WIRE Current Regulator Diodes 17

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Part RoHS Manufacturer Diode Type Terminal Position Terminal Form No. of Terminals Surface Mount Package Shape Package Body Material Config Technology No. of Elements Nominal Regulation Current (Ireg) Package Style (Meter) Sub-Category Maximum Repetitive Peak Reverse Voltage Maximum Knee Impedance Maximum Operating Temperature Maximum Limiting Voltage Minimum Operating Temperature Terminal Finish Minimum Dynamic Impedance JESD-30 Code Moisture Sensitivity Level (MSL) Case Connection Qualification Maximum Power Dissipation Additional Features JEDEC-95 Code JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Diode Element Material Reference Standard

1N5297

Microchip Technology

CURRENT REGULATOR DIODE

AXIAL

WIRE

2

NO

ROUND

UNSPECIFIED

SINGLE

FIELD EFFECT

1

1 mA

LONG FORM

100 V

205000 ohm

175 Cel

1.35 V

-55 Cel

TIN LEAD

O-XALF-W2

ISOLATED

Not Qualified

.5 W

METALLURGICALLY BONDED

DO-35

e0

SILICON

1N5306

Microchip Technology

CURRENT REGULATOR DIODE

AXIAL

WIRE

2

NO

ROUND

UNSPECIFIED

SINGLE

FIELD EFFECT

1

2.2 mA

LONG FORM

100 V

52000 ohm

175 Cel

1.95 V

-55 Cel

TIN LEAD

O-XALF-W2

ISOLATED

Not Qualified

.5 W

METALLURGICALLY BONDED

DO-35

e0

SILICON

J505

Vishay Intertechnology

CURRENT REGULATOR DIODE

BOTTOM

WIRE

2

NO

ROUND

PLASTIC/EPOXY

SINGLE

FIELD EFFECT

1

1 mA

CYLINDRICAL

Current Regulator Diodes

50 V

2.1 V

Tin/Lead (Sn/Pb)

500000 ohm

O-PBCY-W2

.35 W

e0

SILICON

JAN1N5297-1

Microchip Technology

CURRENT REGULATOR DIODE

AXIAL

WIRE

2

NO

ROUND

UNSPECIFIED

SINGLE

FIELD EFFECT

1

1 mA

LONG FORM

1.35 V

TIN LEAD

O-XALF-W2

ISOLATED

Qualified

.5 W

METALLURGICALLY BONDED

DO-35

e0

SILICON

MIL-19500/463

1N5314-1

Microchip Technology

CURRENT REGULATOR DIODE

AXIAL

WIRE

2

NO

ROUND

UNSPECIFIED

SINGLE

FIELD EFFECT

1

4.7 mA

LONG FORM

2.9 V

TIN LEAD

O-XALF-W2

ISOLATED

Not Qualified

.5 W

METALLURGICALLY BONDED

DO-35

e0

SILICON

1N5314-1E3/TR

Microchip Technology

CURRENT REGULATOR DIODE

AXIAL

WIRE

2

NO

ROUND

GLASS

SINGLE

FIELD EFFECT

1

4.7 mA

LONG FORM

100 V

12000 ohm

175 Cel

2.9 V

-65 Cel

Matte Tin (Sn)

