Other Function Converters

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Manufacturers
    • Ams Ag
    • Analog Devices
    • Bias Power
    • Broadcom
    • Diodes Incorporated
    • Dymec
    • General Electric Solid State
    • Infineon Technologies
    • Maxim Integrated
    • Murata Manufacturing
    • NXP Semiconductors
    • New Japan Radio
    • Onsemi
    • Renesas Electronics
    • STMicroelectronics
    • Samsung
    • Telcom Semiconductor
    • Texas Instruments
    • Thine Electronics
    • Toshiba
    • XP Power
Converter Type
    • Analog to Digital Converter
    • Analog to Digital Converter, Delta-sigma
    • Converter
    • Digital to Analog Converter
Temperature Grade
    • Automotive
    • Commercial
    • Commercial Extended
    • Industrial
    • Military
    • Other
Terminal Form
    • Ball
    • Gull Wing
    • J Bend
    • No Lead
    • Through-Hole
No. of Terminals
    • 10
    • 100
    • 105
    • 112
    • 12
    • 14
    • 144
    • 16
    • 160
    • 18
    • 20
    • 22
    • 24
    • 28
    • 30
    • 32
    • 36
    • 38
    • 40
    • 42
    • 44
    • 48
    • 5
    • 56
    • 6
    • 64
    • 68
    • 72
    • 8
    • 80
    • 84
Package Code
    • DIP
    • FBGA
    • HVQCCN
    • QCCJ
    • QCCN
    • QFP
    • SDIP
    • SON
    • SOP
    • SSOP
    • TSOP
    • TSSOP
Package Shape
    • Rectangular
    • Square
Package Body Material
    • Ceramic
    • Metal
    • Plastic/Epoxy
No. of Analog In Channels
    • 1
    • 10
    • 2
    • 3
    • 6
    • 8
Surface Mount
    • No
    • Yes
Maximum Supply Voltage
    • 12 V
    • 4.25 V
    • 5.5 V
Maximum Analog Input Voltage
    • 3 V
    • 3.6 V
    • 5.3 V
No. of Functions
    • 1
    • 12
    • 2
    • 3
    • 32
    • 4
    • 8
Technology
    • BICMOS
    • Bipolar
    • CMOS
    • Hybrid
    • MOS
Screening Level
    • 38535Q/M;38534H;883B
    • 38535V;38534K;883S
    • AEC-Q100
    • MIL-STD-883 Class B (Modified)
No. of Bits
    • 10
    • 11
    • 12
    • 14
    • 16
    • 18
    • 20
    • 24
    • 4
    • 5
    • 6
    • 8
Maximum Settling Time
    • 0.1 ns
    • 1 µs
    • 1.5 µs
    • 10 ns
    • 10 µs
    • 100 ns
    • 110 ns
    • 12 ns
    • 120 ns
    • 135 ns
    • 15 µs
    • 150 ns
    • 150 µs
    • 18 ns
    • 18 µs
    • 2 µs
    • 20 ns
    • 20 µs
    • 200 ns
    • 25 ns
    • 250 ns
    • 28 ns
    • 28.5 ns
    • 3 µs
    • 300 ns
    • 300 µs
    • 350 ns
    • 375 ns
    • 4 µs
    • 4.5 µs
    • 40 ns
    • 400 ns
    • 5 µs
    • 500 ns
    • 6 ns
    • 600 ns
    • 7 µs
    • 7.4 ns
    • 8 ns
    • 8 µs
    • 800 ns
    • 9 µs
    • 900 ns
Maximum Supply Current
    • 1 mA
