Commercial Other Function Converters 376

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Manufacturers
    • Ams Ag
    • Analog Devices
    • Bias Power
    • Broadcom
    • Diodes Incorporated
    • Dymec
    • General Electric Solid State
    • Infineon Technologies
    • Maxim Integrated
    • Murata Manufacturing
    • NXP Semiconductors
    • New Japan Radio
    • Onsemi
    • Renesas Electronics
    • STMicroelectronics
    • Samsung
    • Telcom Semiconductor
    • Texas Instruments
    • Thine Electronics
    • Toshiba
    • XP Power
Converter Type
    • Analog to Digital Converter
    • Analog to Digital Converter, Delta-sigma
    • Converter
    • Digital to Analog Converter
Temperature Grade (1)
    • Commercial
    • Automotive
    • Commercial Extended
    • Industrial
    • Military
    • Other
Terminal Form
    • Ball
    • Gull Wing
    • J Bend
    • No Lead
    • Through-Hole
No. of Terminals
    • 10
    • 100
    • 105
    • 112
    • 12
    • 14
    • 144
    • 16
    • 160
    • 18
    • 20
    • 22
    • 24
    • 28
    • 30
    • 32
    • 36
    • 38
    • 40
    • 42
    • 44
    • 48
    • 5
    • 56
    • 6
    • 64
    • 68
    • 72
    • 8
    • 80
    • 84
Package Code
    • DIP
    • FBGA
    • HVQCCN
    • QCCJ
    • QCCN
    • QFP
    • SDIP
    • SON
    • SOP
    • SSOP
    • TSOP
    • TSSOP
Package Shape
    • Rectangular
    • Square
Package Body Material
    • Ceramic
    • Metal
    • Plastic/Epoxy
No. of Analog In Channels
    • 1
    • 10
    • 2
    • 3
    • 6
    • 8
Surface Mount
    • No
    • Yes
Maximum Supply Voltage
    • 12 V
    • 4.25 V
    • 5.5 V
Maximum Analog Input Voltage
    • 3 V
    • 3.6 V
    • 5.3 V
No. of Functions
    • 1
    • 12
    • 2
    • 3
    • 32
    • 4
    • 8
Technology
    • BICMOS
    • Bipolar
    • CMOS
    • Hybrid
    • MOS
Screening Level
    • 38535Q/M;38534H;883B
    • 38535V;38534K;883S
    • AEC-Q100
    • MIL-STD-883 Class B (Modified)
No. of Bits
    • 10
    • 11
    • 12
    • 14
    • 16
    • 18
    • 20
    • 24
    • 4
    • 5
    • 6
    • 8
Maximum Settling Time
    • 0.1 ns
    • 1 µs
    • 1.5 µs
    • 10 ns
    • 10 µs
    • 100 ns
    • 110 ns
    • 12 ns
    • 120 ns
    • 135 ns
    • 15 µs
    • 150 ns
    • 150 µs
    • 18 ns
    • 18 µs
    • 2 µs
    • 20 ns
    • 20 µs
    • 200 ns
    • 25 ns
    • 250 ns
    • 28 ns
    • 28.5 ns
    • 3 µs
    • 300 ns
    • 300 µs
    • 350 ns
    • 375 ns
    • 4 µs
    • 4.5 µs
    • 40 ns
    • 400 ns
    • 5 µs
    • 500 ns
    • 6 ns
    • 600 ns
    • 7 µs
    • 7.4 ns
    • 8 ns
    • 8 µs
    • 800 ns
    • 9 µs
    • 900 ns
Maximum Supply Current
