Other Other Function Converters 150

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Part	Manufacturer	Converter Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Analog In Channels	Surface Mount	Maximum Analog Input Voltage	No. of Functions	Technology	Screening Level	No. of Bits	Maximum Settling Time	Maximum Supply Current	Maximum Linearity Error (EL)	Nominal Supply Voltage	Power Supplies (V)	Nominal Negative Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Qualification	JESD-609 Code	Input Bit Code
ADDI7006BSUZ	Analog Devices	Analog to Digital Converter	Other	Gull Wing	80	QFP		Plastic/Epoxy	6	Yes		1			10				1.8 V			Flatpack			85 °C (185 °F)	-25 °C (-13 °F)		Quad	X-PQFP-G80
ADDI7006BSUZRL	Analog Devices	Analog to Digital Converter	Other	Gull Wing	80	QFP		Plastic/Epoxy	6	Yes		1			10				1.8 V			Flatpack			85 °C (185 °F)	-25 °C (-13 °F)		Quad	X-PQFP-G80
AD7528CQ/+	Analog Devices	Digital to Analog Converter	Other	Through-Hole	20	DIP	Rectangular	Ceramic		No		2	CMOS		8	400 ns	2 mA	0.2 %		5/15 V		In-Line	DIP20,.3	0.1 in (2.54 mm)	85 °C (185 °F)	-25 °C (-13 °F)	Tin/Lead	Dual	R-XDIP-T20		e0	Binary, Offset Binary
TLV5621EN	Texas Instruments	Digital to Analog Converter	Other	Through-Hole	14	DIP	Rectangular	Plastic/Epoxy		No		4	CMOS		8		1.5 mA	0.39 %		3/5 V		In-Line	DIP14,.3	0.1 in (2.54 mm)	85 °C (185 °F)	-25 °C (-13 °F)		Dual	R-PDIP-T14	No		Binary
DAC85H-CBI-V	Texas Instruments	Digital to Analog Converter	Other	Through-Hole	24	DIP	Rectangular	Ceramic		No		1	Bipolar		12	4 µs		0.012 %		±12/±15 V		In-Line	DIP24,.6	0.1 in (2.54 mm)	85 °C (185 °F)	-25 °C (-13 °F)		Dual	R-XDIP-T24	No		Complementary Binary, Complementary Offset Binary
DAC85H-CBI-I	Texas Instruments	Digital to Analog Converter	Other	Through-Hole	24	DIP	Rectangular	Ceramic		No		1	Bipolar		12	4 µs		0.012 %		±12/±15 V		In-Line	DIP24,.6	0.1 in (2.54 mm)	85 °C (185 °F)	-25 °C (-13 °F)		Dual	R-XDIP-T24	No		Complementary Binary, Complementary Offset Binary
AD7524AD	Analog Devices	Digital to Analog Converter	Other	Through-Hole	16	DIP	Rectangular	Ceramic		No		1	CMOS		8	200 ns				5/15 V		In-Line	DIP16,.3	0.1 in (2.54 mm)	85 °C (185 °F)	-25 °C (-13 °F)	Tin/Lead	Dual	R-XDIP-T16	No	e0	Binary, Offset Binary
AD9923BBCZRL	Analog Devices	Digital to Analog Converter	Other	Ball	105	FBGA	Square	Plastic/Epoxy	1	Yes	3 V				12					3/3.3,-7.5,15 V		Grid Array, Fine Pitch	BGA105,11X11,25	0.025 in (0.635 mm)	85 °C (185 °F)	-25 °C (-13 °F)		Bottom	S-PBGA-B105	No
AD7545AACHIPS	Analog Devices	Digital to Analog Converter	Other									1	CMOS		12	1 µs	2 mA			5/15 V			DIE OR CHIP		85 °C (185 °F)	-25 °C (-13 °F)				No		Binary
5962-01-364-7596	Analog Devices	Digital to Analog Converter	Other	Through-Hole	18	DIP	Rectangular	Ceramic		No		1	Bipolar		8	400 ns		0.19 %		5,-12 V		In-Line	DIP18,.3	0.1 in (2.54 mm)	85 °C (185 °F)	-25 °C (-13 °F)		Dual	R-XDIP-T18	No		Binary, Complementary Binary
AD7545ACQ/+	Analog Devices	Digital to Analog Converter	Other	Through-Hole	20	DIP	Rectangular	Ceramic		No		1	CMOS		12	1 µs	2 mA	0.012 %		5/15 V		In-Line	DIP20,.3	0.1 in (2.54 mm)	85 °C (185 °F)	-25 °C (-13 °F)	Tin/Lead	Dual	R-XDIP-T20		e0	Binary