    • 1.2 mA
    • 1.4 mA
    • 1.5 mA
    • 1.8 mA
    • 10 mA
    • 10 μA
    • 100 μA
    • 105 mA
    • 11.6 mA
    • 11.69 mA
    • 12 mA
    • 125 μA
    • 13 mA
    • 15 mA
    • 15.5 mA
    • 150 mA
    • 155 mA
    • 16 mA
    • 160 mA
    • 18 mA
    • 183 mA
    • 188 mA
    • 2 mA
    • 2.5 mA
    • 2.6 mA
    • 2.7 mA
    • 20 mA
    • 220 mA
    • 23 mA
    • 230 μA
    • 24 mA
    • 25 mA
    • 250 mA
    • 26.3 mA
    • 260 μA
    • 27 mA
    • 275 mA
    • 28 mA
    • 280 μA
    • 290 mA
    • 3 mA
    • 3.2 mA
    • 3.5 mA
    • 300 mA
    • 330 mA
    • 340 mA
    • 35 mA
    • 358 mA
    • 391 mA
    • 4 mA
    • 40 mA
    • 400 μA
    • 410 μA
    • 42 mA
    • 450 μA
    • 49 mA
    • 5 mA
    • 5.2 mA
    • 5.6 mA
    • 50 mA
    • 580 mA
    • 6 mA
    • 60 mA
    • 600 μA
    • 65 mA
    • 700 μA
    • 72 mA
    • 8.33 mA
    • 80 mA
    • 85 mA
    • 9 μA
    • 9.3 mA
    • 900 μA
Maximum Linearity Error (EL)
    • 0.0003 %
    • 0.0012 %
    • 0.0022 %
    • 0.003 %
    • 0.006 %
    • 0.0061 %
    • 0.01 %
    • 0.012 %
    • 0.0125 %
    • 0.015 %
    • 0.017 %
    • 0.018 %
    • 0.02 %
    • 0.024 %
    • 0.03 %
    • 0.032 %
    • 0.036 %
    • 0.042 %
    • 0.048 %
    • 0.049 %
    • 0.05 %
    • 0.06 %
    • 0.097 %
    • 0.0976 %
    • 0.098 %
    • 0.1 %
    • 0.12 %
    • 0.15 %
    • 0.19 %
    • 0.195 %
    • 0.2 %
    • 0.2148 %
    • 0.24 %
    • 0.31 %
    • 0.39 %
    • 0.4 %
    • 0.429 %
    • 0.45 %
    • 0.58 %
    • 0.59 %
    • 0.78 %
    • 0.8 %
    • 0.9 %
    • 0.98 %
    • 1.17 %
    • 1.61 %
    • 3.9 %
Input Format
    • Parallel, 8 Bits
Nominal Supply Voltage
    • 1.8 V
    • 12 V
    • 15 V
    • 3 V
    • 3.3 V
    • 5 V
Power Supplies (V)
    • -15 V
    • -3,3/5,5,8 V
    • -4,5,10 V
    • -5.2 V
    • 1,3.3 V
    • 1.8,1.8/3.3 V
    • 1.8,3.3 V
    • 1.8/3.3 V
    • 1.8/3.6 V
    • 12 V
    • 12/15 V
    • 12/15, GND/-5 V
    • 12/15,-0.3 V
    • 12/15,-5 V
    • 12/15,GND/-0.3 V
    • 12/15,GND/-12/-15 V
    • 15 V
    • 2.5/5.5 V
    • 2.7/5,5 V
    • 2/5,3/5 V
    • 3 V
    • 3,5 V
    • 3.3 V
    • 3.3,3.3/5 V
    • 3.3,5 V
    • 3/3.3 V
    • 3/3.3,-7.5,15 V
    • 3/5 V
    • 3/5,5 V
    • 3/5,5,10.5 V
    • 3/5,±12/±15 V
    • 3/5,±12/±16.5 V
    • 5 V
    • 5,-12 V
    • 5,-15 V
    • 5,-5.2 V
    • 5,13 V
    • 5,15 V
    • 5,±12/±15 V
    • 5,±15 V
    • 5/15 V
    • 5/15,-15 V
    • 5/±5 V
    • ±10/±15 V
    • ±12/±15 V
    • ±15 V
    • ±5 V
    • ±5,3/5 V
Nominal Negative Supply Voltage
    • -15 V
    • -5 V
    • -5.2 V
Package Style (Meter)
    • Chip Carrier
    • Chip Carrier, Heat Sink/Slug, Very Thin Profile
    • Flatpack
