Maxim Integrated Other Function Converters 53

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Manufacturers (1)
    • Maxim Integrated
    • Ams Ag
    • Analog Devices
    • Bias Power
    • Broadcom
    • Diodes Incorporated
    • Dymec
    • General Electric Solid State
    • Infineon Technologies
    • Murata Manufacturing
    • NXP Semiconductors
    • New Japan Radio
    • Onsemi
    • Renesas Electronics
    • STMicroelectronics
    • Samsung
    • Telcom Semiconductor
    • Texas Instruments
    • Thine Electronics
    • Toshiba
    • XP Power
Converter Type
    • Analog to Digital Converter
    • Analog to Digital Converter, Delta-sigma
    • Converter
    • Digital to Analog Converter
Temperature Grade
    • Automotive
    • Commercial
    • Commercial Extended
    • Industrial
    • Military
    • Other
Terminal Form
    • Ball
    • Gull Wing
    • J Bend
    • No Lead
    • Through-Hole
No. of Terminals
    • 10
    • 100
    • 105
    • 112
    • 12
    • 14
    • 144
    • 16
    • 160
    • 18
    • 20
    • 22
    • 24
    • 28
    • 30
    • 32
    • 36
    • 38
    • 40
    • 42
    • 44
    • 48
    • 5
    • 56
    • 6
    • 64
    • 68
    • 72
    • 8
    • 80
    • 84
Package Code
    • DIP
    • FBGA
    • HVQCCN
    • QCCJ
    • QCCN
    • QFP
    • SDIP
    • SON
    • SOP
    • SSOP
    • TSOP
    • TSSOP
Package Shape
    • Rectangular
    • Square
Package Body Material
    • Ceramic
    • Metal
    • Plastic/Epoxy
No. of Analog In Channels
    • 1
    • 10
    • 2
    • 3
    • 6
    • 8
Surface Mount
    • No
    • Yes
Maximum Supply Voltage
    • 12 V
    • 4.25 V
    • 5.5 V
Maximum Analog Input Voltage
    • 3 V
    • 3.6 V
    • 5.3 V
No. of Functions
    • 1
    • 12
    • 2
    • 3
    • 32
    • 4
    • 8
Technology
    • BICMOS
    • Bipolar
    • CMOS
    • Hybrid
    • MOS
Screening Level
    • 38535Q/M;38534H;883B
    • 38535V;38534K;883S
    • AEC-Q100
    • MIL-STD-883 Class B (Modified)
No. of Bits
    • 10
    • 11
    • 12
    • 14
    • 16
    • 18
    • 20
    • 24
    • 4
    • 5
    • 6
    • 8
Maximum Settling Time
    • 0.1 ns
    • 1 µs
    • 1.5 µs
    • 10 ns
    • 10 µs
    • 100 ns
    • 110 ns
    • 12 ns
    • 120 ns
    • 135 ns
    • 15 µs
    • 150 ns
    • 150 µs
    • 18 ns
    • 18 µs
    • 2 µs
    • 20 ns
    • 20 µs
    • 200 ns
    • 25 ns
    • 250 ns
    • 28 ns
    • 28.5 ns
    • 3 µs
    • 300 ns
    • 300 µs
    • 350 ns
    • 375 ns
    • 4 µs
    • 4.5 µs
    • 40 ns
    • 400 ns
    • 5 µs
    • 500 ns
    • 6 ns
    • 600 ns
    • 7 µs
    • 7.4 ns
    • 8 ns
    • 8 µs
    • 800 ns
    • 9 µs
    • 900 ns
Maximum Supply Current
