Analog Devices Other Function Converters 1,517

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Manufacturers (1)
    • Analog Devices
    • Ams Ag
    • Bias Power
    • Broadcom
    • Diodes Incorporated
    • Dymec
    • General Electric Solid State
    • Infineon Technologies
    • Maxim Integrated
    • Murata Manufacturing
    • NXP Semiconductors
    • New Japan Radio
    • Onsemi
    • Renesas Electronics
    • STMicroelectronics
    • Samsung
    • Telcom Semiconductor
    • Texas Instruments
    • Thine Electronics
    • Toshiba
    • XP Power
Converter Type
    • Analog to Digital Converter
    • Analog to Digital Converter, Delta-sigma
    • Converter
    • Digital to Analog Converter
Temperature Grade
    • Automotive
    • Commercial
    • Commercial Extended
    • Industrial
    • Military
    • Other
Terminal Form
    • Ball
    • Gull Wing
    • J Bend
    • No Lead
    • Through-Hole
No. of Terminals
    • 10
    • 100
    • 105
    • 112
    • 12
    • 14
    • 144
    • 16
    • 160
    • 18
    • 20
    • 22
    • 24
    • 28
    • 30
    • 32
    • 36
    • 38
    • 40
    • 42
    • 44
    • 48
    • 5
    • 56
    • 6
    • 64
    • 68
    • 72
    • 8
    • 80
    • 84
Package Code
    • DIP
    • FBGA
    • HVQCCN
    • QCCJ
    • QCCN
    • QFP
    • SDIP
    • SON
    • SOP
    • SSOP
    • TSOP
    • TSSOP
Package Shape
    • Rectangular
    • Square
Package Body Material
    • Ceramic
    • Metal
    • Plastic/Epoxy
No. of Analog In Channels
    • 1
    • 10
    • 2
    • 3
    • 6
    • 8
Surface Mount
    • No
    • Yes
Maximum Supply Voltage
    • 12 V
    • 4.25 V
    • 5.5 V
Maximum Analog Input Voltage
    • 3 V
    • 3.6 V
    • 5.3 V
No. of Functions
    • 1
    • 12
    • 2
    • 3
    • 32
    • 4
    • 8
Technology
    • BICMOS
    • Bipolar
    • CMOS
    • Hybrid
    • MOS
Screening Level
    • 38535Q/M;38534H;883B
    • 38535V;38534K;883S
    • AEC-Q100
    • MIL-STD-883 Class B (Modified)
No. of Bits
    • 10
    • 11
    • 12
    • 14
    • 16
    • 18
    • 20
    • 24
    • 4
    • 5
    • 6
    • 8
Maximum Settling Time
    • 0.1 ns
    • 1 µs
    • 1.5 µs
    • 10 ns
    • 10 µs
    • 100 ns
    • 110 ns
    • 12 ns
    • 120 ns
    • 135 ns
    • 15 µs
    • 150 ns
    • 150 µs
    • 18 ns
    • 18 µs
    • 2 µs
    • 20 ns
    • 20 µs
    • 200 ns
    • 25 ns
    • 250 ns
    • 28 ns
    • 28.5 ns
    • 3 µs
    • 300 ns
    • 300 µs
    • 350 ns
    • 375 ns
    • 4 µs
    • 4.5 µs
    • 40 ns
    • 400 ns
    • 5 µs
    • 500 ns
    • 6 ns
    • 600 ns
    • 7 µs
    • 7.4 ns
    • 8 ns
    • 8 µs
    • 800 ns
    • 9 µs
    • 900 ns
Maximum Supply Current
    • 1 mA
    • 1.2 mA
    • 1.4 mA
    • 1.5 mA
    • 1.8 mA
    • 10 mA
    • 10 μA
    • 100 μA
    • 105 mA
    • 11.6 mA
    • 11.69 mA
    • 12 mA
    • 125 μA
    • 13 mA
    • 15 mA
    • 15.5 mA
    • 150 mA
    • 155 mA
    • 16 mA
    • 160 mA
    • 18 mA
    • 183 mA
    • 188 mA
    • 2 mA
    • 2.5 mA
    • 2.6 mA
    • 2.7 mA
    • 20 mA
    • 220 mA
    • 23 mA
    • 230 μA
    • 24 mA
    • 25 mA
    • 250 mA
    • 26.3 mA
    • 260 μA
    • 27 mA
    • 275 mA
    • 28 mA
    • 280 μA
    • 290 mA
    • 3 mA
    • 3.2 mA
    • 3.5 mA
    • 300 mA
    • 330 mA
    • 340 mA
    • 35 mA
    • 358 mA
    • 391 mA
    • 4 mA
    • 40 mA
    • 400 μA
    • 410 μA
    • 42 mA
    • 450 μA
    • 49 mA
    • 5 mA
    • 5.2 mA
    • 5.6 mA
    • 50 mA
    • 580 mA
    • 6 mA
    • 60 mA
    • 600 μA
    • 65 mA
    • 700 μA
    • 72 mA
    • 8.33 mA
    • 80 mA