AD7545BQ/+	Analog Devices	Digital to Analog Converter	Other	Through-Hole	20	DIP	Rectangular	Ceramic		No		1	CMOS		12	2 µs	2 mA	0.024 %		5/15 V		In-Line	DIP20,.3	0.1 in (2.54 mm)	85 °C (185 °F)	-25 °C (-13 °F)	Tin/Lead	Dual	R-XDIP-T20		e0	Binary
MX7245CQ	Analog Devices	Digital to Analog Converter	Other	Through-Hole	24	DIP	Rectangular	Ceramic		No		1	BICMOS		12	5 µs	12 mA	0.024 %		12/15,GND/-12/-15 V		In-Line	DIP24,.3	0.1 in (2.54 mm)	85 °C (185 °F)	-25 °C (-13 °F)	Tin Lead	Dual	R-XDIP-T24		e0	Binary, Offset Binary
MAX7628BQ	Analog Devices	Digital to Analog Converter	Other	Through-Hole	20	DIP	Rectangular	Ceramic		No		2	CMOS		8					12/15 V		In-Line	DIP20,.3	0.1 in (2.54 mm)	85 °C (185 °F)	-20 °C (-4 °F)	Tin Lead	Dual	R-XDIP-T20		e0	Binary, Offset Binary
DAC8212GBC	Analog Devices	Digital to Analog Converter	Other									2	CMOS	MIL-STD-883 Class B (Modified)	12	1 µs	2 mA	0.024 %		5/15 V			DIE OR CHIP		25 °C (77 °F)	25 °C (77 °F)				No		Binary
DAC210GBC	Analog Devices	Digital to Analog Converter	Other									1	Bipolar	MIL-STD-883 Class B (Modified)	11			0.1 %	15 V	±15 V	-15 V		DIE OR CHIP		25 °C (77 °F)	25 °C (77 °F)				No		Signed Magnitude
AD7524AQ/+	Analog Devices	Digital to Analog Converter	Other	Through-Hole	16	DIP	Rectangular	Ceramic		No		1	CMOS		8	500 ns	2 mA	0.2 %		5/15 V		In-Line	DIP16,.3	0.1 in (2.54 mm)	85 °C (185 °F)	-25 °C (-13 °F)	Tin/Lead	Dual	R-XDIP-T16		e0	Binary, Offset Binary
AD7524BD	Analog Devices	Digital to Analog Converter	Other	Through-Hole	16	DIP	Rectangular	Ceramic		No		1	CMOS		8	200 ns				5/15 V		In-Line	DIP16,.3	0.1 in (2.54 mm)	85 °C (185 °F)	-25 °C (-13 °F)	Tin Lead	Dual	R-XDIP-T16	No	e0	Binary, Offset Binary
DAC01GBC	Analog Devices	Digital to Analog Converter	Other									1	Bipolar		6			0.8 %	15 V	±15 V	-15 V		DIE OR CHIP		25 °C (77 °F)	25 °C (77 °F)				No		Offset Binary, 2's Complement Binary
PM7524GBC	Analog Devices	Digital to Analog Converter	Other									1	CMOS		8					5/15 V			DIE OR CHIP		25 °C (77 °F)	25 °C (77 °F)				No		Binary, Offset Binary
DAC10NTBC	Analog Devices	Digital to Analog Converter	Other									1	Bipolar		10		15 mA	0.048 %	15 V	±15 V	-15 V		DIE OR CHIP		125 °C (257 °F)	25 °C (77 °F)				No		Binary
AD7524CD	Analog Devices	Digital to Analog Converter	Other	Through-Hole	16	DIP	Rectangular	Ceramic		No		1	CMOS		8	200 ns				5/15 V		In-Line	DIP16,.3	0.1 in (2.54 mm)	85 °C (185 °F)	-25 °C (-13 °F)	Tin/Lead	Dual	R-XDIP-T16	No	e0	Binary, Offset Binary
AD9949AKCPRLZ	Analog Devices	Digital to Analog Converter	Other	No Lead	40	QCCN	Square	Plastic/Epoxy	1	Yes					12			0.19 %	3 V	3 V		Chip Carrier	LCC40,.24SQ,20	0.02 in (0.5 mm)	85 °C (185 °F)	-20 °C (-4 °F)		Quad	S-PQCC-N40	No
V62/12637-01XB	Analog Devices	Digital to Analog Converter	Other	No Lead	48	QCCN	Square	Plastic/Epoxy		Yes		3	CMOS		10		72 mA	0.098 %	3.3 V	3.3 V		Chip Carrier	LCC48,.27SQ,20	0.02 in (0.5 mm)	105 °C (221 °F)	-55 °C (-67 °F)		Quad	S-PQCC-N48	No		2's Complement
DAC02GBC	Analog Devices	Digital to Analog Converter	Other									1	Bipolar	MIL-STD-883 Class B (Modified)	11			0.2 %	15 V	±15 V	-15 V		DIE OR CHIP		25 °C (77 °F)	25 °C (77 °F)				No		Binary
DAC312NBC	Analog Devices	Digital to Analog Converter	Other									1	Bipolar	MIL-STD-883 Class B (Modified)	12		18 mA	0.05 %	15 V	±15 V	-15 V		DIE OR CHIP		25 °C (77 °F)	25 °C (77 °F)				No		Binary, Complementary Binary, Offset Binary, 2's Complement Binary, 1's Complement Binary, Modified 1's Complement Binary