    • 1 mA
    • 1.2 mA
    • 1.4 mA
    • 1.5 mA
    • 1.8 mA
    • 10 mA
    • 10 μA
    • 100 μA
    • 105 mA
    • 11.6 mA
    • 11.69 mA
    • 12 mA
    • 125 μA
    • 13 mA
    • 15 mA
    • 15.5 mA
    • 150 mA
    • 155 mA
    • 16 mA
    • 160 mA
    • 18 mA
    • 183 mA
    • 188 mA
    • 2 mA
    • 2.5 mA
    • 2.6 mA
    • 2.7 mA
    • 20 mA
    • 220 mA
    • 23 mA
    • 230 μA
    • 24 mA
    • 25 mA
    • 250 mA
    • 26.3 mA
    • 260 μA
    • 27 mA
    • 275 mA
    • 28 mA
    • 280 μA
    • 290 mA
    • 3 mA
    • 3.2 mA
    • 3.5 mA
    • 300 mA
    • 330 mA
    • 340 mA
    • 35 mA
    • 358 mA
    • 391 mA
    • 4 mA
    • 40 mA
    • 400 μA
    • 410 μA
    • 42 mA
    • 450 μA
    • 49 mA
    • 5 mA
    • 5.2 mA
    • 5.6 mA
    • 50 mA
    • 580 mA
    • 6 mA
    • 60 mA
    • 600 μA
    • 65 mA
    • 700 μA
    • 72 mA
    • 8.33 mA
    • 80 mA
    • 85 mA
    • 9 μA
    • 9.3 mA
    • 900 μA
Maximum Linearity Error (EL)
    • 0.0003 %
    • 0.0012 %
    • 0.0022 %
    • 0.003 %
    • 0.006 %
    • 0.0061 %
    • 0.01 %
    • 0.012 %
    • 0.0125 %
    • 0.015 %
    • 0.017 %
    • 0.018 %
    • 0.02 %
    • 0.024 %
    • 0.03 %
    • 0.032 %
    • 0.036 %
    • 0.042 %
    • 0.048 %
    • 0.049 %
    • 0.05 %
    • 0.06 %
    • 0.097 %
    • 0.0976 %
    • 0.098 %
    • 0.1 %
    • 0.12 %
    • 0.15 %
    • 0.19 %
    • 0.195 %
    • 0.2 %
    • 0.2148 %
    • 0.24 %
    • 0.31 %
    • 0.39 %
    • 0.4 %
    • 0.429 %
    • 0.45 %
    • 0.58 %
    • 0.59 %
    • 0.78 %
    • 0.8 %
    • 0.9 %
    • 0.98 %
    • 1.17 %
    • 1.61 %
    • 3.9 %
Input Format
    • Parallel, 8 Bits
Nominal Supply Voltage
    • 1.8 V
    • 12 V
    • 15 V
    • 3 V
    • 3.3 V
    • 5 V
Power Supplies (V)
    • -15 V
    • -3,3/5,5,8 V
    • -4,5,10 V
    • -5.2 V
    • 1,3.3 V
    • 1.8,1.8/3.3 V
    • 1.8,3.3 V
    • 1.8/3.3 V
    • 1.8/3.6 V
    • 12 V
    • 12/15 V
    • 12/15, GND/-5 V
    • 12/15,-0.3 V
    • 12/15,-5 V
    • 12/15,GND/-0.3 V
    • 12/15,GND/-12/-15 V
    • 15 V
    • 2.5/5.5 V
    • 2.7/5,5 V
    • 2/5,3/5 V
    • 3 V
    • 3,5 V
    • 3.3 V
    • 3.3,3.3/5 V
    • 3.3,5 V
    • 3/3.3 V
    • 3/3.3,-7.5,15 V
    • 3/5 V
    • 3/5,5 V
    • 3/5,5,10.5 V
    • 3/5,±12/±15 V
    • 3/5,±12/±16.5 V
    • 5 V
    • 5,-12 V
    • 5,-15 V
    • 5,-5.2 V
    • 5,13 V
    • 5,15 V
    • 5,±12/±15 V
    • 5,±15 V
    • 5/15 V
    • 5/15,-15 V
    • 5/±5 V
    • ±10/±15 V
    • ±12/±15 V
    • ±15 V
    • ±5 V
    • ±5,3/5 V
Nominal Negative Supply Voltage
    • -15 V
    • -5 V
    • -5.2 V
Package Style (Meter)
    • Chip Carrier
    • Chip Carrier, Heat Sink/Slug, Very Thin Profile
    • Flatpack