    • 85 mA
    • 9 μA
    • 9.3 mA
    • 900 μA
Maximum Linearity Error (EL)
    • 0.0003 %
    • 0.0012 %
    • 0.0022 %
    • 0.003 %
    • 0.006 %
    • 0.0061 %
    • 0.01 %
    • 0.012 %
    • 0.0125 %
    • 0.015 %
    • 0.017 %
    • 0.018 %
    • 0.02 %
    • 0.024 %
    • 0.03 %
    • 0.032 %
    • 0.036 %
    • 0.042 %
    • 0.048 %
    • 0.049 %
    • 0.05 %
    • 0.06 %
    • 0.097 %
    • 0.0976 %
    • 0.098 %
    • 0.1 %
    • 0.12 %
    • 0.15 %
    • 0.19 %
    • 0.195 %
    • 0.2 %
    • 0.2148 %
    • 0.24 %
    • 0.31 %
    • 0.39 %
    • 0.4 %
    • 0.429 %
    • 0.45 %
    • 0.58 %
    • 0.59 %
    • 0.78 %
    • 0.8 %
    • 0.9 %
    • 0.98 %
    • 1.17 %
    • 1.61 %
    • 3.9 %
Input Format
    • Parallel, 8 Bits
Nominal Supply Voltage
    • 1.8 V
    • 12 V
    • 15 V
    • 3 V
    • 3.3 V
    • 5 V
Power Supplies (V)
    • -15 V
    • -3,3/5,5,8 V
    • -4,5,10 V
    • -5.2 V
    • 1,3.3 V
    • 1.8,1.8/3.3 V
    • 1.8,3.3 V
    • 1.8/3.3 V
    • 1.8/3.6 V
    • 12 V
    • 12/15 V
    • 12/15, GND/-5 V
    • 12/15,-0.3 V
    • 12/15,-5 V
    • 12/15,GND/-0.3 V
    • 12/15,GND/-12/-15 V
    • 15 V
    • 2.5/5.5 V
    • 2.7/5,5 V
    • 2/5,3/5 V
    • 3 V
    • 3,5 V
    • 3.3 V
    • 3.3,3.3/5 V
    • 3.3,5 V
    • 3/3.3 V
    • 3/3.3,-7.5,15 V
    • 3/5 V
    • 3/5,5 V
    • 3/5,5,10.5 V
    • 3/5,±12/±15 V
    • 3/5,±12/±16.5 V
    • 5 V
    • 5,-12 V
    • 5,-15 V
    • 5,-5.2 V
    • 5,13 V
    • 5,15 V
    • 5,±12/±15 V
    • 5,±15 V
    • 5/15 V
    • 5/15,-15 V
    • 5/±5 V
    • ±10/±15 V
    • ±12/±15 V
    • ±15 V
    • ±5 V
    • ±5,3/5 V
Nominal Negative Supply Voltage
    • -15 V
    • -5 V
    • -5.2 V
Package Style (Meter)
    • Chip Carrier
    • Chip Carrier, Heat Sink/Slug, Very Thin Profile
    • Flatpack
    • Grid Array, Fine Pitch
    • In-Line
    • In-Line, Shrink Pitch
    • Small Outline
    • Small Outline, Shrink Pitch
    • Small Outline, Thin Profile
    • Small Outline, Thin Profile, Shrink Pitch
Package Equivalence Code
    • BGA105,11X11,25
    • BGA12,3X4,20
    • DIE OR CHIP
    • DIP14,.3
    • DIP16,.3
    • DIP18,.3
    • DIP20,.3
    • DIP22,.3
    • DIP22,.4
    • DIP24(UNSPEC)
    • DIP24,.3
    • DIP24,.4
    • DIP24,.6
    • DIP28,.6
    • DIP30,1.8
    • DIP32,.9
    • DIP40,.6
    • DIP42,.6
    • DIP8,.3
    • LCC16,.12SQ,20
    • LCC20,.35SQ
    • LCC28,.45SQ
    • LCC32,.2SQ,20
    • LCC36,.25SQ,20
    • LCC40,.24SQ,20
    • LCC48,.27SQ,20
    • LCC56,.31SQ,20
    • LCC64,.35SQ,20
    • LCC68,.4SQ,20
    • LCC72,.39SQ,20
    • LDCC20,.4SQ
    • LDCC28,.5SQ
    • LDCC44,.7SQ
    • LDCC84,1.2SQ
    • QFP144,1.2SQ
    • QFP160,1.2SQ
    • QFP44,.5SQ,32
    • QFP48,.35SQ,20
    • QFP48,.5X.66,32
    • QFP64,.47SQ,20
    • QFP64,.7X.95,40
    • QFP80,.55SQ,20
    • SDIP24,.3
    • SDIP28,.4
    • SDIP30,.4
    • SOLCC10,.08,20
    • SOLCC10,.11,20
    • SOLCC10,.12,20
    • SOLCC14,.12,20
    • SOLCC8,.12,25
    • SOP16,.25
    • SOP16,.3
    • SOP16,.4
    • SOP20,.3
    • SOP20,.4
    • SOP24,.3
    • SOP24,.3,32
    • SOP24,.4
    • SOP28,.3
    • SOP28,.4
    • SOP28,.5
    • SOP36,.3,32
    • SOP8,.25
    • SSOP16,.25
    • SSOP20,.25
    • SSOP24,.3
    • SSOP28,.3
    • TQFP100,.63SQ
    • TQFP32,.35SQ,32
    • TQFP48,.35SQ
    • TQFP64,.47SQ
    • TQFP64,.63SQ,32
    • TQFP80,.55SQ
    • TSOP5/6,.11,37
    • TSOP6,.11,37
    • TSSOP10,.19,20
    • TSSOP14,.25
    • TSSOP16,.19,20
    • TSSOP16,.25
    • TSSOP20,.25
    • TSSOP28,.25
    • TSSOP38,.25,20
    • TSSOP6,.08
    • TSSOP8,.1
    • TSSOP8,.19