AD7524BD/883B	Analog Devices	Digital to Analog Converter	Other	Through-Hole	16	DIP	Rectangular	Ceramic		No		1	CMOS	38535Q/M;38534H;883B	8	200 ns				5/15 V		In-Line	DIP16,.3	0.1 in (2.54 mm)	85 °C (185 °F)	-25 °C (-13 °F)	Tin/Lead	Dual	R-XDIP-T16	No	e0	Binary, Offset Binary
AD7549ACHIPS	Analog Devices	Digital to Analog Converter	Other									2	CMOS		12	1.5 µs	5 mA	0.024 %	15 V	15 V			DIE OR CHIP		85 °C (185 °F)	-25 °C (-13 °F)				No		Binary
DAC02NBC	Analog Devices	Digital to Analog Converter	Other									1	Bipolar	MIL-STD-883 Class B (Modified)	11			0.1 %	15 V	±15 V	-15 V		DIE OR CHIP		25 °C (77 °F)	25 °C (77 °F)				No		Binary
DAC210NBC	Analog Devices	Digital to Analog Converter	Other									1	Bipolar	MIL-STD-883 Class B (Modified)	11			0.05 %	15 V	±15 V	-15 V		DIE OR CHIP		25 °C (77 °F)	25 °C (77 °F)				No		Signed Magnitude
5962-01-253-1567	Analog Devices	Digital to Analog Converter	Other	Through-Hole	18	DIP	Rectangular	Ceramic		No		1	Bipolar		8					5,-5.2 V		In-Line	DIP18,.3	0.1 in (2.54 mm)	115 °C (239 °F)	-30 °C (-22 °F)		Dual	R-XDIP-T18	No		Binary, Offset Binary
AD7524BQ/+	Analog Devices	Digital to Analog Converter	Other	Through-Hole	16	DIP	Rectangular	Ceramic		No		1	CMOS		8	500 ns	2 mA	0.1 %		5/15 V		In-Line	DIP16,.3	0.1 in (2.54 mm)	85 °C (185 °F)	-25 °C (-13 °F)	Tin/Lead	Dual	R-XDIP-T16		e0	Binary, Offset Binary
DAC888GBC	Analog Devices	Digital to Analog Converter	Other									1	Bipolar	MIL-STD-883 Class B (Modified)	8	400 ns		0.19 %		5,-12 V			DIE OR CHIP		25 °C (77 °F)	25 °C (77 °F)				No		Binary, Complementary Binary
HDD-1409KMB	Analog Devices	Digital to Analog Converter	Other	Through-Hole	32	DIP	Rectangular	Metal		No		1	Bipolar	MIL-STD-883 Class B (Modified)	14					5,±15 V		In-Line	DIP32,.9	0.1 in (2.54 mm)	85 °C (185 °F)	-25 °C (-13 °F)	Tin/Lead	Dual	R-MDIP-T32	No	e0	Offset Binary, 2's Complement Binary
AD7545ABCHIPS	Analog Devices	Digital to Analog Converter	Other									1	CMOS		12	1 µs	2 mA	0.012 %		5/15 V			DIE OR CHIP		85 °C (185 °F)	-25 °C (-13 °F)				No		Binary
AD7524CD/883B	Analog Devices	Digital to Analog Converter	Other	Through-Hole	16	DIP	Rectangular	Ceramic		No		1	CMOS	38535Q/M;38534H;883B	8	200 ns				5/15 V		In-Line	DIP16,.3	0.1 in (2.54 mm)	85 °C (185 °F)	-25 °C (-13 °F)	Tin/Lead	Dual	R-XDIP-T16	No	e0	Binary, Offset Binary
AD7535BD/+	Analog Devices	Digital to Analog Converter	Other	Through-Hole	28	DIP	Rectangular	Ceramic		No		1	BICMOS		14	1.5 µs	4 mA	0.006 %		12/15,GND/-0.3 V		In-Line	DIP28,.6	0.1 in (2.54 mm)	85 °C (185 °F)	-25 °C (-13 °F)	Tin/Lead	Dual	R-XDIP-T28		e0	Binary, Offset Binary
DAC8012GBC	Analog Devices	Digital to Analog Converter	Other									1	CMOS	MIL-STD-883 Class B (Modified)	12	1 µs	2 mA	0.012 %		5/15 V			DIE OR CHIP		25 °C (77 °F)	25 °C (77 °F)				No		Binary
DAC89NBC	Analog Devices	Digital to Analog Converter	Other									1	Bipolar		8		12 mA		15 V	±15 V	-15 V		DIE OR CHIP		25 °C (77 °F)	25 °C (77 °F)				No		Signed Magnitude
AD7524AD/883B	Analog Devices	Digital to Analog Converter	Other	Through-Hole	16	DIP	Rectangular	Ceramic		No		1	CMOS	38535Q/M;38534H;883B	8	200 ns				5/15 V		In-Line	DIP16,.3	0.1 in (2.54 mm)	85 °C (185 °F)	-25 °C (-13 °F)	Tin/Lead	Dual	R-XDIP-T16	No	e0	Binary, Offset Binary