    • Grid Array, Fine Pitch
    • In-Line
    • In-Line, Shrink Pitch
    • Small Outline
    • Small Outline, Shrink Pitch
    • Small Outline, Thin Profile
    • Small Outline, Thin Profile, Shrink Pitch
Package Equivalence Code
    • BGA105,11X11,25
    • BGA12,3X4,20
    • DIE OR CHIP
    • DIP14,.3
    • DIP16,.3
    • DIP18,.3
    • DIP20,.3
    • DIP22,.3
    • DIP22,.4
    • DIP24(UNSPEC)
    • DIP24,.3
    • DIP24,.4
    • DIP24,.6
    • DIP28,.6
    • DIP30,1.8
    • DIP32,.9
    • DIP40,.6
    • DIP42,.6
    • DIP8,.3
    • LCC16,.12SQ,20
    • LCC20,.35SQ
    • LCC28,.45SQ
    • LCC32,.2SQ,20
    • LCC36,.25SQ,20
    • LCC40,.24SQ,20
    • LCC48,.27SQ,20
    • LCC56,.31SQ,20
    • LCC64,.35SQ,20
    • LCC68,.4SQ,20
    • LCC72,.39SQ,20
    • LDCC20,.4SQ
    • LDCC28,.5SQ
    • LDCC44,.7SQ
    • LDCC84,1.2SQ
    • QFP144,1.2SQ
    • QFP160,1.2SQ
    • QFP44,.5SQ,32
    • QFP48,.35SQ,20
    • QFP48,.5X.66,32
    • QFP64,.47SQ,20
    • QFP64,.7X.95,40
    • QFP80,.55SQ,20
    • SDIP24,.3
    • SDIP28,.4
    • SDIP30,.4
    • SOLCC10,.08,20
    • SOLCC10,.11,20
    • SOLCC10,.12,20
    • SOLCC14,.12,20
    • SOLCC8,.12,25
    • SOP16,.25
    • SOP16,.3
    • SOP16,.4
    • SOP20,.3
    • SOP20,.4
    • SOP24,.3
    • SOP24,.3,32
    • SOP24,.4
    • SOP28,.3
    • SOP28,.4
    • SOP28,.5
    • SOP36,.3,32
    • SOP8,.25
    • SSOP16,.25
    • SSOP20,.25
    • SSOP24,.3
    • SSOP28,.3
    • TQFP100,.63SQ
    • TQFP32,.35SQ,32
    • TQFP48,.35SQ
    • TQFP64,.47SQ
    • TQFP64,.63SQ,32
    • TQFP80,.55SQ
    • TSOP5/6,.11,37
    • TSOP6,.11,37
    • TSSOP10,.19,20
    • TSSOP14,.25
    • TSSOP16,.19,20
    • TSSOP16,.25
    • TSSOP20,.25
    • TSSOP28,.25
    • TSSOP38,.25,20
    • TSSOP6,.08
    • TSSOP8,.1
    • TSSOP8,.19
    • TSSOP8,.25
    • WAFER
Minimum Supply Voltage
    • 2.7 V
    • 3 V
    • 4.75 V
Terminal Pitch
    • 0.02 in (0.5 mm)
    • 0.025 in (0.635 mm)
    • 0.026 in (0.65 mm)
    • 0.031 in (0.8 mm)
    • 0.037 in (0.95 mm)
    • 0.039 in (1 mm)
    • 0.05 in (1.27 mm)
    • 0.07 in (1.78 mm)
    • 0.1 in (2.54 mm)
Maximum Operating Temperature
    • 105 °C (221 °F)
    • 115 °C (239 °F)
    • 125 °C (257 °F)
    • 25 °C (77 °F)
    • 60 °C (140 °F)
    • 70 °C (158 °F)
    • 80 °C (176 °F)
    • 85 °C (185 °F)
Minimum Operating Temperature
    • -10 °C (14 °F)
    • -15 °C (5 °F)
    • -20 °C (-4 °F)
    • -25 °C (-13 °F)
    • -30 °C (-22 °F)
    • -40 °C (-40 °F)
    • -55 °C (-67 °F)
    • 0 °C (32 °F)
    • 25 °C (77 °F)
Terminal Finish
    • Gold
    • Matte Tin
    • Matte Tin - annealed
    • Nickel Gold Palladium Silver
    • Nickel Palladium Gold
    • Tin Bismuth
    • Tin Lead
