD6900C

Renesas Electronics

Digital to Analog Converter

Commercial

Through-Hole

22

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

8

50 mA

0.39 %

5 V

5 V

In-Line

DIP22,.4

0.1 in (2.54 mm)

70 °C (158 °F)

-20 °C (-4 °F)

Tin/Lead

Dual

R-PDIP-T22

No

e0

Binary

UPD6221CX

Renesas Electronics

Digital to Analog Converter

Other

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

8

CMOS

8

0.31 %

5 V

5 V

In-Line

DIP20,.3

0.1 in (2.54 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Tin/Lead

Dual

R-PDIP-T20

No

e0

Binary

AD7523UD/HR

Renesas Electronics

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

MIL-STD-883 Class B (Modified)

8

200 ns

2.5 mA

0.05 %

15 V

15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

HI-565ASD/BIN/883B

Renesas Electronics

Digital to Analog Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

MIL-STD-883 Class B (Modified)

12

500 ns

15.5 mA

0.02 %

15 V

±15 V

-15 V

In-Line

DIP24,.6

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

Binary, Offset Binary, 2's Complentary Binary

HI-565ATD/BIN

Renesas Electronics

Digital to Analog Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

12

250 ns

15 V

±15 V

-15 V

In-Line

DIP24,.6

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

Binary, Offset Binary

UPC624C

Renesas Electronics

Digital to Analog Converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

8

150 ns

11.6 mA

0.19 %

15 V

±15 V

-15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

70 °C (158 °F)

-20 °C (-4 °F)

Tin/Lead

Dual

R-PDIP-T16

No

e0

Binary, Offset Binary

HI1-5685AI-4

Renesas Electronics

Digital to Analog Converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

12

0.012 %

5,±12/±15 V

In-Line

DIP24,.6

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-XDIP-T24

No

Complementary Binary, Complementary Offset Binary

HI1-5687I-8

Renesas Electronics

Digital to Analog Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

38535Q/M;38534H;883B

12

0.018 %

5,±12/±15 V

In-Line

DIP24,.6

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

Complementary Binary, Complementary Offset Binary

HI1-565AJD

Renesas Electronics

Digital to Analog Converter

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

12

250 ns

26.3 mA

0.018 %

15 V

±15 V

-15 V

In-Line

DIP24,.6

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

Binary, Offset Binary

HI1-562A-4

Renesas Electronics

Digital to Analog Converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

12

400 ns

23 mA

0.02 %

5,-15 V

In-Line

DIP24,.6

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-XDIP-T24

No

Binary, Offset Binary

HAR1106JCB

Renesas Electronics

Digital to Analog Converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

8

0.195 %

5/±5 V

In-Line

DIP24,.4

0.1 in (2.54 mm)

70 °C (158 °F)

-20 °C (-4 °F)

Tin/Lead

Dual

R-PDIP-T24

No

e0

Binary

UPD6336C

Renesas Electronics

Digital to Analog Converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

8

CMOS

6

10 µs

5,15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDIP-T16

No

e0

HI1-562A-5

Renesas Electronics

Digital to Analog Converter

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

12

400 ns

23 mA

0.02 %

5,-15 V

In-Line

DIP24,.6

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T24

No

Binary, Offset Binary

UPD6902C

Renesas Electronics

Digital to Analog Converter

Commercial

Through-Hole

22

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

8

160 mA

0.39 %

5 V

5 V

In-Line

DIP22,.4

0.1 in (2.54 mm)

70 °C (158 °F)

-20 °C (-4 °F)

Tin/Lead

Dual

R-PDIP-T22

No

e0

Binary

HI-565ATD/883

Renesas Electronics

Digital to Analog Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

38535Q/M;38534H;883B

12

500 ns

15.5 mA

0.01 %

15 V

±15 V

-15 V

In-Line

DIP24,.6

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

Binary, Offset Binary, 2's Complentary Binary

UPD6326C

Renesas Electronics

Digital to Analog Converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

8

CMOS

6

10 ns

5,15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDIP-T16

No

e0

UPD6325C

Renesas Electronics

Digital to Analog Converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

4

CMOS

6

10 µs

5,15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDIP-T16

No

e0

AD7523TD/HR

Renesas Electronics

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

MIL-STD-883 Class B (Modified)

8

200 ns

2.5 mA

0.1 %

15 V

15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T16

No

Binary, Offset Binary

HI1-565AT/883

Renesas Electronics

Digital to Analog Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

38535Q/M;38534H;883B

12

500 ns

15.5 mA

0.01 %

15 V

±15 V

-15 V

In-Line

DIP24,.6

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

Binary, Offset Binary, 2's Complentary Binary

UPD6376CX

Renesas Electronics

Digital to Analog Converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

2

CMOS

16

12 mA

5 V

5 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

70 °C (158 °F)

-20 °C (-4 °F)

Tin/Lead

Dual

R-PDIP-T16

No

e0

HI-565ASD/883

Renesas Electronics

Digital to Analog Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

38535Q/M;38534H;883B

12

500 ns

15.5 mA

0.02 %

15 V

±15 V

-15 V

In-Line

DIP24,.6

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

Binary, Offset Binary, 2's Complentary Binary
Other Function Converters

Other function converters are specialized electronic devices that perform signal conversion and processing for specific applications. These converters are designed to provide a specific function or task, such as frequency-to-voltage conversion, voltage-to-frequency conversion, or power-to-frequency conversion.

Frequency-to-voltage converters (FVCs) are electronic devices that convert an input frequency signal into an output voltage signal. FVCs are used in applications such as tachometers, speedometers, and frequency counters. Voltage-to-frequency converters (VFCs) are electronic devices that convert an input voltage signal into an output frequency signal. VFCs are used in applications such as waveform generators, signal conditioning circuits, and measurement systems.

Power-to-frequency converters (PFCs) are electronic devices that convert an input power signal into an output frequency signal. PFCs are used in applications such as power monitoring, energy harvesting, and renewable energy systems.

Other function converters may include specialized converters, such as temperature-to-frequency converters, current-to-frequency converters, or phase-locked loop (PLL) frequency synthesizers. These converters are designed to perform specific signal conversion and processing tasks, depending on the application and the required performance.