    • 1 mA
    • 1.2 mA
    • 1.4 mA
    • 1.5 mA
    • 1.8 mA
    • 10 mA
    • 10 μA
    • 100 μA
    • 105 mA
    • 11.6 mA
    • 11.69 mA
    • 12 mA
    • 125 μA
    • 13 mA
    • 15 mA
    • 15.5 mA
    • 150 mA
    • 155 mA
    • 16 mA
    • 160 mA
    • 18 mA
    • 183 mA
    • 188 mA
    • 2 mA
    • 2.5 mA
    • 2.6 mA
    • 2.7 mA
    • 20 mA
    • 220 mA
    • 23 mA
    • 230 μA
    • 24 mA
    • 25 mA
    • 250 mA
    • 26.3 mA
    • 260 μA
    • 27 mA
    • 275 mA
    • 28 mA
    • 280 μA
    • 290 mA
    • 3 mA
    • 3.2 mA
    • 3.5 mA
    • 300 mA
    • 330 mA
    • 340 mA
    • 35 mA
    • 358 mA
    • 391 mA
    • 4 mA
    • 40 mA
    • 400 μA
    • 410 μA
    • 42 mA
    • 450 μA
    • 49 mA
    • 5 mA
    • 5.2 mA
    • 5.6 mA
    • 50 mA
    • 580 mA
    • 6 mA
    • 60 mA
    • 600 μA
    • 65 mA
    • 700 μA
    • 72 mA
    • 8.33 mA
    • 80 mA
    • 85 mA
    • 9 μA
    • 9.3 mA
    • 900 μA
Maximum Linearity Error (EL)
    • 0.0003 %
    • 0.0012 %
    • 0.0022 %
    • 0.003 %
    • 0.006 %
    • 0.0061 %
    • 0.01 %
    • 0.012 %
    • 0.0125 %
    • 0.015 %
    • 0.017 %
    • 0.018 %
    • 0.02 %
    • 0.024 %
    • 0.03 %
    • 0.032 %
    • 0.036 %
    • 0.042 %
    • 0.048 %
    • 0.049 %
    • 0.05 %
    • 0.06 %
    • 0.097 %
    • 0.0976 %
    • 0.098 %
    • 0.1 %
    • 0.12 %
    • 0.15 %
    • 0.19 %
    • 0.195 %
    • 0.2 %
    • 0.2148 %
    • 0.24 %
    • 0.31 %
    • 0.39 %
    • 0.4 %
    • 0.429 %
    • 0.45 %
    • 0.58 %
    • 0.59 %
    • 0.78 %
    • 0.8 %
    • 0.9 %
    • 0.98 %
    • 1.17 %
    • 1.61 %
    • 3.9 %
Input Format
    • Parallel, 8 Bits
Nominal Supply Voltage
    • 1.8 V
    • 12 V
    • 15 V
    • 3 V
    • 3.3 V
    • 5 V
Power Supplies (V)
    • -15 V
    • -3,3/5,5,8 V
    • -4,5,10 V
    • -5.2 V
    • 1,3.3 V
    • 1.8,1.8/3.3 V
    • 1.8,3.3 V
    • 1.8/3.3 V
    • 1.8/3.6 V
    • 12 V
    • 12/15 V
    • 12/15, GND/-5 V
    • 12/15,-0.3 V
    • 12/15,-5 V
    • 12/15,GND/-0.3 V
    • 12/15,GND/-12/-15 V
    • 15 V
    • 2.5/5.5 V
    • 2.7/5,5 V
    • 2/5,3/5 V
    • 3 V
    • 3,5 V
    • 3.3 V
    • 3.3,3.3/5 V
    • 3.3,5 V
    • 3/3.3 V
    • 3/3.3,-7.5,15 V
    • 3/5 V
    • 3/5,5 V
    • 3/5,5,10.5 V
    • 3/5,±12/±15 V
    • 3/5,±12/±16.5 V
    • 5 V
    • 5,-12 V
    • 5,-15 V
    • 5,-5.2 V
    • 5,13 V
    • 5,15 V
    • 5,±12/±15 V
    • 5,±15 V
    • 5/15 V
    • 5/15,-15 V
    • 5/±5 V
    • ±10/±15 V
    • ±12/±15 V
    • ±15 V
    • ±5 V
    • ±5,3/5 V
Nominal Negative Supply Voltage
    • -15 V
    • -5 V
    • -5.2 V
Package Style (Meter)
    • Chip Carrier
    • Chip Carrier, Heat Sink/Slug, Very Thin Profile
    • Flatpack
