Other Function Converters

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Manufacturers
    • Ams Ag
    • Analog Devices
    • Bias Power
    • Broadcom
    • Diodes Incorporated
    • Dymec
    • General Electric Solid State
    • Infineon Technologies
    • Maxim Integrated
    • Murata Manufacturing
    • NXP Semiconductors
    • New Japan Radio
    • Onsemi
    • Renesas Electronics
    • STMicroelectronics
    • Samsung
    • Telcom Semiconductor
    • Texas Instruments
    • Thine Electronics
    • Toshiba
    • XP Power
Converter Type
    • Analog to Digital Converter
    • Analog to Digital Converter, Delta-sigma
    • Converter
    • Digital to Analog Converter
Temperature Grade
    • Automotive
    • Commercial
    • Commercial Extended
    • Industrial
    • Military
    • Other
Terminal Form
    • Ball
    • Gull Wing
    • J Bend
    • No Lead
    • Through-Hole
No. of Terminals
    • 10
    • 100
    • 105
    • 112
    • 12
    • 14
    • 144
    • 16
    • 160
    • 18
    • 20
    • 22
    • 24
    • 28
    • 30
    • 32
    • 36
    • 38
    • 40
    • 42
    • 44
    • 48
    • 5
    • 56
    • 6
    • 64
    • 68
    • 72
    • 8
    • 80
    • 84
Package Code
    • DIP
    • FBGA
    • HVQCCN
    • QCCJ
    • QCCN
    • QFP
    • SDIP
    • SON
    • SOP
    • SSOP
    • TSOP
    • TSSOP
Package Shape
    • Rectangular
    • Square
Package Body Material
    • Ceramic
    • Metal
    • Plastic/Epoxy
No. of Analog In Channels
    • 1
    • 10
    • 2
    • 3
    • 6
    • 8
Surface Mount
    • No
    • Yes
Maximum Supply Voltage
    • 12 V
    • 4.25 V
    • 5.5 V
Maximum Analog Input Voltage
    • 3 V
    • 3.6 V
    • 5.3 V
No. of Functions
    • 1
    • 12
    • 2
    • 3
    • 32
    • 4
    • 8
Technology
    • BICMOS
    • Bipolar
    • CMOS
    • Hybrid
    • MOS
Screening Level
    • 38535Q/M;38534H;883B
    • 38535V;38534K;883S
    • AEC-Q100
    • MIL-STD-883 Class B (Modified)
No. of Bits
    • 10
    • 11
    • 12
    • 14
    • 16
    • 18
    • 20
    • 24
    • 4
    • 5
    • 6
    • 8
Maximum Settling Time
    • 0.1 ns
    • 1 µs
    • 1.5 µs
    • 10 ns
    • 10 µs
    • 100 ns
    • 110 ns
    • 12 ns
    • 120 ns
    • 135 ns
    • 15 µs
    • 150 ns
    • 150 µs
    • 18 ns
    • 18 µs
    • 2 µs
    • 20 ns
    • 20 µs
    • 200 ns
    • 25 ns
    • 250 ns
    • 28 ns
    • 28.5 ns
    • 3 µs
    • 300 ns
    • 300 µs
    • 350 ns
    • 375 ns
    • 4 µs
    • 4.5 µs
    • 40 ns
    • 400 ns
    • 5 µs
    • 500 ns
    • 6 ns
    • 600 ns
    • 7 µs
    • 7.4 ns
    • 8 ns
    • 8 µs
    • 800 ns
    • 9 µs
    • 900 ns
Maximum Supply Current
    • 1 mA
