Part | RoHS | Manufacturer | Diode Type | Terminal Position | Terminal Form | No. of Terminals | Surface Mount | Package Shape | Package Body Material | Diode Resistive Test Current | Config | Frequency Band | Maximum Forward Voltage (VF) | Maximum Diode Capacitance | Technology | Maximum Reverse Current | No. of Elements | Reverse Test Voltage | Package Style (Meter) | Sub-Category | Maximum Repetitive Peak Reverse Voltage | Maximum Operating Temperature | Application | Minimum Operating Temperature | Terminal Finish | JESD-30 Code | Maximum Diode Forward Resistance | Moisture Sensitivity Level (MSL) | Case Connection | Qualification | Maximum Power Dissipation | Nominal Diode Capacitance | Additional Features | Nominal Minority Carrier Lifetime | JEDEC-95 Code | Minimum Breakdown Voltage | Maximum Non Repetitive Peak Forward Current | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Diode Element Material | Diode Resistive Test Frequency | Reference Standard |
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Microchip Technology |
PIN DIODE |
RADIAL |
FLAT |
2 |
NO |
ROUND |
UNSPECIFIED |
SINGLE |
1 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
POST/STUD MOUNT |
ATTENUATOR; SWITCHING |
TIN LEAD |
O-XRPM-F2 |
1 ohm |
Not Qualified |
7.5 W |
LOW DISTORTION, METALLURGICALLY BONDED |
3.5 us |
e0 |
SILICON |
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|
Microchip Technology |
PIN DIODE |
20 mA |
SINGLE |
ULTRA HIGH FREQUENCY TO KU BAND |
.5 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
10 V |
150 Cel |
ATTENUATOR; LIMITER; SWITCHING |
-55 Cel |
.6 ohm |
HIGH RELIABILITY |
.5 us |
250 V |
SILICON |
1000 MHz |
MIL-19500 |
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|
Microchip Technology |
PIN DIODE |
20 mA |
SINGLE |
ULTRA HIGH FREQUENCY TO KU BAND |
.5 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
10 V |
150 Cel |
ATTENUATOR; LIMITER; SWITCHING |
-55 Cel |
.6 ohm |
HIGH RELIABILITY |
.5 us |
250 V |
SILICON |
1000 MHz |
MIL-19500 |
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Microchip Technology |
PIN DIODE |
END |
NO LEAD |
2 |
YES |
ROUND |
UNSPECIFIED |
100 mA |
SINGLE |
ULTRA HIGH FREQUENCY |
.4 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
100 V |
MICROWAVE |
PIN Diodes |
175 Cel |
ATTENUATOR; SWITCHING |
-65 Cel |
TIN LEAD |
O-XEMW-N2 |
2.5 ohm |
Not Qualified |
6 W |
.4 pF |
1 us |
600 V |
e0 |
SILICON |
100 MHz |
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Microchip Technology |
PIN DIODE |
AXIAL |
WIRE |
2 |
NO |
ROUND |
UNSPECIFIED |
100 mA |
SINGLE |
ULTRA HIGH FREQUENCY |
.4 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
100 V |
LONG FORM |
PIN Diodes |
175 Cel |
ATTENUATOR; SWITCHING |
-65 Cel |
TIN LEAD |
O-XALF-W2 |
2.5 ohm |
ISOLATED |
Not Qualified |
2.5 W |
.4 pF |
1 us |
100 V |
e0 |
SILICON |
100 MHz |
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Microchip Technology |
PIN DIODE |
END |
WRAP AROUND |
2 |
YES |
ROUND |
UNSPECIFIED |
SINGLE |
ULTRA HIGH FREQUENCY |
.4 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
LONG FORM |
ATTENUATOR; SWITCHING |
TIN LEAD |
O-XELF-R2 |
2.5 ohm |
ISOLATED |
Not Qualified |
4.5 W |
1 us |
600 V |
e0 |
SILICON |
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Microchip Technology |
PIN DIODE |
AXIAL |
WIRE |
2 |
NO |
ROUND |
UNSPECIFIED |
100 mA |
SINGLE |
ULTRA HIGH FREQUENCY |
.4 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
100 V |
LONG FORM |
PIN Diodes |
175 Cel |
ATTENUATOR; SWITCHING |
-65 Cel |
TIN LEAD |
O-XALF-W2 |
2.5 ohm |
ISOLATED |
Not Qualified |
2.5 W |
.4 pF |
1 us |
1000 V |
e0 |
SILICON |
100 MHz |
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Microchip Technology |
PIN DIODE |