    • Grid Array, Fine Pitch
    • In-Line
    • In-Line, Shrink Pitch
    • Small Outline
    • Small Outline, Shrink Pitch
    • Small Outline, Thin Profile
    • Small Outline, Thin Profile, Shrink Pitch
Package Equivalence Code
    • BGA105,11X11,25
    • BGA12,3X4,20
    • DIE OR CHIP
    • DIP14,.3
    • DIP16,.3
    • DIP18,.3
    • DIP20,.3
    • DIP22,.3
    • DIP22,.4
    • DIP24(UNSPEC)
    • DIP24,.3
    • DIP24,.4
    • DIP24,.6
    • DIP28,.6
    • DIP30,1.8
    • DIP32,.9
    • DIP40,.6
    • DIP42,.6
    • DIP8,.3
    • LCC16,.12SQ,20
    • LCC20,.35SQ
    • LCC28,.45SQ
    • LCC32,.2SQ,20
    • LCC36,.25SQ,20
    • LCC40,.24SQ,20
    • LCC48,.27SQ,20
    • LCC56,.31SQ,20
    • LCC64,.35SQ,20
    • LCC68,.4SQ,20
    • LCC72,.39SQ,20
    • LDCC20,.4SQ
    • LDCC28,.5SQ
    • LDCC44,.7SQ
    • LDCC84,1.2SQ
    • QFP144,1.2SQ
    • QFP160,1.2SQ
    • QFP44,.5SQ,32
    • QFP48,.35SQ,20
    • QFP48,.5X.66,32
    • QFP64,.47SQ,20
    • QFP64,.7X.95,40
    • QFP80,.55SQ,20
    • SDIP24,.3
    • SDIP28,.4
    • SDIP30,.4
    • SOLCC10,.08,20
    • SOLCC10,.11,20
    • SOLCC10,.12,20
    • SOLCC14,.12,20
    • SOLCC8,.12,25
    • SOP16,.25
    • SOP16,.3
    • SOP16,.4
    • SOP20,.3
    • SOP20,.4
    • SOP24,.3
    • SOP24,.3,32
    • SOP24,.4
    • SOP28,.3
    • SOP28,.4
    • SOP28,.5
    • SOP36,.3,32
    • SOP8,.25
    • SSOP16,.25
    • SSOP20,.25
    • SSOP24,.3
    • SSOP28,.3
    • TQFP100,.63SQ
    • TQFP32,.35SQ,32
    • TQFP48,.35SQ
    • TQFP64,.47SQ
    • TQFP64,.63SQ,32
    • TQFP80,.55SQ
    • TSOP5/6,.11,37
    • TSOP6,.11,37
    • TSSOP10,.19,20
    • TSSOP14,.25
    • TSSOP16,.19,20
    • TSSOP16,.25
    • TSSOP20,.25
    • TSSOP28,.25
    • TSSOP38,.25,20
    • TSSOP6,.08
    • TSSOP8,.1
    • TSSOP8,.19
    • TSSOP8,.25
    • WAFER
Minimum Supply Voltage
    • 2.7 V
    • 3 V
    • 4.75 V
Terminal Pitch
    • 0.02 in (0.5 mm)
    • 0.025 in (0.635 mm)
    • 0.026 in (0.65 mm)
    • 0.031 in (0.8 mm)
    • 0.037 in (0.95 mm)
    • 0.039 in (1 mm)
    • 0.05 in (1.27 mm)
    • 0.07 in (1.78 mm)
    • 0.1 in (2.54 mm)
Maximum Operating Temperature
    • 105 °C (221 °F)
    • 115 °C (239 °F)
    • 125 °C (257 °F)
    • 25 °C (77 °F)
    • 60 °C (140 °F)
    • 70 °C (158 °F)
    • 80 °C (176 °F)
    • 85 °C (185 °F)
Minimum Operating Temperature
    • -10 °C (14 °F)
    • -15 °C (5 °F)
    • -20 °C (-4 °F)
    • -25 °C (-13 °F)
    • -30 °C (-22 °F)
    • -40 °C (-40 °F)
    • -55 °C (-67 °F)
    • 0 °C (32 °F)
    • 25 °C (77 °F)
Terminal Finish
    • Gold
    • Matte Tin
    • Matte Tin - annealed
    • Nickel Gold Palladium Silver
    • Nickel Palladium Gold
    • Tin Bismuth