    • 1.2 mA
    • 1.4 mA
    • 1.5 mA
    • 1.8 mA
    • 10 mA
    • 10 μA
    • 100 μA
    • 105 mA
    • 11.6 mA
    • 11.69 mA
    • 12 mA
    • 125 μA
    • 13 mA
    • 15 mA
    • 15.5 mA
    • 150 mA
    • 155 mA
    • 16 mA
    • 160 mA
    • 18 mA
    • 183 mA
    • 188 mA
    • 2 mA
    • 2.5 mA
    • 2.6 mA
    • 2.7 mA
    • 20 mA
    • 220 mA
    • 23 mA
    • 230 μA
    • 24 mA
    • 25 mA
    • 250 mA
    • 26.3 mA
    • 260 μA
    • 27 mA
    • 275 mA
    • 28 mA
    • 280 μA
    • 290 mA
    • 3 mA
    • 3.2 mA
    • 3.5 mA
    • 300 mA
    • 330 mA
    • 340 mA
    • 35 mA
    • 358 mA
    • 391 mA
    • 4 mA
    • 40 mA
    • 400 μA
    • 410 μA
    • 42 mA
    • 450 μA
    • 49 mA
    • 5 mA
    • 5.2 mA
    • 5.6 mA
    • 50 mA
    • 580 mA
    • 6 mA
    • 60 mA
    • 600 μA
    • 65 mA
    • 700 μA
    • 72 mA
    • 8.33 mA
    • 80 mA
    • 85 mA
    • 9 μA
    • 9.3 mA
    • 900 μA
Maximum Linearity Error (EL)
    • 0.0003 %
    • 0.0012 %
    • 0.0022 %
    • 0.003 %
    • 0.006 %
    • 0.0061 %
    • 0.01 %
    • 0.012 %
    • 0.0125 %
    • 0.015 %
    • 0.017 %
    • 0.018 %
    • 0.02 %
    • 0.024 %
    • 0.03 %
    • 0.032 %
    • 0.036 %
    • 0.042 %
    • 0.048 %
    • 0.049 %
    • 0.05 %
    • 0.06 %
    • 0.097 %
    • 0.0976 %
    • 0.098 %
    • 0.1 %
    • 0.12 %
    • 0.15 %
    • 0.19 %
    • 0.195 %
    • 0.2 %
    • 0.2148 %
    • 0.24 %
    • 0.31 %
    • 0.39 %
    • 0.4 %
    • 0.429 %
    • 0.45 %
    • 0.58 %
    • 0.59 %
    • 0.78 %
    • 0.8 %
    • 0.9 %
    • 0.98 %
    • 1.17 %
    • 1.61 %
    • 3.9 %
Input Format
    • Parallel, 8 Bits
Nominal Supply Voltage
    • 1.8 V
    • 12 V
    • 15 V
    • 3 V
    • 3.3 V
    • 5 V
Power Supplies (V)
    • -15 V
    • -3,3/5,5,8 V
    • -4,5,10 V
    • -5.2 V
    • 1,3.3 V
    • 1.8,1.8/3.3 V
    • 1.8,3.3 V
    • 1.8/3.3 V
    • 1.8/3.6 V
    • 12 V
    • 12/15 V
    • 12/15, GND/-5 V
    • 12/15,-0.3 V
    • 12/15,-5 V
    • 12/15,GND/-0.3 V
    • 12/15,GND/-12/-15 V
    • 15 V
    • 2.5/5.5 V
    • 2.7/5,5 V
    • 2/5,3/5 V
    • 3 V
    • 3,5 V
    • 3.3 V
    • 3.3,3.3/5 V
    • 3.3,5 V
    • 3/3.3 V
    • 3/3.3,-7.5,15 V
    • 3/5 V
    • 3/5,5 V
    • 3/5,5,10.5 V
    • 3/5,±12/±15 V
    • 3/5,±12/±16.5 V
    • 5 V
    • 5,-12 V
    • 5,-15 V
    • 5,-5.2 V
    • 5,13 V
    • 5,15 V
    • 5,±12/±15 V
    • 5,±15 V
    • 5/15 V
    • 5/15,-15 V
    • 5/±5 V
    • ±10/±15 V
    • ±12/±15 V
    • ±15 V
    • ±5 V
    • ±5,3/5 V
Nominal Negative Supply Voltage
    • -15 V
    • -5 V
    • -5.2 V
Package Style (Meter)
    • Chip Carrier
    • Chip Carrier, Heat Sink/Slug, Very Thin Profile
    • Flatpack