UPPER |
NO LEAD |
1 |
NO |
ROUND |
UNSPECIFIED |
SINGLE |
1 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
POST/STUD MOUNT |
ATTENUATOR; SWITCHING |
TIN LEAD |
O-XUPM-N1 |
1 ohm |
ANODE |
Not Qualified |
10 W |
LOW DISTORTION, METALLURGICALLY BONDED |
3.5 us |
e0 |
SILICON |
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|
Microchip Technology |
PIN DIODE |
BOTTOM |
NO LEAD |
2 |
YES |
RECTANGULAR |
UNSPECIFIED |
10 mA |
SINGLE |
X BAND |
.15 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
CHIP CARRIER |
150 Cel |
-55 Cel |
R-XBCC-N2 |
2 ohm |
25 V |
SILICON |
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|
Microchip Technology |
PIN DIODE |
BOTTOM |
NO LEAD |
2 |
YES |
RECTANGULAR |
UNSPECIFIED |
10 mA |
SINGLE |
ULTRA HIGH FREQUENCY TO X BAND |
.2 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
10 V |
CHIP CARRIER |
PIN Diodes |
150 Cel |
LIMITER |
-55 Cel |
GOLD |
R-XBCC-N2 |
2.5 ohm |
15 V |
e4 |
SILICON |
1000 MHz |
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Microchip Technology |
PIN DIODE |
AXIAL |
WIRE |
2 |
NO |
ROUND |
GLASS |
50 mA |
SINGLE |
4 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
50 V |
LONG FORM |
PIN Diodes |
175 Cel |
SWITCHING |
-65 Cel |
TIN LEAD |
O-LALF-W2 |
1 ohm |
ISOLATED |
Not Qualified |
2.5 W |
4 pF |
LOW DISTORTION |
5 us |
50 V |
e0 |
SILICON |
100 MHz |
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Microchip Technology |
PIN DIODE |
AXIAL |
WIRE |
2 |
NO |
ROUND |
UNSPECIFIED |
50 mA |
SINGLE |
HIGH FREQUENCY TO ULTRA HIGH FREQUENCY |
4 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
0 V |
LONG FORM |
PIN Diodes |
SWITCHING |
TIN LEAD |
O-XALF-W2 |
1 ohm |
ISOLATED |
Not Qualified |
2.5 W |
4 pF |
LOW DISTORTION |
5 us |
50 V |
e0 |
SILICON |
100 MHz |
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Microchip Technology |
PIN DIODE |
END |
WRAP AROUND |
2 |
YES |
ROUND |
GLASS |
50 mA |
SINGLE |
HIGH FREQUENCY TO ULTRA HIGH FREQUENCY |
4 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
0 V |
LONG FORM |
PIN Diodes |
SWITCHING |
TIN LEAD |
O-LELF-R2 |
1 ohm |
ISOLATED |
Not Qualified |
2.5 W |
4 pF |
LOW DISTORTION |
5 us |
50 V |
e0 |
SILICON |
100 MHz |
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Microchip Technology |
PIN DIODE |
END |
WRAP AROUND |
2 |
YES |
ROUND |
GLASS |
50 mA |
SINGLE |
HIGH FREQUENCY TO ULTRA HIGH FREQUENCY |
1.5 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
0 V |
LONG FORM |
PIN Diodes |
SWITCHING |
TIN LEAD |
O-LELF-R2 |
1 ohm |
ISOLATED |
Not Qualified |
1.5 W |
1.5 pF |
LOW DISTORTION |
2 us |
50 V |
e0 |
SILICON |
100 MHz |
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|
Microchip Technology |
PIN DIODE |
BOTTOM |
NO LEAD |
2 |
YES |
RECTANGULAR |
UNSPECIFIED |
SINGLE |
ULTRA HIGH FREQUENCY TO X BAND |
.15 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
CHIP CARRIER |
150 Cel |
-55 Cel |
GOLD |
R-XBCC-N2 |
2 ohm |
25 V |
e4 |
SILICON |
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Microchip Technology |
PIN DIODE |
AXIAL |
WIRE |
2 |
NO |
ROUND |
UNSPECIFIED |
100 mA |
SINGLE |
HIGH FREQUENCY TO S BAND |
3 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
100 V |
LONG FORM |
PIN Diodes |
ATTENUATOR; SWITCHING |
TIN LEAD |
O-XALF-W2 |
.5 ohm |
ISOLATED |
Not Qualified |
2.5 W |
2.4 pF |
LOW DISTORTION |
10 us |
e0 |
SILICON |
100 MHz |
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|
Microchip Technology |
PIN DIODE |
BOTTOM |
NO LEAD |
2 |
YES |
RECTANGULAR |
UNSPECIFIED |
10 mA |
SINGLE |
ULTRA HIGH FREQUENCY TO X BAND |
.15 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
10 V |
CHIP CARRIER |
PIN Diodes |
150 Cel |
LIMITER |
-55 Cel |
GOLD |
R-XBCC-N2 |
2 ohm |
25 V |