    • TSSOP8,.25
    • WAFER
Minimum Supply Voltage
    • 2.7 V
    • 3 V
    • 4.75 V
Terminal Pitch
    • 0.02 in (0.5 mm)
    • 0.025 in (0.635 mm)
    • 0.026 in (0.65 mm)
    • 0.031 in (0.8 mm)
    • 0.037 in (0.95 mm)
    • 0.039 in (1 mm)
    • 0.05 in (1.27 mm)
    • 0.07 in (1.78 mm)
    • 0.1 in (2.54 mm)
Maximum Operating Temperature
    • 105 °C (221 °F)
    • 115 °C (239 °F)
    • 125 °C (257 °F)
    • 25 °C (77 °F)
    • 60 °C (140 °F)
    • 70 °C (158 °F)
    • 80 °C (176 °F)
    • 85 °C (185 °F)
Minimum Operating Temperature
    • -10 °C (14 °F)
    • -15 °C (5 °F)
    • -20 °C (-4 °F)
    • -25 °C (-13 °F)
    • -30 °C (-22 °F)
    • -40 °C (-40 °F)
    • -55 °C (-67 °F)
    • 0 °C (32 °F)
    • 25 °C (77 °F)
Terminal Finish
    • Gold
    • Matte Tin
    • Matte Tin - annealed
    • Nickel Gold Palladium Silver
    • Nickel Palladium Gold
    • Tin Bismuth
    • Tin Lead
    • Tin Silver Copper
    • Tin Silver Copper Nickel
    • Tin/Lead
    • Tin/Lead (Sn63Pb37)
    • Tin/Lead (Sn85Pb15)
    • Tin/Lead - hot dipped
    • Tin/Silver
Terminal Position
    • Bottom
    • Dual
    • Quad
JESD-30 Code
    • R-MDIP-T24
    • R-MDIP-T32
    • R-PBGA-B12
    • R-PDIP-T14
    • R-PDIP-T16
    • R-PDIP-T20
    • R-PDIP-T22
    • R-PDIP-T24
    • R-PDIP-T28
    • R-PDIP-T30
    • R-PDIP-T40
    • R-PDIP-T42
    • R-PDIP-T8
    • R-PDSO-G10
    • R-PDSO-G14
    • R-PDSO-G16
    • R-PDSO-G20
    • R-PDSO-G24
    • R-PDSO-G28
    • R-PDSO-G36
    • R-PDSO-G38
    • R-PDSO-G5
    • R-PDSO-G6
    • R-PDSO-G8
    • R-PDSO-N10
    • R-PDSO-N14
    • R-PDSO-N8
    • R-PQFP-G48
    • R-PQFP-G64
    • R-XDIP-T14
    • R-XDIP-T16
    • R-XDIP-T18
    • R-XDIP-T20
    • R-XDIP-T22
    • R-XDIP-T24
    • R-XDIP-T28
    • R-XDIP-T30
    • R-XDIP-T32
    • R-XDIP-T40
    • S-MQFP-G160
    • S-PBGA-B105
    • S-PBGA-B112
    • S-PQCC-J20
    • S-PQCC-J28
    • S-PQCC-J44
    • S-PQCC-J84
    • S-PQCC-N16
    • S-PQCC-N32
    • S-PQCC-N36
    • S-PQCC-N40
    • S-PQCC-N48
    • S-PQCC-N56
    • S-PQCC-N64
    • S-PQCC-N68
    • S-PQCC-N72
    • S-PQFP-G100
    • S-PQFP-G160
    • S-PQFP-G32
    • S-PQFP-G44
    • S-PQFP-G48
    • S-PQFP-G64
    • S-PQFP-G80
    • S-XQCC-N16
    • S-XQCC-N20
    • S-XQCC-N28
    • S-XQFP-G144
    • X-PQFP-G80
Moisture Sensitivity Level (MSL)
    • 1
    • 3
Maximum Seated Height
    • 0.039 in (1 mm)
    • 0.078 in (1.99 mm)
    • 0.096 in (2.45 mm)
Width
    • 0.049 in (1.25 mm)
    • 0.118 in (3 mm)
    • 0.208 in (5.29 mm)
    • 0.394 in (10 mm)
Qualification
    • No
JESD-609 Code
    • e0
    • e1
    • e2
    • e3
    • e4
    • e6
Maximum Time At Peak Reflow Temperature (s)
    • 10 s
    • 20 s
    • 30 s
    • 40 s
Peak Reflow Temperature (C)
    • 240 °C (464 °F)
    • 245 °C (473 °F)
    • 260 °C (500 °F)
Length
    • 0.079 in (2 mm)
    • 0.118 in (3 mm)
    • 0.394 in (10 mm)
    • 0.402 in (10.2 mm)
Input Bit Code
    • 2's Complement
    • Binary
    • Binary Coded Decimal
    • Binary, 2'S Complement Binary
    • Binary, Complementary Binary
    • Binary, Complementary Binary, Offset Binary, 2's Complement Binary, 1's Complement Binary, Modified 1's Complement Binary
    • Binary, Offset Binary
    • Binary, Offset Binary, 2's Complentary Binary
    • Binary,Offset Binary
    • Complementary Binary
    • Complementary Binary Coded Decimal
    • Complementary Binary, Complementary Offset Binary
    • Offset Binary
    • Offset Binary, 2's Complement Binary
    • Signed Magnitude
Reset All
Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