    • Grid Array, Fine Pitch
    • In-Line
    • In-Line, Shrink Pitch
    • Small Outline
    • Small Outline, Shrink Pitch
    • Small Outline, Thin Profile
    • Small Outline, Thin Profile, Shrink Pitch
Package Equivalence Code
    • BGA105,11X11,25
    • BGA12,3X4,20
    • DIE OR CHIP
    • DIP14,.3
    • DIP16,.3
    • DIP18,.3
    • DIP20,.3
    • DIP22,.3
    • DIP22,.4
    • DIP24(UNSPEC)
    • DIP24,.3
    • DIP24,.4
    • DIP24,.6
    • DIP28,.6
    • DIP30,1.8
    • DIP32,.9
    • DIP40,.6
    • DIP42,.6
    • DIP8,.3
    • LCC16,.12SQ,20
    • LCC20,.35SQ
    • LCC28,.45SQ
    • LCC32,.2SQ,20
    • LCC36,.25SQ,20
    • LCC40,.24SQ,20
    • LCC48,.27SQ,20
    • LCC56,.31SQ,20
    • LCC64,.35SQ,20
    • LCC68,.4SQ,20
    • LCC72,.39SQ,20
    • LDCC20,.4SQ
    • LDCC28,.5SQ
    • LDCC44,.7SQ
    • LDCC84,1.2SQ
    • QFP144,1.2SQ
    • QFP160,1.2SQ
    • QFP44,.5SQ,32
    • QFP48,.35SQ,20
    • QFP48,.5X.66,32
    • QFP64,.47SQ,20
    • QFP64,.7X.95,40
    • QFP80,.55SQ,20
    • SDIP24,.3
    • SDIP28,.4
    • SDIP30,.4
    • SOLCC10,.08,20
    • SOLCC10,.11,20
    • SOLCC10,.12,20
    • SOLCC14,.12,20
    • SOLCC8,.12,25
    • SOP16,.25
    • SOP16,.3
    • SOP16,.4
    • SOP20,.3
    • SOP20,.4
    • SOP24,.3
    • SOP24,.3,32
    • SOP24,.4
    • SOP28,.3
    • SOP28,.4
    • SOP28,.5
    • SOP36,.3,32
    • SOP8,.25
    • SSOP16,.25
    • SSOP20,.25
    • SSOP24,.3
    • SSOP28,.3
    • TQFP100,.63SQ
    • TQFP32,.35SQ,32
    • TQFP48,.35SQ
    • TQFP64,.47SQ
    • TQFP64,.63SQ,32
    • TQFP80,.55SQ
    • TSOP5/6,.11,37
    • TSOP6,.11,37
    • TSSOP10,.19,20
    • TSSOP14,.25
    • TSSOP16,.19,20
    • TSSOP16,.25
    • TSSOP20,.25
    • TSSOP28,.25
    • TSSOP38,.25,20
    • TSSOP6,.08
    • TSSOP8,.1
    • TSSOP8,.19
    • TSSOP8,.25
    • WAFER
Minimum Supply Voltage
    • 2.7 V
    • 3 V
    • 4.75 V
Terminal Pitch
    • 0.02 in (0.5 mm)
    • 0.025 in (0.635 mm)
    • 0.026 in (0.65 mm)
    • 0.031 in (0.8 mm)
    • 0.037 in (0.95 mm)
    • 0.039 in (1 mm)
    • 0.05 in (1.27 mm)
    • 0.07 in (1.78 mm)
    • 0.1 in (2.54 mm)
Maximum Operating Temperature
    • 105 °C (221 °F)
    • 115 °C (239 °F)
    • 125 °C (257 °F)
    • 25 °C (77 °F)
    • 60 °C (140 °F)
    • 70 °C (158 °F)
    • 80 °C (176 °F)
    • 85 °C (185 °F)
Minimum Operating Temperature
    • -10 °C (14 °F)
    • -15 °C (5 °F)
    • -20 °C (-4 °F)
    • -25 °C (-13 °F)
    • -30 °C (-22 °F)
    • -40 °C (-40 °F)
    • -55 °C (-67 °F)
    • 0 °C (32 °F)
    • 25 °C (77 °F)
Terminal Finish
    • Gold
    • Matte Tin
    • Matte Tin - annealed
    • Nickel Gold Palladium Silver
    • Nickel Palladium Gold
    • Tin Bismuth
    • Tin Lead
