Part | RoHS | Manufacturer | Diode Type | Terminal Position | Terminal Form | No. of Terminals | Surface Mount | Package Shape | Package Body Material | Config | Technology | No. of Elements | Nominal Regulation Current (Ireg) | Package Style (Meter) | Sub-Category | Maximum Repetitive Peak Reverse Voltage | Maximum Knee Impedance | Maximum Operating Temperature | Maximum Limiting Voltage | Minimum Operating Temperature | Terminal Finish | Minimum Dynamic Impedance | JESD-30 Code | Moisture Sensitivity Level (MSL) | Case Connection | Qualification | Maximum Power Dissipation | Additional Features | JEDEC-95 Code | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Diode Element Material | Reference Standard |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
CURRENT REGULATOR DIODE |
AXIAL |
WIRE |
2 |
NO |
ROUND |
UNSPECIFIED |
SINGLE |
FIELD EFFECT |
1 |
1 mA |
LONG FORM |
100 V |
205000 ohm |
175 Cel |
1.35 V |
-55 Cel |
TIN LEAD |
O-XALF-W2 |
ISOLATED |
Not Qualified |
.5 W |
METALLURGICALLY BONDED |
DO-35 |
e0 |
SILICON |
||||||||
Microchip Technology |
CURRENT REGULATOR DIODE |
AXIAL |
WIRE |
2 |
NO |
ROUND |
UNSPECIFIED |
SINGLE |
FIELD EFFECT |
1 |
2.2 mA |
LONG FORM |
100 V |
52000 ohm |
175 Cel |
1.95 V |
-55 Cel |
TIN LEAD |
O-XALF-W2 |
ISOLATED |
Not Qualified |
.5 W |
METALLURGICALLY BONDED |
DO-35 |
e0 |
SILICON |
||||||||
Microchip Technology |
CURRENT REGULATOR DIODE |
AXIAL |
WIRE |
2 |
NO |
ROUND |
UNSPECIFIED |
SINGLE |
FIELD EFFECT |
1 |
1 mA |
LONG FORM |
1.35 V |
TIN LEAD |
O-XALF-W2 |
ISOLATED |
Qualified |
.5 W |
METALLURGICALLY BONDED |
DO-35 |
e0 |
SILICON |
MIL-19500/463 |
|||||||||||
Microchip Technology |
CURRENT REGULATOR DIODE |
AXIAL |
WIRE |
2 |
NO |
ROUND |
UNSPECIFIED |
SINGLE |
FIELD EFFECT |
1 |
4.7 mA |
LONG FORM |
2.9 V |
TIN LEAD |
O-XALF-W2 |
ISOLATED |
Not Qualified |
.5 W |
METALLURGICALLY BONDED |
DO-35 |
e0 |
SILICON |
||||||||||||
|
Microchip Technology |
CURRENT REGULATOR DIODE |
AXIAL |
WIRE |
2 |
NO |
ROUND |
GLASS |
SINGLE |
FIELD EFFECT |
1 |
4.7 mA |
LONG FORM |
100 V |
12000 ohm |
175 Cel |
2.9 V |
-65 Cel |
Matte Tin (Sn) |
235000 ohm |
O-LALF-W2 |
ISOLATED |
.5 W |
HIGH SOURCE IMPEDANCE |
DO-7 |
e3 |
SILICON |
|||||||
Microchip Technology |
CURRENT REGULATOR DIODE |
AXIAL |
WIRE |
2 |
NO |
ROUND |
UNSPECIFIED |
SINGLE |
FIELD EFFECT |
1 |
4.7 mA |
LONG FORM |
2.9 V |
TIN LEAD |
O-XALF-W2 |
ISOLATED |
Qualified |
.5 W |
METALLURGICALLY BONDED |
DO-35 |
e0 |
SILICON |
MIL-19500/463 |
|||||||||||
Microchip Technology |
CURRENT REGULATOR DIODE |
AXIAL |
WIRE |
2 |
NO |
ROUND |
UNSPECIFIED |
SINGLE |
FIELD EFFECT |
1 |
4.7 mA |
LONG FORM |
2.9 V |
TIN LEAD |
O-XALF-W2 |
ISOLATED |
Qualified |
.5 W |
METALLURGICALLY BONDED |
DO-35 |
e0 |
SILICON |
MIL-19500/463 |
|||||||||||
Microchip Technology |
CURRENT REGULATOR DIODE |
AXIAL |
WIRE |
2 |
NO |
ROUND |
UNSPECIFIED |
SINGLE |
FIELD EFFECT |
1 |
4.7 mA |
LONG FORM |
2.9 V |
TIN LEAD |
O-XALF-W2 |
ISOLATED |
Qualified |
.5 W |
METALLURGICALLY BONDED |
DO-35 |
e0 |
SILICON |
MIL-19500/463 |
|||||||||||
Microchip Technology |
CURRENT REGULATOR DIODE |
AXIAL |
WIRE |
2 |
NO |
ROUND |
UNSPECIFIED |
SINGLE |
FIELD EFFECT |
1 |
4.7 mA |
LONG FORM |
100 V |
12000 ohm |
175 Cel |