235000 ohm

O-LALF-W2

ISOLATED

.5 W

HIGH SOURCE IMPEDANCE

DO-7

e3

SILICON

JAN1N5314-1

Microchip Technology

CURRENT REGULATOR DIODE

AXIAL

WIRE

2

NO

ROUND

UNSPECIFIED

SINGLE

FIELD EFFECT

1

4.7 mA

LONG FORM

2.9 V

TIN LEAD

O-XALF-W2

ISOLATED

Qualified

.5 W

METALLURGICALLY BONDED

DO-35

e0

SILICON

MIL-19500/463

JANTX1N5314-1

Microchip Technology

CURRENT REGULATOR DIODE

AXIAL

WIRE

2

NO

ROUND

UNSPECIFIED

SINGLE

FIELD EFFECT

1

4.7 mA

LONG FORM

2.9 V

TIN LEAD

O-XALF-W2

ISOLATED

Qualified

.5 W

METALLURGICALLY BONDED

DO-35

e0

SILICON

MIL-19500/463

JANTXV1N5314-1

Microchip Technology

CURRENT REGULATOR DIODE

AXIAL

WIRE

2

NO

ROUND

UNSPECIFIED

SINGLE

FIELD EFFECT

1

4.7 mA

LONG FORM

2.9 V

TIN LEAD

O-XALF-W2

ISOLATED

Qualified

.5 W

METALLURGICALLY BONDED

DO-35

e0

SILICON

MIL-19500/463

1N5314

Microchip Technology

CURRENT REGULATOR DIODE

AXIAL

WIRE

2

NO

ROUND

UNSPECIFIED

SINGLE

FIELD EFFECT

1

4.7 mA

LONG FORM

100 V

12000 ohm

175 Cel

2.9 V

-55 Cel

TIN LEAD

O-XALF-W2

ISOLATED

Not Qualified

.5 W

METALLURGICALLY BONDED

DO-35

e0

SILICON

1N5314TR

Central Semiconductor

CURRENT REGULATOR DIODE

AXIAL

WIRE

2

NO

ROUND

GLASS

SINGLE

FIELD EFFECT

1

4.7 mA

LONG FORM

200 Cel

2.9 V

-65 Cel

TIN LEAD

O-LALF-W2

ISOLATED

Not Qualified

.6 W

HIGH RELIABILITY

DO-35

e0

SILICON

1N5306TR

Central Semiconductor

CURRENT REGULATOR DIODE

AXIAL

WIRE

2

NO

ROUND

GLASS

SINGLE

FIELD EFFECT

1

2.2 mA

LONG FORM

200 Cel

1.95 V

-65 Cel

TIN LEAD

O-LALF-W2

ISOLATED

Not Qualified

.6 W

HIGH RELIABILITY

DO-35

e0

SILICON

JANS1N5306-1

Microchip Technology

CURRENT REGULATOR DIODE

AXIAL

WIRE

2

NO

ROUND

UNSPECIFIED

SINGLE

FIELD EFFECT

1

2.2 mA

LONG FORM

1.95 V

TIN LEAD

O-XALF-W2

ISOLATED

Qualified

.5 W

METALLURGICALLY BONDED

DO-35

e0

SILICON

MIL-19500/463

1N5297-1E3

Microchip Technology

CURRENT REGULATOR DIODE

AXIAL

WIRE

2

NO

ROUND

GLASS

SINGLE

FIELD EFFECT

1

1 mA

LONG FORM

Current Regulator Diodes

100 V

175 Cel

1.35 V

-65 Cel

MATTE TIN

800000 ohm

O-LALF-W2

ISOLATED

.5 W

METALLURGICALLY BONDED, HIGH SOURCE IMPEDANCE

DO-7

e3

SILICON

1N5297TR

Central Semiconductor

CURRENT REGULATOR DIODE

AXIAL

WIRE

2

NO

ROUND

GLASS

SINGLE

FIELD EFFECT

1

1 mA

LONG FORM

200 Cel

1.35 V

-65 Cel

TIN LEAD

O-LALF-W2

ISOLATED

Not Qualified

.6 W

HIGH RELIABILITY

DO-35

e0

SILICON

JANTX1N5297-1

Microchip Technology

CURRENT REGULATOR DIODE

AXIAL

WIRE

2

NO

ROUND

UNSPECIFIED

SINGLE

FIELD EFFECT

1

1 mA

LONG FORM

175 Cel

1.35 V

-65 Cel

TIN LEAD

O-XALF-W2

ISOLATED

Qualified

.5 W

METALLURGICALLY BONDED

DO-35

e0

SILICON

MIL-19500/463

JANTXV1N5297-1

Microchip Technology

CURRENT REGULATOR DIODE

AXIAL

WIRE

2

NO

ROUND

UNSPECIFIED

SINGLE

FIELD EFFECT

1

1 mA

LONG FORM

1.35 V

TIN LEAD

O-XALF-W2

ISOLATED

Qualified

.5 W

METALLURGICALLY BONDED

DO-35

e0

SILICON

MIL-19500/463

Current Regulator Diodes

Current regulator diodes, also known as constant current diodes, are electronic components used to regulate the current flowing through a circuit. They are designed to provide a constant current independent of the voltage applied to the circuit.

Current regulator diodes work by maintaining a constant voltage drop across the diode, which in turn maintains a constant current through the circuit. The voltage drop is determined by the internal structure of the diode, which is typically made up of a P-N junction and a resistor.

Current regulator diodes are commonly used in electronic circuits that require a constant current, such as LED drivers, voltage regulators, and battery chargers. They offer several advantages over other types of current regulation, such as simplicity, low cost, and high reliability.

Current regulator diodes come in different package sizes and current ratings, depending on the application and the required performance. They can be integrated into a circuit board or mounted in a separate enclosure, depending on the application and the space available.