    • Tin Silver Copper
    • Tin Silver Copper Nickel
    • Tin/Lead
    • Tin/Lead (Sn63Pb37)
    • Tin/Lead (Sn85Pb15)
    • Tin/Lead - hot dipped
    • Tin/Silver
Terminal Position
    • Bottom
    • Dual
    • Quad
JESD-30 Code
    • R-MDIP-T24
    • R-MDIP-T32
    • R-PBGA-B12
    • R-PDIP-T14
    • R-PDIP-T16
    • R-PDIP-T20
    • R-PDIP-T22
    • R-PDIP-T24
    • R-PDIP-T28
    • R-PDIP-T30
    • R-PDIP-T40
    • R-PDIP-T42
    • R-PDIP-T8
    • R-PDSO-G10
    • R-PDSO-G14
    • R-PDSO-G16
    • R-PDSO-G20
    • R-PDSO-G24
    • R-PDSO-G28
    • R-PDSO-G36
    • R-PDSO-G38
    • R-PDSO-G5
    • R-PDSO-G6
    • R-PDSO-G8
    • R-PDSO-N10
    • R-PDSO-N14
    • R-PDSO-N8
    • R-PQFP-G48
    • R-PQFP-G64
    • R-XDIP-T14
    • R-XDIP-T16
    • R-XDIP-T18
    • R-XDIP-T20
    • R-XDIP-T22
    • R-XDIP-T24
    • R-XDIP-T28
    • R-XDIP-T30
    • R-XDIP-T32
    • R-XDIP-T40
    • S-MQFP-G160
    • S-PBGA-B105
    • S-PBGA-B112
    • S-PQCC-J20
    • S-PQCC-J28
    • S-PQCC-J44
    • S-PQCC-J84
    • S-PQCC-N16
    • S-PQCC-N32
    • S-PQCC-N36
    • S-PQCC-N40
    • S-PQCC-N48
    • S-PQCC-N56
    • S-PQCC-N64
    • S-PQCC-N68
    • S-PQCC-N72
    • S-PQFP-G100
    • S-PQFP-G160
    • S-PQFP-G32
    • S-PQFP-G44
    • S-PQFP-G48
    • S-PQFP-G64
    • S-PQFP-G80
    • S-XQCC-N16
    • S-XQCC-N20
    • S-XQCC-N28
    • S-XQFP-G144
    • X-PQFP-G80
Moisture Sensitivity Level (MSL)
    • 1
    • 3
Maximum Seated Height
    • 0.039 in (1 mm)
    • 0.078 in (1.99 mm)
    • 0.096 in (2.45 mm)
Width
    • 0.049 in (1.25 mm)
    • 0.118 in (3 mm)
    • 0.208 in (5.29 mm)
    • 0.394 in (10 mm)
Qualification
    • No
JESD-609 Code
    • e0
    • e1
    • e2
    • e3
    • e4
    • e6
Maximum Time At Peak Reflow Temperature (s)
    • 10 s
    • 20 s
    • 30 s
    • 40 s
Peak Reflow Temperature (C)
    • 240 °C (464 °F)
    • 245 °C (473 °F)
    • 260 °C (500 °F)
Length
    • 0.079 in (2 mm)
    • 0.118 in (3 mm)
    • 0.394 in (10 mm)
    • 0.402 in (10.2 mm)
Input Bit Code
    • 2's Complement
    • Binary
    • Binary Coded Decimal
    • Binary, 2'S Complement Binary
    • Binary, Complementary Binary
    • Binary, Complementary Binary, Offset Binary, 2's Complement Binary, 1's Complement Binary, Modified 1's Complement Binary
    • Binary, Offset Binary
    • Binary, Offset Binary, 2's Complentary Binary
    • Binary,Offset Binary
    • Complementary Binary
    • Complementary Binary Coded Decimal
    • Complementary Binary, Complementary Offset Binary
    • Offset Binary
    • Offset Binary, 2's Complement Binary
    • Signed Magnitude
Reset All
Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