    • Tin Lead
    • Tin Silver Copper
    • Tin Silver Copper Nickel
    • Tin/Lead
    • Tin/Lead (Sn63Pb37)
    • Tin/Lead (Sn85Pb15)
    • Tin/Lead - hot dipped
    • Tin/Silver
Terminal Position
    • Bottom
    • Dual
    • Quad
JESD-30 Code
    • R-MDIP-T24
    • R-MDIP-T32
    • R-PBGA-B12
    • R-PDIP-T14
    • R-PDIP-T16
    • R-PDIP-T20
    • R-PDIP-T22
    • R-PDIP-T24
    • R-PDIP-T28
    • R-PDIP-T30
    • R-PDIP-T40
    • R-PDIP-T42
    • R-PDIP-T8
    • R-PDSO-G10
    • R-PDSO-G14
    • R-PDSO-G16
    • R-PDSO-G20
    • R-PDSO-G24
    • R-PDSO-G28
    • R-PDSO-G36
    • R-PDSO-G38
    • R-PDSO-G5
    • R-PDSO-G6
    • R-PDSO-G8
    • R-PDSO-N10
    • R-PDSO-N14
    • R-PDSO-N8
    • R-PQFP-G48
    • R-PQFP-G64
    • R-XDIP-T14
    • R-XDIP-T16
    • R-XDIP-T18
    • R-XDIP-T20
    • R-XDIP-T22
    • R-XDIP-T24
    • R-XDIP-T28
    • R-XDIP-T30
    • R-XDIP-T32
    • R-XDIP-T40
    • S-MQFP-G160
    • S-PBGA-B105
    • S-PBGA-B112
    • S-PQCC-J20
    • S-PQCC-J28
    • S-PQCC-J44
    • S-PQCC-J84
    • S-PQCC-N16
    • S-PQCC-N32
    • S-PQCC-N36
    • S-PQCC-N40
    • S-PQCC-N48
    • S-PQCC-N56
    • S-PQCC-N64
    • S-PQCC-N68
    • S-PQCC-N72
    • S-PQFP-G100
    • S-PQFP-G160
    • S-PQFP-G32
    • S-PQFP-G44
    • S-PQFP-G48
    • S-PQFP-G64
    • S-PQFP-G80
    • S-XQCC-N16
    • S-XQCC-N20
    • S-XQCC-N28
    • S-XQFP-G144
    • X-PQFP-G80
Moisture Sensitivity Level (MSL)
    • 1
    • 3
Maximum Seated Height
    • 0.039 in (1 mm)
    • 0.078 in (1.99 mm)
    • 0.096 in (2.45 mm)
Width
    • 0.049 in (1.25 mm)
    • 0.118 in (3 mm)
    • 0.208 in (5.29 mm)
    • 0.394 in (10 mm)
Qualification
    • No
JESD-609 Code
    • e0
    • e1
    • e2
    • e3
    • e4
    • e6
Maximum Time At Peak Reflow Temperature (s)
    • 10 s
    • 20 s
    • 30 s
    • 40 s
Peak Reflow Temperature (C)
    • 240 °C (464 °F)
    • 245 °C (473 °F)
    • 260 °C (500 °F)
Length
    • 0.079 in (2 mm)
    • 0.118 in (3 mm)
    • 0.394 in (10 mm)
    • 0.402 in (10.2 mm)
Input Bit Code
    • 2's Complement
    • Binary
    • Binary Coded Decimal
    • Binary, 2'S Complement Binary
    • Binary, Complementary Binary
    • Binary, Complementary Binary, Offset Binary, 2's Complement Binary, 1's Complement Binary, Modified 1's Complement Binary
    • Binary, Offset Binary
    • Binary, Offset Binary, 2's Complentary Binary
    • Binary,Offset Binary
    • Complementary Binary
    • Complementary Binary Coded Decimal
    • Complementary Binary, Complementary Offset Binary
    • Offset Binary
    • Offset Binary, 2's Complement Binary
    • Signed Magnitude
Reset All
Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