DAC210GRBC	Analog Devices	Digital to Analog Converter	Other									1	Bipolar	MIL-STD-883 Class B (Modified)	11			0.2 %	15 V	±15 V	-15 V		DIE OR CHIP		25 °C (77 °F)	25 °C (77 °F)				No		Signed Magnitude
DAC10GBC	Analog Devices	Digital to Analog Converter	Other									1	Bipolar		10	150 ns	15 mA	0.098 %	15 V	±15 V	-15 V		DIE OR CHIP		25 °C (77 °F)	25 °C (77 °F)				No		Binary
PM7645GBC	Analog Devices	Digital to Analog Converter	Other									1	CMOS	MIL-STD-883 Class B (Modified)	12		2 mA	0.012 %	15 V	15 V			DIE OR CHIP		25 °C (77 °F)	25 °C (77 °F)				No		Binary
DAC88NBC	Analog Devices	Digital to Analog Converter	Other									1	Bipolar		8		12 mA		15 V	±15 V	-15 V		DIE OR CHIP		25 °C (77 °F)	25 °C (77 °F)				No		Signed Magnitude
AD7528AQ/+	Analog Devices	Digital to Analog Converter	Other	Through-Hole	20	DIP	Rectangular	Ceramic		No		2	CMOS		8	400 ns	2 mA	0.4 %		5/15 V		In-Line	DIP20,.3	0.1 in (2.54 mm)	85 °C (185 °F)	-25 °C (-13 °F)	Tin/Lead	Dual	R-XDIP-T20		e0	Binary, Offset Binary
AD1864P-K	Analog Devices	Digital to Analog Converter	Other	J Bend	28	QCCJ	Square	Plastic/Epoxy		Yes		2			18		28 mA		5 V	±5 V	-5 V	Chip Carrier	LDCC28,.5SQ	0.05 in (1.27 mm)	70 °C (158 °F)	-25 °C (-13 °F)	Tin/Lead	Quad	S-PQCC-J28	No	e0	2's Complement
AD9768SQ	Analog Devices	Digital to Analog Converter	Other	Through-Hole	18	DIP	Rectangular	Ceramic		No		1	Bipolar		8					5,-5.2 V		In-Line	DIP18,.3	0.1 in (2.54 mm)	115 °C (239 °F)	-30 °C (-22 °F)	Tin/Lead	Dual	R-XDIP-T18	No	e0	Binary, Offset Binary
DAC888NBC	Analog Devices	Digital to Analog Converter	Other									1	Bipolar	MIL-STD-883 Class B (Modified)	8	400 ns		0.1 %		5,-12 V			DIE OR CHIP		25 °C (77 °F)	25 °C (77 °F)				No		Binary, Complementary Binary

Other Function Converters

Other function converters are specialized electronic devices that perform signal conversion and processing for specific applications. These converters are designed to provide a specific function or task, such as frequency-to-voltage conversion, voltage-to-frequency conversion, or power-to-frequency conversion.

Frequency-to-voltage converters (FVCs) are electronic devices that convert an input frequency signal into an output voltage signal. FVCs are used in applications such as tachometers, speedometers, and frequency counters. Voltage-to-frequency converters (VFCs) are electronic devices that convert an input voltage signal into an output frequency signal. VFCs are used in applications such as waveform generators, signal conditioning circuits, and measurement systems.

Power-to-frequency converters (PFCs) are electronic devices that convert an input power signal into an output frequency signal. PFCs are used in applications such as power monitoring, energy harvesting, and renewable energy systems.

Other function converters may include specialized converters, such as temperature-to-frequency converters, current-to-frequency converters, or phase-locked loop (PLL) frequency synthesizers. These converters are designed to perform specific signal conversion and processing tasks, depending on the application and the required performance.