2.9 V |
-55 Cel |
TIN LEAD |
O-XALF-W2 |
ISOLATED |
Not Qualified |
.5 W |
METALLURGICALLY BONDED |
DO-35 |
e0 |
SILICON |
||||||||
Central Semiconductor |
CURRENT REGULATOR DIODE |
AXIAL |
WIRE |
2 |
NO |
ROUND |
GLASS |
SINGLE |
FIELD EFFECT |
1 |
4.7 mA |
LONG FORM |
200 Cel |
2.9 V |
-65 Cel |
TIN LEAD |
O-LALF-W2 |
ISOLATED |
Not Qualified |
.6 W |
HIGH RELIABILITY |
DO-35 |
e0 |
SILICON |
||||||||||
Central Semiconductor |
CURRENT REGULATOR DIODE |
AXIAL |
WIRE |
2 |
NO |
ROUND |
GLASS |
SINGLE |
FIELD EFFECT |
1 |
2.2 mA |
LONG FORM |
200 Cel |
1.95 V |
-65 Cel |
TIN LEAD |
O-LALF-W2 |
ISOLATED |
Not Qualified |
.6 W |
HIGH RELIABILITY |
DO-35 |
e0 |
SILICON |
||||||||||
Microchip Technology |
CURRENT REGULATOR DIODE |
AXIAL |
WIRE |
2 |
NO |
ROUND |
UNSPECIFIED |
SINGLE |
FIELD EFFECT |
1 |
2.2 mA |
LONG FORM |
1.95 V |
TIN LEAD |
O-XALF-W2 |
ISOLATED |
Qualified |
.5 W |
METALLURGICALLY BONDED |
DO-35 |
e0 |
SILICON |
MIL-19500/463 |
|||||||||||
|
Microchip Technology |
CURRENT REGULATOR DIODE |
AXIAL |
WIRE |
2 |
NO |
ROUND |
GLASS |
SINGLE |
FIELD EFFECT |
1 |
1 mA |
LONG FORM |
Current Regulator Diodes |
100 V |
175 Cel |
1.35 V |
-65 Cel |
MATTE TIN |
800000 ohm |
O-LALF-W2 |
ISOLATED |
.5 W |
METALLURGICALLY BONDED, HIGH SOURCE IMPEDANCE |
DO-7 |
e3 |
SILICON |
|||||||
Central Semiconductor |
CURRENT REGULATOR DIODE |
AXIAL |
WIRE |
2 |
NO |
ROUND |
GLASS |
SINGLE |
FIELD EFFECT |
1 |
1 mA |
LONG FORM |
200 Cel |
1.35 V |
-65 Cel |
TIN LEAD |
O-LALF-W2 |
ISOLATED |
Not Qualified |
.6 W |
HIGH RELIABILITY |
DO-35 |
e0 |
SILICON |
||||||||||
Microchip Technology |
CURRENT REGULATOR DIODE |
AXIAL |
WIRE |
2 |
NO |
ROUND |
UNSPECIFIED |
SINGLE |
FIELD EFFECT |
1 |
1 mA |
LONG FORM |
175 Cel |
1.35 V |
-65 Cel |
TIN LEAD |
O-XALF-W2 |
ISOLATED |
Qualified |
.5 W |
METALLURGICALLY BONDED |
DO-35 |
e0 |
SILICON |
MIL-19500/463 |
|||||||||
Microchip Technology |
CURRENT REGULATOR DIODE |
AXIAL |
WIRE |
2 |
NO |
ROUND |
UNSPECIFIED |
SINGLE |
FIELD EFFECT |
1 |
1 mA |
LONG FORM |
1.35 V |
TIN LEAD |
O-XALF-W2 |
ISOLATED |
Qualified |
.5 W |
METALLURGICALLY BONDED |
DO-35 |
e0 |
SILICON |
MIL-19500/463 |
Current regulator diodes, also known as constant current diodes, are electronic components used to regulate the current flowing through a circuit. They are designed to provide a constant current independent of the voltage applied to the circuit.
Current regulator diodes work by maintaining a constant voltage drop across the diode, which in turn maintains a constant current through the circuit. The voltage drop is determined by the internal structure of the diode, which is typically made up of a P-N junction and a resistor.
Current regulator diodes are commonly used in electronic circuits that require a constant current, such as LED drivers, voltage regulators, and battery chargers. They offer several advantages over other types of current regulation, such as simplicity, low cost, and high reliability.
Current regulator diodes come in different package sizes and current ratings, depending on the application and the required performance. They can be integrated into a circuit board or mounted in a separate enclosure, depending on the application and the space available.