LTC2630CSC6-LZ8#TR

Analog Devices

Digital to Analog Converter

Commercial

Gull Wing

6

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

8

260 μA

0.19 %

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP6,.08

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G6

No

e0

Binary

PM7528HP

Analog Devices

Digital to Analog Converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

2

CMOS

8

400 ns

1 mA

0.2 %

5/15 V

In-Line

DIP20,.3

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T20

No

e0

Binary, Offset Binary

LTC2634CMSE-HZ10#PBF

Analog Devices

Digital to Analog Converter

Commercial

Gull Wing

10

TSSOP

Rectangular

Plastic/Epoxy

Yes

4

CMOS

10

900 μA

0.097 %

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G10

1

No

e3

30 s

260 °C (500 °F)

Binary

LTC2636CMS-LMI12#TR

Analog Devices

Digital to Analog Converter

Commercial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

Yes

8

CMOS

12

1.5 mA

0.06 %

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.19,20

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary

LTC2636CDE-LMI8#TR

Analog Devices

Digital to Analog Converter

Commercial

No Lead

14

SON

Rectangular

Plastic/Epoxy

Yes

8

CMOS

8

1.5 mA

0.19 %

3/5 V

Small Outline

SOLCC14,.12,20

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-N14

No

e0

Binary

LTC2636CMS-HMX8#TR

Analog Devices

Digital to Analog Converter

Commercial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

Yes

8

CMOS

8

1.5 mA

0.19 %

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.19,20

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary

LTC2634CMSE-HZ12#PBF

Analog Devices

Digital to Analog Converter

Commercial

Gull Wing

10

TSSOP

Rectangular

Plastic/Epoxy

Yes

4

CMOS

12

900 μA

0.06 %

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G10

1

No

e3

30 s

260 °C (500 °F)