    • Grid Array, Fine Pitch
    • In-Line
    • In-Line, Shrink Pitch
    • Small Outline
    • Small Outline, Shrink Pitch
    • Small Outline, Thin Profile
    • Small Outline, Thin Profile, Shrink Pitch
Package Equivalence Code
    • BGA105,11X11,25
    • BGA12,3X4,20
    • DIE OR CHIP
    • DIP14,.3
    • DIP16,.3
    • DIP18,.3
    • DIP20,.3
    • DIP22,.3
    • DIP22,.4
    • DIP24(UNSPEC)
    • DIP24,.3
    • DIP24,.4
    • DIP24,.6
    • DIP28,.6
    • DIP30,1.8
    • DIP32,.9
    • DIP40,.6
    • DIP42,.6
    • DIP8,.3
    • LCC16,.12SQ,20
    • LCC20,.35SQ
    • LCC28,.45SQ
    • LCC32,.2SQ,20
    • LCC36,.25SQ,20
    • LCC40,.24SQ,20
    • LCC48,.27SQ,20
    • LCC56,.31SQ,20
    • LCC64,.35SQ,20
    • LCC68,.4SQ,20
    • LCC72,.39SQ,20
    • LDCC20,.4SQ
    • LDCC28,.5SQ
    • LDCC44,.7SQ
    • LDCC84,1.2SQ
    • QFP144,1.2SQ
    • QFP160,1.2SQ
    • QFP44,.5SQ,32
    • QFP48,.35SQ,20
    • QFP48,.5X.66,32
    • QFP64,.47SQ,20
    • QFP64,.7X.95,40
    • QFP80,.55SQ,20
    • SDIP24,.3
    • SDIP28,.4
    • SDIP30,.4
    • SOLCC10,.08,20
    • SOLCC10,.11,20
    • SOLCC10,.12,20
    • SOLCC14,.12,20
    • SOLCC8,.12,25
    • SOP16,.25
    • SOP16,.3
    • SOP16,.4
    • SOP20,.3
    • SOP20,.4
    • SOP24,.3
    • SOP24,.3,32
    • SOP24,.4
    • SOP28,.3
    • SOP28,.4
    • SOP28,.5
    • SOP36,.3,32
    • SOP8,.25
    • SSOP16,.25
    • SSOP20,.25
    • SSOP24,.3
    • SSOP28,.3
    • TQFP100,.63SQ
    • TQFP32,.35SQ,32
    • TQFP48,.35SQ
    • TQFP64,.47SQ
    • TQFP64,.63SQ,32
    • TQFP80,.55SQ
    • TSOP5/6,.11,37
    • TSOP6,.11,37
    • TSSOP10,.19,20
    • TSSOP14,.25
    • TSSOP16,.19,20
    • TSSOP16,.25
    • TSSOP20,.25
    • TSSOP28,.25
    • TSSOP38,.25,20
    • TSSOP6,.08
    • TSSOP8,.1
    • TSSOP8,.19
    • TSSOP8,.25
    • WAFER
Minimum Supply Voltage
    • 2.7 V
    • 3 V
    • 4.75 V
Terminal Pitch
    • 0.02 in (0.5 mm)
    • 0.025 in (0.635 mm)
    • 0.026 in (0.65 mm)
    • 0.031 in (0.8 mm)
    • 0.037 in (0.95 mm)
    • 0.039 in (1 mm)
    • 0.05 in (1.27 mm)
    • 0.07 in (1.78 mm)
    • 0.1 in (2.54 mm)
Maximum Operating Temperature
    • 105 °C (221 °F)
    • 115 °C (239 °F)
    • 125 °C (257 °F)
    • 25 °C (77 °F)
    • 60 °C (140 °F)
    • 70 °C (158 °F)
    • 80 °C (176 °F)
    • 85 °C (185 °F)
Minimum Operating Temperature
    • -10 °C (14 °F)
    • -15 °C (5 °F)
    • -20 °C (-4 °F)
    • -25 °C (-13 °F)
    • -30 °C (-22 °F)
    • -40 °C (-40 °F)
    • -55 °C (-67 °F)
    • 0 °C (32 °F)
    • 25 °C (77 °F)
Terminal Finish
    • Gold
    • Matte Tin
    • Matte Tin - annealed
    • Nickel Gold Palladium Silver
    • Nickel Palladium Gold
    • Tin Bismuth
    • Tin Lead