MAX114ENG+

Analog Devices

Matte Tin - annealed

1

e3

30 s

260 °C (500 °F)

MX7533TQ/883

Analog Devices

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

10

800 ns

2 mA

0.1 %

15 V

15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

MX7524TQ/883

Analog Devices

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

8

500 ns

2 mA

0.1 %

5/15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

MX7528SQ/883

Analog Devices

Digital to Analog Converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

2

CMOS

38535Q/M;38534H;883B

8

400 ns

1 mA

0.39 %

5/15 V

In-Line

DIP20,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

No

e0

Binary, Offset Binary

AD7541JC/D

Analog Devices

Digital to Analog Converter

Commercial

1

CMOS

12

1 µs

2 mA

0.024 %

15 V

15 V

DIE OR CHIP

70 °C (158 °F)

0 °C (32 °F)

No

Binary, Offset Binary

AD7628KCWP

Analog Devices

Digital to Analog Converter

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

Yes

2

CMOS

8

400 ns

2 mA

0.2 %

12/15 V

Small Outline

SOP20,.4

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G20

No

e0

Binary, Offset Binary

MAX7581JCWI

Analog Devices

DS4302Z-019+TR

Analog Devices

Digital to Analog Converter

Industrial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

Yes

1

5

5 V

5 V

Small Outline

SOP8,.25

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G8

No

MAX7581TQ

Analog Devices

DS4302Z-019+

Analog Devices

Digital to Analog Converter

Industrial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

Yes

1

5

5 V

5 V

Small Outline

SOP8,.25

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G8

No

DS4302U-020+TR

Analog Devices

Digital to Analog Converter

Industrial

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

5

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G8

No

MX7845JC/D

Analog Devices

Digital to Analog Converter

Commercial

1

BICMOS

12

5 µs

10 mA

0.024 %

15 V

±15 V

-15 V

DIE OR CHIP

70 °C (158 °F)