Binary

LTC2630CSC6-LM8

Analog Devices

Digital to Analog Converter

Commercial

Gull Wing

6

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

8

260 μA

0.19 %

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP6,.08

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G6

No

e0

Binary

PMADV476KN50

Analog Devices

Digital to Analog Converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

6

220 mA

0.78 %

5 V

5 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

LTC2630CSC6-LZ12

Analog Devices

Digital to Analog Converter

Commercial

Gull Wing

6

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

260 μA

0.049 %

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP6,.08

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G6

No

e0

Binary

AD7545JN/+

Analog Devices

Digital to Analog Converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

2 µs

2 mA

0.049 %

5/15 V

In-Line

DIP20,.3

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T20

e0

Binary

LTC2630CSC6-HM12

Analog Devices

Digital to Analog Converter

Commercial

Gull Wing

6

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

280 μA

0.049 %

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP6,.08

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G6

No

e0

Binary

AD565AKD/BIN

Analog Devices

Digital to Analog Converter

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

12

250 ns

18 mA

0.012 %

15 V

±15 V

-15 V

In-Line

DIP24,.6

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

Binary, Offset Binary

DAC8408HS

Analog Devices

Digital to Analog Converter

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

4

CMOS

8

250 ns

1.5 mA

0.19 %

5 V

5 V

Small Outline

SOP28,.4

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G28

No

e0

Binary

LTC2636CDE-HMX8

Analog Devices

Digital to Analog Converter

Commercial

No Lead

14

SON

Rectangular

Plastic/Epoxy

Yes

8

CMOS

8

1.5 mA

0.19 %

5 V

5 V

Small Outline

SOLCC14,.12,20

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-N14

No

e0

Binary

LTC2630CSC6-LM12

Analog Devices

Digital to Analog Converter

Commercial

Gull Wing

6

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

260 μA

0.049 %

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP6,.08

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G6

No

e0

Binary

AD565AJE

Analog Devices

Digital to Analog Converter

Commercial

No Lead

28

QCCN

Square

Ceramic

Yes

1

Bipolar

12

250 ns

18 mA

0.018 %

15 V

±15 V

-15 V

Chip Carrier

LCC28,.45SQ

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-XQCC-N28

No

e0

Binary, Offset Binary

AD7850JP

Analog Devices

Digital to Analog Converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

3 V

BICMOS

12

5 V

±5 V

-5 V

Chip Carrier

LDCC28,.5SQ

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J28

No

e0

LC99059-MJ9

Onsemi

Digital to Analog Converter

Commercial

Gull Wing

80

QFP

Square

Plastic/Epoxy

1

Yes

CMOS

8

5 V

5 V

Flatpack

QFP80,.55SQ,20

0.02 in (0.5 mm)

60 °C (140 °F)

-15 °C (5 °F)

Quad

S-PQFP-G80

No

STG1700J-13Z

STMicroelectronics

Digital to Analog Converter

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

Yes

3

CMOS

8

7.4 ns

340 mA

0.59 %

5 V

5 V

Chip Carrier

LDCC44,.7SQ

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J44

No

e0

IMSG173J-66Z

STMicroelectronics

Digital to Analog Converter

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

Yes

3

CMOS

6

250 mA

0.78 %

5 V

5 V

Chip Carrier

LDCC44,.7SQ

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J44

No

e0

IMSG173P-66S

STMicroelectronics

Digital to Analog Converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

6

250 mA

0.78 %

5 V

5 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

IMSG174J-80Z

STMicroelectronics

Digital to Analog Converter

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

Yes

3

CMOS

8

250 mA

0.39 %

5 V

5 V

Chip Carrier

LDCC44,.7SQ

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J44

No

e0

EF9369P30

STMicroelectronics

Digital to Analog Converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

3

MOS

4

5 V

5 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

IMSG174J-66Z

STMicroelectronics

Digital to Analog Converter

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

Yes

3

CMOS

8

250 mA

0.39 %

5 V

5 V

Chip Carrier

LDCC44,.7SQ

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J44

No

e0

EF9369FN

STMicroelectronics

Digital to Analog Converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

3

MOS

4

5 V

5 V

Chip Carrier

LDCC28,.5SQ

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J28

No

e0

STV8438CP

STMicroelectronics

Digital to Analog Converter

Commercial

Through-Hole

42

DIP

Rectangular

Plastic/Epoxy

No

3

Bipolar

8

28.5 ns

0.4 %

5 V

5 V

In-Line

DIP42,.6

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T42

No

e0

Binary, 2'S Complement Binary

IMSG173J-80Z

STMicroelectronics

Digital to Analog Converter

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

Yes

3

CMOS

6

250 mA

0.78 %

5 V

5 V

Chip Carrier

LDCC44,.7SQ

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J44

No

e0

IMSG173P-80S

STMicroelectronics

Digital to Analog Converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

6

250 mA

0.78 %

5 V

5 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

EF9369P

STMicroelectronics

Digital to Analog Converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

3

MOS

4

5 V

5 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

TDA9965HL/C3,151

NXP Semiconductors

Digital to Analog Converter

Commercial

Gull Wing

48

QFP

Square

Plastic/Epoxy

1

Yes

12

3,5 V

Flatpack

QFP48,.35SQ,20

0.02 in (0.5 mm)

70 °C (158 °F)

-20 °C (-4 °F)