    • Tin Silver Copper
    • Tin Silver Copper Nickel
    • Tin/Lead
    • Tin/Lead (Sn63Pb37)
    • Tin/Lead (Sn85Pb15)
    • Tin/Lead - hot dipped
    • Tin/Silver
Terminal Position
    • Bottom
    • Dual
    • Quad
JESD-30 Code
    • R-MDIP-T24
    • R-MDIP-T32
    • R-PBGA-B12
    • R-PDIP-T14
    • R-PDIP-T16
    • R-PDIP-T20
    • R-PDIP-T22
    • R-PDIP-T24
    • R-PDIP-T28
    • R-PDIP-T30
    • R-PDIP-T40
    • R-PDIP-T42
    • R-PDIP-T8
    • R-PDSO-G10
    • R-PDSO-G14
    • R-PDSO-G16
    • R-PDSO-G20
    • R-PDSO-G24
    • R-PDSO-G28
    • R-PDSO-G36
    • R-PDSO-G38
    • R-PDSO-G5
    • R-PDSO-G6
    • R-PDSO-G8
    • R-PDSO-N10
    • R-PDSO-N14
    • R-PDSO-N8
    • R-PQFP-G48
    • R-PQFP-G64
    • R-XDIP-T14
    • R-XDIP-T16
    • R-XDIP-T18
    • R-XDIP-T20
    • R-XDIP-T22
    • R-XDIP-T24
    • R-XDIP-T28
    • R-XDIP-T30
    • R-XDIP-T32
    • R-XDIP-T40
    • S-MQFP-G160
    • S-PBGA-B105
    • S-PBGA-B112
    • S-PQCC-J20
    • S-PQCC-J28
    • S-PQCC-J44
    • S-PQCC-J84
    • S-PQCC-N16
    • S-PQCC-N32
    • S-PQCC-N36
    • S-PQCC-N40
    • S-PQCC-N48
    • S-PQCC-N56
    • S-PQCC-N64
    • S-PQCC-N68
    • S-PQCC-N72
    • S-PQFP-G100
    • S-PQFP-G160
    • S-PQFP-G32
    • S-PQFP-G44
    • S-PQFP-G48
    • S-PQFP-G64
    • S-PQFP-G80
    • S-XQCC-N16
    • S-XQCC-N20
    • S-XQCC-N28
    • S-XQFP-G144
    • X-PQFP-G80
Moisture Sensitivity Level (MSL)
    • 1
    • 3
Maximum Seated Height
    • 0.039 in (1 mm)
    • 0.078 in (1.99 mm)
    • 0.096 in (2.45 mm)
Width
    • 0.049 in (1.25 mm)
    • 0.118 in (3 mm)
    • 0.208 in (5.29 mm)
    • 0.394 in (10 mm)
Qualification
    • No
JESD-609 Code
    • e0
    • e1
    • e2
    • e3
    • e4
    • e6
Maximum Time At Peak Reflow Temperature (s)
    • 10 s
    • 20 s
    • 30 s
    • 40 s
Peak Reflow Temperature (C)
    • 240 °C (464 °F)
    • 245 °C (473 °F)
    • 260 °C (500 °F)
Length
    • 0.079 in (2 mm)
    • 0.118 in (3 mm)
    • 0.394 in (10 mm)
    • 0.402 in (10.2 mm)
Input Bit Code
    • 2's Complement
    • Binary
    • Binary Coded Decimal
    • Binary, 2'S Complement Binary
    • Binary, Complementary Binary
    • Binary, Complementary Binary, Offset Binary, 2's Complement Binary, 1's Complement Binary, Modified 1's Complement Binary
    • Binary, Offset Binary
    • Binary, Offset Binary, 2's Complentary Binary
    • Binary,Offset Binary
    • Complementary Binary
    • Complementary Binary Coded Decimal
    • Complementary Binary, Complementary Offset Binary
    • Offset Binary
    • Offset Binary, 2's Complement Binary
    • Signed Magnitude
Reset All
Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD7533SQ/883