    • Tin Silver Copper
    • Tin Silver Copper Nickel
    • Tin/Lead
    • Tin/Lead (Sn63Pb37)
    • Tin/Lead (Sn85Pb15)
    • Tin/Lead - hot dipped
    • Tin/Silver
Terminal Position
    • Bottom
    • Dual
    • Quad
JESD-30 Code
    • R-MDIP-T24
    • R-MDIP-T32
    • R-PBGA-B12
    • R-PDIP-T14
    • R-PDIP-T16
    • R-PDIP-T20
    • R-PDIP-T22
    • R-PDIP-T24
    • R-PDIP-T28
    • R-PDIP-T30
    • R-PDIP-T40
    • R-PDIP-T42
    • R-PDIP-T8
    • R-PDSO-G10
    • R-PDSO-G14
    • R-PDSO-G16
    • R-PDSO-G20
    • R-PDSO-G24
    • R-PDSO-G28
    • R-PDSO-G36
    • R-PDSO-G38
    • R-PDSO-G5
    • R-PDSO-G6
    • R-PDSO-G8
    • R-PDSO-N10
    • R-PDSO-N14
    • R-PDSO-N8
    • R-PQFP-G48
    • R-PQFP-G64
    • R-XDIP-T14
    • R-XDIP-T16
    • R-XDIP-T18
    • R-XDIP-T20
    • R-XDIP-T22
    • R-XDIP-T24
    • R-XDIP-T28
    • R-XDIP-T30
    • R-XDIP-T32
    • R-XDIP-T40
    • S-MQFP-G160
    • S-PBGA-B105
    • S-PBGA-B112
    • S-PQCC-J20
    • S-PQCC-J28
    • S-PQCC-J44
    • S-PQCC-J84
    • S-PQCC-N16
    • S-PQCC-N32
    • S-PQCC-N36
    • S-PQCC-N40
    • S-PQCC-N48
    • S-PQCC-N56
    • S-PQCC-N64
    • S-PQCC-N68
    • S-PQCC-N72
    • S-PQFP-G100
    • S-PQFP-G160
    • S-PQFP-G32
    • S-PQFP-G44
    • S-PQFP-G48
    • S-PQFP-G64
    • S-PQFP-G80
    • S-XQCC-N16
    • S-XQCC-N20
    • S-XQCC-N28
    • S-XQFP-G144
    • X-PQFP-G80
Moisture Sensitivity Level (MSL)
    • 1
    • 3
Maximum Seated Height
    • 0.039 in (1 mm)
    • 0.078 in (1.99 mm)
    • 0.096 in (2.45 mm)
Width
    • 0.049 in (1.25 mm)
    • 0.118 in (3 mm)
    • 0.208 in (5.29 mm)
    • 0.394 in (10 mm)
Qualification
    • No
JESD-609 Code
    • e0
    • e1
    • e2
    • e3
    • e4
    • e6
Maximum Time At Peak Reflow Temperature (s)
    • 10 s
    • 20 s
    • 30 s
    • 40 s
Peak Reflow Temperature (C)
    • 240 °C (464 °F)
    • 245 °C (473 °F)
    • 260 °C (500 °F)
Length
    • 0.079 in (2 mm)
    • 0.118 in (3 mm)
    • 0.394 in (10 mm)
    • 0.402 in (10.2 mm)
Input Bit Code
    • 2's Complement
    • Binary
    • Binary Coded Decimal
    • Binary, 2'S Complement Binary
    • Binary, Complementary Binary
    • Binary, Complementary Binary, Offset Binary, 2's Complement Binary, 1's Complement Binary, Modified 1's Complement Binary
    • Binary, Offset Binary
    • Binary, Offset Binary, 2's Complentary Binary
    • Binary,Offset Binary
    • Complementary Binary
    • Complementary Binary Coded Decimal
    • Complementary Binary, Complementary Offset Binary
    • Offset Binary
    • Offset Binary, 2's Complement Binary
    • Signed Magnitude
Reset All
Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