Quad

S-PQFP-G48

No

SAB82C171-35-P

Infineon Technologies

Digital to Analog Converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

6

28 ns

150 mA

0.78 %

5 V

5 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

SAB82C176-50-P

Infineon Technologies

Digital to Analog Converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

6

20 ns

160 mA

0.78 %

5 V

5 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

SAB82C171-50-C

Infineon Technologies

Digital to Analog Converter

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic

No

3

CMOS

6

20 ns

160 mA

0.78 %

5 V

5 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

SAB82C176-40-P

Infineon Technologies

Digital to Analog Converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

6

25 ns

155 mA

0.78 %

5 V

5 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

SAB82C171-50-P

Infineon Technologies

Digital to Analog Converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

6

20 ns

160 mA

0.78 %

5 V

5 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

AD7543JCWE

Maxim Integrated

Digital to Analog Converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2.5 mA

0.024 %

5 V

5 V

Small Outline

SOP16,.4

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary

AD7524JCSE

Maxim Integrated

Digital to Analog Converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

8

500 ns

2 mA

0.2 %

5/15 V

Small Outline

SOP16,.25

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary, Offset Binary

MX7524JN+2

Maxim Integrated

Digital to Analog Converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

8

500 ns

2 mA

0.2 %

5/15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T16

No

e3

Binary, Offset Binary

AD7543KCWP

Maxim Integrated

Digital to Analog Converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2.5 mA

0.012 %

5 V

5 V

Small Outline

SOP16,.4

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary

AD7531JC/D

Maxim Integrated

Digital to Analog Converter

Commercial

1

CMOS

12

2 mA

0.2 %

15 V

15 V

DIE OR CHIP

70 °C (158 °F)

0 °C (32 °F)

No

Binary, Offset Binary

AD7524KCSE

Maxim Integrated

Digital to Analog Converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

8

500 ns

2 mA

0.1 %

5/15 V

Small Outline

SOP16,.25

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary, Offset Binary

AD7543KCWE

Maxim Integrated

Digital to Analog Converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2.5 mA

0.012 %

5 V

5 V

Small Outline

SOP16,.4

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary

AD7530JC/D

Maxim Integrated

Digital to Analog Converter

Commercial

1

CMOS

10

2 mA

0.2 %

15 V

15 V

DIE OR CHIP

70 °C (158 °F)

0 °C (32 °F)

No

Binary, Offset Binary

AD7528JC/D

Maxim Integrated

Digital to Analog Converter

Commercial

2

CMOS

8

400 ns

1 mA

0.39 %

5/15 V

DIE OR CHIP

70 °C (158 °F)

0 °C (32 °F)

No

Binary, Offset Binary

AD7524LCSE

Maxim Integrated

Digital to Analog Converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

8

500 ns

2 mA

0.05 %

5/15 V

Small Outline

SOP16,.25

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary, Offset Binary

MX7528KN+4

Maxim Integrated

Digital to Analog Converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

2

CMOS

8

400 ns

1 mA

0.2 %

5/15 V

In-Line

DIP20,.3

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T20

e3

Binary, Offset Binary

MX7528LN-4

Maxim Integrated

Digital to Analog Converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

2

CMOS

8

400 ns

1 mA

0.2 %

5/15 V

In-Line

DIP20,.3

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T20

e0

Binary, Offset Binary
Other Function Converters

Other function converters are specialized electronic devices that perform signal conversion and processing for specific applications. These converters are designed to provide a specific function or task, such as frequency-to-voltage conversion, voltage-to-frequency conversion, or power-to-frequency conversion.

Frequency-to-voltage converters (FVCs) are electronic devices that convert an input frequency signal into an output voltage signal. FVCs are used in applications such as tachometers, speedometers, and frequency counters. Voltage-to-frequency converters (VFCs) are electronic devices that convert an input voltage signal into an output frequency signal. VFCs are used in applications such as waveform generators, signal conditioning circuits, and measurement systems.

Power-to-frequency converters (PFCs) are electronic devices that convert an input power signal into an output frequency signal. PFCs are used in applications such as power monitoring, energy harvesting, and renewable energy systems.

Other function converters may include specialized converters, such as temperature-to-frequency converters, current-to-frequency converters, or phase-locked loop (PLL) frequency synthesizers. These converters are designed to perform specific signal conversion and processing tasks, depending on the application and the required performance.