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

10

800 ns

2 mA

0.2 %

15 V

15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

MAX5814AUD+

Maxim Integrated

Digital to Analog Converter

Automotive

Gull Wing

14

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

10

1.4 mA

0.049 %

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP14,.25

0.025 in (0.635 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G14

1

No

e3

30 s

260 °C (500 °F)

Binary

MAX5331UCB-T

Maxim Integrated

Digital to Analog Converter

Other

Gull Wing

64

QFP

Square

Plastic/Epoxy

Yes

1

BICMOS

12

0.1 %

-4,5,10 V

Flatpack

QFP64,.47SQ,20

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQFP-G64

No

e0

AD7541SQ/883

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

1 µs

2 mA

0.024 %

15 V

15 V

In-Line

DIP18,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

AD7521SQ/883

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 mA

0.2 %

15 V

15 V

In-Line

DIP18,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

MAX5622UCB-T

Maxim Integrated

Digital to Analog Converter

Other

Gull Wing

64

QFP

Square

Plastic/Epoxy

Yes

1

BICMOS

16

0.015 %

-4,5,10 V

Flatpack

QFP64,.47SQ,20

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQFP-G64

No

e0

Binary

AD7541ABD

Maxim Integrated

Digital to Analog Converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 mA

0.012 %

15 V

15 V

In-Line

DIP18,.3

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T18

e0

Binary, Offset Binary

MAX195

Maxim Integrated

AD7543SQ/883

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

2.5 mA

0.024 %

5 V

5 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary

MAX530AMRG

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

12

0.024 %

5/±5 V

In-Line

DIP24(UNSPEC)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

e0

20 s

240 °C (464 °F)

Binary, Offset Binary

MAX5734CUTN

Maxim Integrated

Digital to Analog Converter

Other

No Lead

56

QCCN

Square

Plastic/Epoxy

Yes

32

BICMOS

16

20 µs

0.097 %

-3,3/5,5,8 V

Chip Carrier

LCC56,.31SQ,20

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-N56

No

e0

Offset Binary

AD7541AAD

Maxim Integrated

Digital to Analog Converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 mA

0.024 %

15 V

15 V

In-Line

DIP18,.3

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T18

e0

Binary, Offset Binary

AD7541TQ/883

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

1 µs

2 mA

0.012 %

15 V

15 V

In-Line

DIP18,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

AD7542GTQ/883

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

2.5 mA

0.012 %

5 V

5 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary

MAX5384EZT+

Maxim Integrated

Digital to Analog Converter

Industrial

Gull Wing

6

TSOP

Rectangular

Plastic/Epoxy

Yes

1

8

230 μA

0.39 %

5 V

5 V

Small Outline, Thin Profile

TSOP6,.11,37

0.037 in (0.95 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G6

1

No

e3

30 s

260 °C (500 °F)

Binary

MAX5633UCB-T

Maxim Integrated

Digital to Analog Converter

Other

Gull Wing

64

QFP

Square

Plastic/Epoxy

Yes

1

BICMOS

16

0.015 %

-4,5,10 V

Flatpack

QFP64,.47SQ,20

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQFP-G64

No

e0

Binary

AD7543JCWE

Maxim Integrated

Digital to Analog Converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2.5 mA