LTC2634HUD-LZ12#PBF

Analog Devices

Digital to Analog Converter

Automotive

No Lead

16

QCCN

Square

Plastic/Epoxy

Yes

4

CMOS

12

900 μA

0.06 %

3/5 V

Chip Carrier

LCC16,.12SQ,20

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

No

e3

30 s

260 °C (500 °F)

Binary

LTC2630HSC6-LM10#TR

Analog Devices

Digital to Analog Converter

Automotive

Gull Wing

6

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

10

260 μA

0.98 %

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP6,.08

0.025 in (0.635 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-G6

No

e0

Binary

DAC-14QG/BIN/REG/FAST/2SC/DEGL

Analog Devices

DAC-16QG/2SC/DIR/STND/BIN/NONE

Analog Devices

DAC-14QG/SMD/DIR/STAB/BIN/NONE

Analog Devices

DAC-16QG/2SC/REG/STAB/SMB/NONE

Analog Devices

LTC2634HMSE-HMI10#PBF

Analog Devices

Digital to Analog Converter

Automotive

Gull Wing

10

TSSOP

Rectangular

Plastic/Epoxy

Yes

4

CMOS

10

900 μA

0.097 %

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G10

1

No

e3

30 s

260 °C (500 °F)

Binary

DAC-14QG/BCD/DIR/STAB/SMD/NONE

Analog Devices

HDD-1206SMB

Analog Devices

Digital to Analog Converter

Military

Through-Hole

32

DIP

Rectangular

Metal

No

1

Bipolar

38535Q/M;38534H;883B

12

0.0125 %

5,±15 V

In-Line

DIP32,.9

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-MDIP-T32

No

Complementary Binary, Complementary Offset Binary

DAC-14QG/SMB/DIR/FAST/BCD/NONE

Analog Devices

LTC1669CMS8#TR

Analog Devices

Digital to Analog Converter

Commercial

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

10

125 μA

0.24 %

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G8

No

e0

AD7524SD

Analog Devices

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

8

200 ns

5/15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

AD9768SQ

Analog Devices

Digital to Analog Converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

Bipolar

8

5,-5.2 V

In-Line

DIP18,.3

0.1 in (2.54 mm)

115 °C (239 °F)

-30 °C (-22 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

DAC-16QG/BIN/REG/STAB/BCD/NONE

Analog Devices

ADDAC08/883B

Analog Devices

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

Bipolar

38535Q/M;38534H;883B

8

15 V

±15 V

-15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

LTC2636IMS-LMX12#TR

Analog Devices

Digital to Analog Converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

Yes

8

CMOS

12

1.5 mA

0.06 %

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.19,20

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary

DAC888NBC

Analog Devices

Digital to Analog Converter

Other

1

Bipolar

MIL-STD-883 Class B (Modified)

8

400 ns

0.1 %

5,-12 V

DIE OR CHIP

25 °C (77 °F)

25 °C (77 °F)

No

Binary, Complementary Binary

LTC2636IDE-LZ8

Analog Devices

Digital to Analog Converter

Industrial

No Lead

14

SON

Rectangular

Plastic/Epoxy

Yes

8

CMOS

8

1.5 mA

0.19 %

3/5 V

Small Outline

SOLCC14,.12,20

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-N14

No

e0

Binary

AD9923BBCZ

Analog Devices

Digital to Analog Converter

Other

Ball

105

FBGA

Square

Plastic/Epoxy

1

Yes

3 V

12

3/3.3,-7.5,15 V

Grid Array, Fine Pitch

BGA105,11X11,25

0.025 in (0.635 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Bottom

S-PBGA-B105

No

LTC2630HSC6-HZ8

Analog Devices

Digital to Analog Converter

Automotive

Gull Wing

6

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

8

280 μA

0.19 %

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP6,.08

0.025 in (0.635 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-G6

No

e0

Binary

DAC-14QG/BIN/DIR/STND/SMD/NONE

Analog Devices

LTC2636HMS-LMI10

Analog Devices

Digital to Analog Converter

Automotive

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

Yes

8

CMOS

10

1.5 mA

0.097 %

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.19,20

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary

HDD-1409KM

Analog Devices

Digital to Analog Converter

Other

Through-Hole

32

DIP

Rectangular

Metal

No

1

Bipolar

14

5,±15 V

In-Line

DIP32,.9

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-MDIP-T32

No

e0

Offset Binary, 2's Complement Binary

DAC-16QG/BCD/DIR/FAST/BCD/DEGL

Analog Devices

LTC2630CSC6-HM10#TR

Analog Devices

Digital to Analog Converter

Commercial

Gull Wing

6

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

10

280 μA

0.98 %

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP6,.08

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G6

No

e0

Binary

AD9804JSTZ

Analog Devices

Digital to Analog Converter

Other

Gull Wing

48

QFP

Square

Plastic/Epoxy

1

Yes

3.6 V

CMOS

10

3 V

3 V

Flatpack

QFP48,.35SQ,20

0.02 in (0.5 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Quad

S-PQFP-G48

No

DAC-14QG/BCD/REG/STAB/2SC/DEGL

Analog Devices

LTC2636CDE-LMX10#TR

Analog Devices

Digital to Analog Converter

Commercial

No Lead

14

SON

Rectangular

Plastic/Epoxy

Yes

8

CMOS

10

1.5 mA

0.097 %

3/5 V

Small Outline

SOLCC14,.12,20

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-N14

No

e0

Binary

DAC-16QG/2SC/REG/STAB/SMB/DEGL

Analog Devices

LTC2634HMSE-LMI8#PBF

Analog Devices

Digital to Analog Converter

Automotive

Gull Wing

10

TSSOP

Rectangular

Plastic/Epoxy

Yes

4

CMOS

8

900 μA

0.19 %

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G10

1

No

e3

30 s

260 °C (500 °F)