0 °C (32 °F)

No

Binary, Offset Binary

DAC-14QG/2SC/DIR/FAST/SMD/NONE

Analog Devices

DAC-14QG/BCD/DIR/STAB/SMB/NONE

Analog Devices

ADDAC08ACHIPS

Analog Devices

Digital to Analog Converter

Military

1

Bipolar

8

15 V

±15 V

-15 V

DIE OR CHIP

125 °C (257 °F)

-55 °C (-67 °F)

No

Binary, Offset Binary

AD7541SD/883B

Analog Devices

Digital to Analog Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

1 µs

2 mA

0.024 %

15 V

15 V

In-Line

DIP18,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

LTC2630ACSC6-LZ12

Analog Devices

Digital to Analog Converter

Commercial

Gull Wing

6

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

260 μA

0.024 %

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP6,.08

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G6

No

e0

Binary

DAC8212GBC

Analog Devices

Digital to Analog Converter

Other

2

CMOS

MIL-STD-883 Class B (Modified)

12

1 µs

2 mA

0.024 %

5/15 V

DIE OR CHIP

25 °C (77 °F)

25 °C (77 °F)

No

Binary

LTC2636CDE-LZ10

Analog Devices

Digital to Analog Converter

Commercial

No Lead

14

SON

Rectangular

Plastic/Epoxy

Yes

8

CMOS

10

1.5 mA

0.097 %

3/5 V

Small Outline

SOLCC14,.12,20

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-N14

No

e0

Binary

DAC-16QG/SMB/REG/STND/2SC/NONE

Analog Devices

LTC2630ISC6-HM10

Analog Devices

Digital to Analog Converter

Industrial

Gull Wing

6

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

10

280 μA

0.98 %

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP6,.08

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-G6

No

e0

Binary

LTC2636HDE-HZ10

Analog Devices

Digital to Analog Converter

Automotive

No Lead

14

SON

Rectangular

Plastic/Epoxy

Yes

8

CMOS

10

1.5 mA

0.097 %

5 V

5 V

Small Outline

SOLCC14,.12,20

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-N14

No

e0

Binary

DAC-16QG/SMD/REG/FAST/BIN/DEGL

Analog Devices

LTC2634CUD-HMX10#PBF

Analog Devices

Digital to Analog Converter

Commercial

No Lead

16

QCCN

Square

Plastic/Epoxy

Yes

4

CMOS

10

900 μA

0.097 %

5 V

5 V

Chip Carrier

LCC16,.12SQ,20

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

No

e3

30 s

260 °C (500 °F)

Binary

DAC-16QG/2SC/REG/STAB/BIN/DEGL

Analog Devices

DAC-16QG/2SC/DIR/FAST/BIN/DEGL

Analog Devices

LTC2633CTS8-LI8#PBF

Analog Devices

Digital to Analog Converter

Commercial

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

8

600 μA

0.195 %

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.1

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

No

e3

30 s

260 °C (500 °F)

Binary

LTC2630-HZ12#PBF

Analog Devices

Digital to Analog Converter

Gull Wing

6

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

280 μA

0.048 %

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP6,.08

0.025 in (0.635 mm)

Dual

R-PDSO-G6

No

Binary

LTC2634HMSE-HMI8#PBF

Analog Devices

Digital to Analog Converter

Automotive

Gull Wing

10

TSSOP

Rectangular

Plastic/Epoxy

Yes

4

CMOS

8

900 μA

0.19 %

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G10

1

No

e3

30 s

260 °C (500 °F)