0.024 %

5 V

5 V

Small Outline

SOP16,.4

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary

AD7524JCSE

Maxim Integrated

Digital to Analog Converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

8

500 ns

2 mA

0.2 %

5/15 V

Small Outline

SOP16,.25

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary, Offset Binary

MX7524JN+2

Maxim Integrated

Digital to Analog Converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

8

500 ns

2 mA

0.2 %

5/15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T16

No

e3

Binary, Offset Binary

AD7520UQ/883

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

10

2 mA

0.05 %

15 V

15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

AD7543KCWP

Maxim Integrated

Digital to Analog Converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2.5 mA

0.012 %

5 V

5 V

Small Outline

SOP16,.4

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary

AD7531JC/D

Maxim Integrated

Digital to Analog Converter

Commercial

1

CMOS

12

2 mA

0.2 %

15 V

15 V

DIE OR CHIP

70 °C (158 °F)

0 °C (32 °F)

No

Binary, Offset Binary

MAX5733CUTN

Maxim Integrated

Digital to Analog Converter

Other

No Lead

56

QCCN

Square

Plastic/Epoxy

Yes

32

BICMOS

16

20 µs

0.097 %

3/5,5,10.5 V

Chip Carrier

LCC56,.31SQ,20

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-N56

No

e0

Offset Binary

MAX5383EZT+

Maxim Integrated

Digital to Analog Converter

Industrial

Gull Wing

6

TSOP

Rectangular

Plastic/Epoxy

Yes

1

8

230 μA

0.39 %

3/3.3 V

Small Outline, Thin Profile

TSOP6,.11,37

0.037 in (0.95 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G6

1

No

e3

30 s

260 °C (500 °F)

Binary

MAX530BMRG

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

12

0.048 %

5/±5 V

In-Line

DIP24(UNSPEC)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

e0

20 s

240 °C (464 °F)

Binary, Offset Binary

MAX197BMDI

Maxim Integrated

MAX5732CUTN

Maxim Integrated

Digital to Analog Converter

Other

No Lead

56

QCCN

Square

Plastic/Epoxy

Yes

32

BICMOS

16

20 µs

0.097 %

3/5,5 V

Chip Carrier

LCC56,.31SQ,20

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-N56

No

e0

Offset Binary

MAX5735CUTN

Maxim Integrated

Digital to Analog Converter

Other

No Lead

56

QCCN

Square

Plastic/Epoxy

Yes

32

BICMOS

16

20 µs

0.097 %

±5,3/5 V

Chip Carrier

LCC56,.31SQ,20

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-N56

No

e0

Offset Binary

AD7524KCSE

Maxim Integrated

Digital to Analog Converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

8

500 ns

2 mA

0.1 %

5/15 V

Small Outline

SOP16,.25

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary, Offset Binary

MAX5803AKA+T

Maxim Integrated

Digital to Analog Converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

8

410 μA

0.098 %

2/5,3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.1

0.025 in (0.635 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G8

No

Offset Binary

MAX5703ATB+

Maxim Integrated

Digital to Analog Converter

Automotive

No Lead

10

SON

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

8

410 μA

0.098 %

3/5 V

Small Outline

SOLCC10,.08,20

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-N10

1

No

e4

30 s

260 °C (500 °F)

Offset Binary

MAX5623UCB-T

Maxim Integrated

Digital to Analog Converter

Other

Gull Wing

64

QFP

Square

Plastic/Epoxy

Yes

1

BICMOS

16

0.015 %

-4,5,10 V

Flatpack

QFP64,.47SQ,20

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQFP-G64

No

e0

Binary

AD7543KCWE

Maxim Integrated

Digital to Analog Converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2.5 mA

0.012 %

5 V

5 V

Small Outline

SOP16,.4

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary

AD7530JC/D

Maxim Integrated

Digital to Analog Converter

Commercial

1

CMOS

10

2 mA

0.2 %

15 V

15 V

DIE OR CHIP

70 °C (158 °F)

0 °C (32 °F)