MAX5815AWC+

Analog Devices

Digital to Analog Converter

Automotive

Ball

12

FBGA

Rectangular

Plastic/Epoxy

Yes

4

BICMOS

12

1.5 mA

0.024 %

3/5 V

Grid Array, Fine Pitch

BGA12,3X4,20

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B12

1

No

e2

30 s

260 °C (500 °F)

Binary

AD7541QTQ/883B

Analog Devices

Digital to Analog Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

1 µs

2 mA

0.012 %

15 V

15 V

In-Line

DIP18,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

MAX7628BQ

Analog Devices

Digital to Analog Converter

Other

Through-Hole

20

DIP

Rectangular

Ceramic

No

2

CMOS

8

12/15 V

In-Line

DIP20,.3

0.1 in (2.54 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Tin Lead

Dual

R-XDIP-T20

e0

Binary, Offset Binary

MAX7581CQ

Analog Devices

MX7543GTQ/883

Analog Devices

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

2.5 mA

0.012 %

5 V

5 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T16

No

e0

Binary

MAX7581AD

Analog Devices

MAX5155MJEE

Analog Devices

DS4302U-019+

Analog Devices

Digital to Analog Converter

Industrial

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

5

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G8

No

MAX5383EUT+

Analog Devices

Digital to Analog Converter

Industrial

Gull Wing

6

TSOP

Rectangular

Plastic/Epoxy

Yes

1

8

230 μA

0.39 %

3/3.3 V

Small Outline, Thin Profile

TSOP6,.11,37

0.037 in (0.95 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G6

1

No

e3

30 s

260 °C (500 °F)

Binary

MAX114ENG+

Analog Devices

Matte Tin - annealed

1

e3

30 s

260 °C (500 °F)

MX7533TQ/883

Analog Devices

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

10

800 ns

2 mA

0.1 %

15 V

15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

MX7524TQ/883

Analog Devices

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

8

500 ns

2 mA

0.1 %

5/15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

MX7528SQ/883

Analog Devices

Digital to Analog Converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

2

CMOS

38535Q/M;38534H;883B

8

400 ns

1 mA

0.39 %

5/15 V

In-Line

DIP20,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

No

e0

Binary, Offset Binary

AD7541JC/D

Analog Devices

Digital to Analog Converter

Commercial

1

CMOS

12

1 µs

2 mA

0.024 %

15 V

15 V

DIE OR CHIP

70 °C (158 °F)

0 °C (32 °F)

No

Binary, Offset Binary

AD7628KCWP

Analog Devices

Digital to Analog Converter

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

Yes

2

CMOS

8

400 ns

2 mA

0.2 %

12/15 V

Small Outline

SOP20,.4

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G20

No

e0

Binary, Offset Binary

MAX7581JCWI

Analog Devices

DS4302Z-019+TR

Analog Devices

Digital to Analog Converter

Industrial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

Yes

1

5

5 V

5 V

Small Outline

SOP8,.25

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G8

No

MAX7581TQ

Analog Devices

DS4302Z-019+

Analog Devices

Digital to Analog Converter

Industrial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

Yes

1

5

5 V

5 V

Small Outline

SOP8,.25

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G8

No

DS4302U-020+TR

Analog Devices

Digital to Analog Converter

Industrial

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

5

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G8

No

MX7845JC/D

Analog Devices

Digital to Analog Converter

Commercial

1

BICMOS

12

5 µs

10 mA

0.024 %

15 V

±15 V

-15 V

DIE OR CHIP

70 °C (158 °F)

0 °C (32 °F)

No

Binary, Offset Binary

LC78816V

Onsemi

Digital to Analog Converter

Gull Wing

24

SSOP

Rectangular

Plastic/Epoxy

Yes

2

CMOS

16

5 V

5 V

Small Outline, Shrink Pitch

SSOP24,.3

0.025 in (0.635 mm)

Dual

R-PDSO-G24

No

LC78816

Onsemi

Digital to Analog Converter

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

2

CMOS

16

5 V

5 V

In-Line

DIP20,.3

0.1 in (2.54 mm)

Dual

R-PDIP-T20

No

LC99059-MJ9

Onsemi

Digital to Analog Converter

Commercial

Gull Wing

80

QFP

Square

Plastic/Epoxy

1

Yes

CMOS

8

5 V

5 V

Flatpack

QFP80,.55SQ,20

0.02 in (0.5 mm)

60 °C (140 °F)

-15 °C (5 °F)