Binary

DAC8408HPC

Analog Devices

Digital to Analog Converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

4

CMOS

8

250 ns

1.5 mA

0.19 %

5 V

5 V

Chip Carrier

LDCC28,.5SQ

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J28

No

e0

Binary

LTC2636CMS-HMI12#TR

Analog Devices

Digital to Analog Converter

Commercial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

Yes

8

CMOS

12

1.5 mA

0.06 %

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.19,20

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary

LTC2636HDE-LMI10

Analog Devices

Digital to Analog Converter

Automotive

No Lead

14

SON

Rectangular

Plastic/Epoxy

Yes

8

CMOS

10

1.5 mA

0.097 %

3/5 V

Small Outline

SOLCC14,.12,20

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-N14

No

e0

Binary

LTC2636IMS-HMX10#TR

Analog Devices

Digital to Analog Converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

Yes

8

CMOS

10

1.5 mA

0.097 %

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.19,20

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary

DAC-16QG/2SC/REG/STND/BIN/NONE

Analog Devices

LTC2634CUD-LZ10#PBF

Analog Devices

Digital to Analog Converter

Commercial

No Lead

16

QCCN

Square

Plastic/Epoxy

Yes

4

CMOS

10

900 μA

0.097 %

3/5 V

Chip Carrier

LCC16,.12SQ,20

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

No

e3

30 s

260 °C (500 °F)

Binary

LTC2633AHTS8-LX12#PBF

Analog Devices

Digital to Analog Converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

600 μA

0.024 %

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.1

0.025 in (0.635 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

No

e3

30 s

260 °C (500 °F)

Binary

DAC-16QG/BCD/DIR/STAB/SMB/NONE

Analog Devices

DAC-16QG/2SC/REG/STAB/BCD/NONE

Analog Devices

DAC210GBC

Analog Devices

Digital to Analog Converter

Other

1

Bipolar

MIL-STD-883 Class B (Modified)

11

0.1 %

15 V

±15 V

-15 V

DIE OR CHIP

25 °C (77 °F)

25 °C (77 °F)

No

Signed Magnitude

AD566ASD/883B

Analog Devices

Digital to Analog Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

38535Q/M;38534H;883B

12

350 ns

18 mA

0.018 %

-15 V

-15 V

In-Line

DIP24,.6

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead (Sn63Pb37)

Dual

R-XDIP-T24

No

e0

Binary, Offset Binary

LTC1669-8CMS8#TR

Analog Devices

Digital to Analog Converter

Commercial

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

10

125 μA

0.24 %

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G8

No

e0

LTC2636IDE-LMI8

Analog Devices

Digital to Analog Converter

Industrial

No Lead

14

SON

Rectangular

Plastic/Epoxy

Yes

8

CMOS

8

1.5 mA

0.19 %

3/5 V

Small Outline

SOLCC14,.12,20

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-N14

No

e0

Binary

DAC-14QG/SMD/DIR/FAST/BCD/NONE

Analog Devices

LTC2633ACTS8-HZ12#PBF

Analog Devices

Digital to Analog Converter

Commercial

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

700 μA

0.024 %

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.1

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

No

e3

30 s

260 °C (500 °F)

Binary

LTC2636CDE-HMI8

Analog Devices

Digital to Analog Converter

Commercial

No Lead

14

SON

Rectangular

Plastic/Epoxy

Yes

8

CMOS

8

1.5 mA

0.19 %

5 V

5 V

Small Outline

SOLCC14,.12,20

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-N14

No

e0

Binary

DAC-14QG/SMB/REG/FAST/BIN/DEGL

Analog Devices

AD7549SCHIPS

Analog Devices

Digital to Analog Converter

Military

2

CMOS

12

1.5 µs

5 mA

0.024 %

15 V

15 V

DIE OR CHIP

125 °C (257 °F)

-55 °C (-67 °F)

No

Binary

AD565JN/BIN

Analog Devices

Digital to Analog Converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

12

400 ns

15 V

±15 V

-15 V

In-Line

DIP24,.6

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T24

No

e0

Binary, Offset Binary
Other Function Converters

Other function converters are specialized electronic devices that perform signal conversion and processing for specific applications. These converters are designed to provide a specific function or task, such as frequency-to-voltage conversion, voltage-to-frequency conversion, or power-to-frequency conversion.

Frequency-to-voltage converters (FVCs) are electronic devices that convert an input frequency signal into an output voltage signal. FVCs are used in applications such as tachometers, speedometers, and frequency counters. Voltage-to-frequency converters (VFCs) are electronic devices that convert an input voltage signal into an output frequency signal. VFCs are used in applications such as waveform generators, signal conditioning circuits, and measurement systems.

Power-to-frequency converters (PFCs) are electronic devices that convert an input power signal into an output frequency signal. PFCs are used in applications such as power monitoring, energy harvesting, and renewable energy systems.

Other function converters may include specialized converters, such as temperature-to-frequency converters, current-to-frequency converters, or phase-locked loop (PLL) frequency synthesizers. These converters are designed to perform specific signal conversion and processing tasks, depending on the application and the required performance.