No

Binary, Offset Binary

AD7543TQ/883

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

2.5 mA

0.012 %

5 V

5 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary

MAX5804AKA+T

Maxim Integrated

Digital to Analog Converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

10

410 μA

0.048 %

2/5,3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.1

0.025 in (0.635 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G8

No

Offset Binary

MAX5804ATA+T

Maxim Integrated

Digital to Analog Converter

Automotive

No Lead

8

SON

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

10

410 μA

0.048 %

2/5,3/5 V

Small Outline

SOLCC8,.12,25

0.025 in (0.635 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

R-PDSO-N8

No

Offset Binary

MAX11359AETL

Maxim Integrated

Digital to Analog Converter

Industrial

No Lead

40

QCCN

Square

Plastic/Epoxy

10

Yes

BICMOS

16

1.8/3.6 V

Chip Carrier

LCC40,.24SQ,20

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N40

No

AD7543GTQ/883

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

2.5 mA

0.012 %

5 V

5 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary

MAX5774UCB-T

Maxim Integrated

Digital to Analog Converter

Other

Gull Wing

64

QFP

Square

Plastic/Epoxy

Yes

1

BICMOS

14

20 µs

0.024 %

2.7/5,5 V

Flatpack

QFP64,.47SQ,20

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQFP-G64

No

e0

AD7524UQ/883

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

8

500 ns

2 mA

0.05 %

5/15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

AD7528JC/D

Maxim Integrated

Digital to Analog Converter

Commercial

2

CMOS

8

400 ns

1 mA

0.39 %

5/15 V

DIE OR CHIP

70 °C (158 °F)

0 °C (32 °F)

No

Binary, Offset Binary

AD7524LCSE

Maxim Integrated

Digital to Analog Converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

8

500 ns

2 mA

0.05 %

5/15 V

Small Outline

SOP16,.25

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary, Offset Binary

MAX5803ATA+T

Maxim Integrated

Digital to Analog Converter

Automotive

No Lead

8

SON

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

8

410 μA

0.098 %

2/5,3/5 V

Small Outline

SOLCC8,.12,25

0.025 in (0.635 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N8

1

No

e3

30 s

260 °C (500 °F)

Offset Binary

MAX5632UCB+

Maxim Integrated

Digital to Analog Converter

Other

Gull Wing

64

QFP

Square

Plastic/Epoxy

Yes

1

BICMOS

16

42 mA

0.015 %

-4,5,10 V

Flatpack

QFP64,.47SQ,20

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Quad

S-PQFP-G64

No

Binary

MX7528KN+4

Maxim Integrated

Digital to Analog Converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

2

CMOS

8

400 ns

1 mA

0.2 %

5/15 V

In-Line

DIP20,.3

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T20

e3

Binary, Offset Binary

MX7528LN-4

Maxim Integrated

Digital to Analog Converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

2

CMOS

8

400 ns

1 mA

0.2 %

5/15 V

In-Line

DIP20,.3

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T20

e0

Binary, Offset Binary

MAX5813AUD+

Maxim Integrated

Digital to Analog Converter

Automotive

Gull Wing

14

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

8

1.4 mA

0.0976 %

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP14,.25

0.025 in (0.635 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G14

1

No

e3

30 s

260 °C (500 °F)

Binary
Other Function Converters

Other function converters are specialized electronic devices that perform signal conversion and processing for specific applications. These converters are designed to provide a specific function or task, such as frequency-to-voltage conversion, voltage-to-frequency conversion, or power-to-frequency conversion.

Frequency-to-voltage converters (FVCs) are electronic devices that convert an input frequency signal into an output voltage signal. FVCs are used in applications such as tachometers, speedometers, and frequency counters. Voltage-to-frequency converters (VFCs) are electronic devices that convert an input voltage signal into an output frequency signal. VFCs are used in applications such as waveform generators, signal conditioning circuits, and measurement systems.

Power-to-frequency converters (PFCs) are electronic devices that convert an input power signal into an output frequency signal. PFCs are used in applications such as power monitoring, energy harvesting, and renewable energy systems.

Other function converters may include specialized converters, such as temperature-to-frequency converters, current-to-frequency converters, or phase-locked loop (PLL) frequency synthesizers. These converters are designed to perform specific signal conversion and processing tasks, depending on the application and the required performance.