Quad

S-PQFP-G80

No

LC78833V

Onsemi

Digital to Analog Converter

Other

Gull Wing

24

SSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

16

3/5 V

Small Outline, Shrink Pitch

SSOP24,.3

0.025 in (0.635 mm)

70 °C (158 °F)

-30 °C (-22 °F)

Dual

R-PDSO-G24

No

2's Complement

LC89080

Onsemi

Digital to Analog Converter

Other

Through-Hole

42

DIP

Rectangular

Plastic/Epoxy

No

3

8

0.19 %

5 V

5 V

In-Line

DIP42,.6

0.1 in (2.54 mm)

70 °C (158 °F)

-30 °C (-22 °F)

Dual

R-PDIP-T42

No

Binary

LC78855KM

Onsemi

Digital to Analog Converter

Other

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

2

CMOS

16

5 V

5 V

Small Outline

SOP28,.4

0.05 in (1.27 mm)

70 °C (158 °F)

-30 °C (-22 °F)

Dual

R-PDSO-G28

No

TS8306FP

STMicroelectronics

FLI2300-LF-CF

STMicroelectronics

TS8306P

STMicroelectronics

STG1700J-13Z

STMicroelectronics

Digital to Analog Converter

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

Yes

3

CMOS

8

7.4 ns

340 mA

0.59 %

5 V

5 V

Chip Carrier

LDCC44,.7SQ

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J44

No

e0

IMSG173J-66Z

STMicroelectronics

Digital to Analog Converter

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

Yes

3

CMOS

6

250 mA

0.78 %

5 V

5 V

Chip Carrier

LDCC44,.7SQ

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J44

No

e0

STW521062/HF

STMicroelectronics

L291B

STMicroelectronics

Digital to Analog Converter

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

5

10 mA

1.61 %

±10/±15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

Tin Lead

Dual

R-PDIP-T16

No

e0

Binary

FLI2310

STMicroelectronics

IMSG173P-66S

STMicroelectronics

Digital to Analog Converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

6

250 mA

0.78 %

5 V

5 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

STW520062T/HF

STMicroelectronics

TS8306C

STMicroelectronics

FLI2310-LF-BD

STMicroelectronics

IMSG174J-80Z

STMicroelectronics

Digital to Analog Converter

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

Yes

3

CMOS

8

250 mA

0.39 %

5 V

5 V

Chip Carrier

LDCC44,.7SQ

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J44

No

e0

STW521062T/HF

STMicroelectronics

TS8408P

STMicroelectronics

EF9369P30

STMicroelectronics

Digital to Analog Converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

3

MOS

4

5 V

5 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

TS8428P

STMicroelectronics

TS8307J

STMicroelectronics

FLI2310-LF-CF

STMicroelectronics

IMSG174J-66Z

STMicroelectronics

Digital to Analog Converter

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

Yes

3

CMOS

8

250 mA

0.39 %

5 V

5 V

Chip Carrier

LDCC44,.7SQ

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J44

No

e0

EF9369FN

STMicroelectronics

Digital to Analog Converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

3

MOS

4

5 V

5 V

Chip Carrier

LDCC28,.5SQ

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J28

No

e0

Other Function Converters

Other function converters are specialized electronic devices that perform signal conversion and processing for specific applications. These converters are designed to provide a specific function or task, such as frequency-to-voltage conversion, voltage-to-frequency conversion, or power-to-frequency conversion.

Frequency-to-voltage converters (FVCs) are electronic devices that convert an input frequency signal into an output voltage signal. FVCs are used in applications such as tachometers, speedometers, and frequency counters. Voltage-to-frequency converters (VFCs) are electronic devices that convert an input voltage signal into an output frequency signal. VFCs are used in applications such as waveform generators, signal conditioning circuits, and measurement systems.

Power-to-frequency converters (PFCs) are electronic devices that convert an input power signal into an output frequency signal. PFCs are used in applications such as power monitoring, energy harvesting, and renewable energy systems.

Other function converters may include specialized converters, such as temperature-to-frequency converters, current-to-frequency converters, or phase-locked loop (PLL) frequency synthesizers. These converters are designed to perform specific signal conversion and processing tasks, depending on the application and the required performance.