Binary

DAC-14QG/2SC/REG/STAB/2SC/NONE

Analog Devices

DAC-16QG/SMB/DIR/STND/2SC/NONE

Analog Devices

DAC-14QG/BIN/REG/STND/SMD/NONE

Analog Devices

LTC2633CTS8-HI10#PBF

Analog Devices

Digital to Analog Converter

Commercial

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

10

700 μA

0.098 %

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.1

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

No

e3

30 s

260 °C (500 °F)

Binary

DAC-14QG/2SC/REG/FAST/2SC/NONE

Analog Devices

LTC2636CDE-HZ8

Analog Devices

Digital to Analog Converter

Commercial

No Lead

14

SON

Rectangular

Plastic/Epoxy

Yes

8

CMOS

8

1.5 mA

0.19 %

5 V

5 V

Small Outline

SOLCC14,.12,20

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-N14

No

e0

Binary

DAC-16QG/SMB/DIR/FAST/SMD/NONE

Analog Devices

AD7546KN/+

Analog Devices

Digital to Analog Converter

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

16

In-Line

DIP40,.6

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T40

e0

DAC-14QG/BCD/REG/STND/2SC/NONE

Analog Devices

AD565AJN/BIN

Analog Devices

Digital to Analog Converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

12

250 ns

15 V

±15 V

-15 V

In-Line

DIP24,.6

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T24

No

e0

Binary, Offset Binary

PM7548AR/883

Analog Devices

Digital to Analog Converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

1 µs

3 mA

0.012 %

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP20,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T20

No

e0

Binary,Offset Binary

AD9707ARUZRL7

Analog Devices

Digital to Analog Converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

14

1.8/3.3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G28

No

Binary, 2'S Complement Binary

DAC-14QG/SMD/REG/FAST/SMD/DEGL

Analog Devices

LTC2634HMSE-HZ8#PBF

Analog Devices

Digital to Analog Converter

Automotive

Gull Wing

10

TSSOP

Rectangular

Plastic/Epoxy

Yes

4

CMOS

8

900 μA

0.19 %

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G10

1

No

e3

30 s

260 °C (500 °F)

Binary

DAC-16QG/SMB/DIR/STAB/BCD/NONE

Analog Devices

LTC2634CMSE-LMI10#PBF

Analog Devices

Digital to Analog Converter

Commercial

Gull Wing

10

TSSOP

Rectangular

Plastic/Epoxy

Yes

4

CMOS

10

900 μA

0.097 %

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G10

1

No

e3

30 s

260 °C (500 °F)

Binary

AD565TD

Analog Devices

Digital to Analog Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

12

400 ns

15 V

±15 V

-15 V

In-Line

DIP24,.6

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

Binary, Offset Binary

DAC-14QG/SMB/REG/STAB/SMB/NONE

Analog Devices

Other Function Converters

Other function converters are specialized electronic devices that perform signal conversion and processing for specific applications. These converters are designed to provide a specific function or task, such as frequency-to-voltage conversion, voltage-to-frequency conversion, or power-to-frequency conversion.

Frequency-to-voltage converters (FVCs) are electronic devices that convert an input frequency signal into an output voltage signal. FVCs are used in applications such as tachometers, speedometers, and frequency counters. Voltage-to-frequency converters (VFCs) are electronic devices that convert an input voltage signal into an output frequency signal. VFCs are used in applications such as waveform generators, signal conditioning circuits, and measurement systems.

Power-to-frequency converters (PFCs) are electronic devices that convert an input power signal into an output frequency signal. PFCs are used in applications such as power monitoring, energy harvesting, and renewable energy systems.

Other function converters may include specialized converters, such as temperature-to-frequency converters, current-to-frequency converters, or phase-locked loop (PLL) frequency synthesizers. These converters are designed to perform specific signal conversion and processing tasks, depending on the application and the required performance.