e4 |
SILICON |
1000 MHz |
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|
Microchip Technology |
PIN DIODE |
END |
WRAP AROUND |
2 |
YES |
ROUND |
GLASS |
SINGLE |
MEDIUM FREQUENCY TO VERY HIGH FREQUENCY |
1 V |
5 pF |
1 |
0 V |
LONG FORM |
Rectifier Diodes |
75 V |
150 Cel |
LIMITER |
-65 Cel |
O-LELF-R2 |
ISOLATED |
1.2 pF |
75 V |
2.5 A |
SILICON |
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|
Microchip Technology |
PIN DIODE |
END |
WRAP AROUND |
2 |
YES |
ROUND |
UNSPECIFIED |
SERIES CONNECTED, 2 ELEMENTS |
VERY HIGH FREQUENCY |
.4 V |
8 pF |
POSITIVE-INTRINSIC-NEGATIVE |
2 |
LONG FORM |
Other Diodes |
150 Cel |
GENERAL PURPOSE |
-65 Cel |
O-XELF-R2 |
ISOLATED |
4 pF |
2 A |
SILICON |
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|
Microchip Technology |
PIN DIODE |
UPPER |
NO LEAD |
1 |
YES |
SQUARE |
UNSPECIFIED |
100 mA |
SINGLE |
ULTRA HIGH FREQUENCY TO KU BAND |
.1 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
50 V |
UNCASED CHIP |
150 Cel |
ATTENUATOR; SWITCHING |
-55 Cel |
Gold (Au) |
S-XUUC-N1 |
1.5 ohm |
Not Qualified |
HIGH RELIABILITY, LOW DISTORTION |
.6 us |
300 V |
e4 |
SILICON |
100 MHz |
MIL-19500 |
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|
Microchip Technology |
PIN DIODE |
DUAL |
NO LEAD |
6 |
YES |
SQUARE |
PLASTIC/EPOXY |
10 mA |
SINGLE |
X BAND |
.4 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
16 V |
SMALL OUTLINE |
150 Cel |
ATTENUATOR; LIMITER |
-55 Cel |
S-PDSO-N6 |
2 ohm |
.45 pF |
.01 us |
20 V |
NOT SPECIFIED |
NOT SPECIFIED |
SILICON |
1000 MHz |
|||||||||||||||
Microchip Technology |
PIN DIODE |
END |
NO LEAD |
2 |
YES |
ROUND |
UNSPECIFIED |
SINGLE |
KU BAND |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
MICROWAVE |
LIMITER |
O-XEMW-N2 |
Not Qualified |
250 V |
SILICON |
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|
Microchip Technology |
PIN DIODE |
UNSPECIFIED |
FLAT |
2 |
YES |
UNSPECIFIED |
UNSPECIFIED |
10 mA |
SINGLE |
KU BAND |
.06 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
10 V |
MICROWAVE |
PIN Diodes |
150 Cel |
ATTENUATOR; SWITCHING |
GOLD |
X-XXMW-F2 |
1.5 ohm |
Not Qualified |
.06 pF |
.05 us |
50 V |
e4 |
SILICON |
2200 MHz |
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Microchip Technology |
PIN DIODE |
AXIAL |
WIRE |
2 |
NO |
ELLIPTICAL |
UNSPECIFIED |
SINGLE |
MEDIUM FREQUENCY |
10 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
50 V |
LONG FORM |
PIN Diodes |
175 Cel |
-55 Cel |
TIN LEAD |
E-XALF-W2 |
ISOLATED |
Not Qualified |
HIGH RELIABILITY |
2 us |
100 V |
e0 |
SILICON |
|||||||||||||||||
Microchip Technology |
PIN DIODE |
NO |
100 mA |
SINGLE |
.5 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
100 V |
PIN Diodes |
175 Cel |
1.7 ohm |
.5 pF |
1 us |
100 V |
SILICON |
100 MHz |
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|
Microchip Technology |
PIN DIODE |
SINGLE |
GULL WING |
1 |
YES |
RECTANGULAR |
PLASTIC/EPOXY |
SINGLE |
1 pF |
POSITIVE-INTRINSIC-NEGATIVE |
1 |
SMALL OUTLINE |
150 Cel |
SWITCHING |
-55 Cel |
MATTE TIN |
R-PSSO-G1 |
1 ohm |
ANODE |
Not Qualified |
2.5 W |
LOW DISTORTION |
2 us |
50 V |
e3 |
SILICON |
PIN diodes are electronic components that are used in microwave and radio frequency applications as switches or attenuators. They are named after their structure, which consists of a P-type layer, an intrinsic layer, and an N-type layer.
PIN diodes operate based on the properties of their intrinsic layer, which has a low doping density, making it highly resistive. When a forward-bias voltage is applied to the diode, the intrinsic layer becomes less resistive, allowing current to flow through the diode. When a reverse-bias voltage is applied to the diode, the intrinsic layer becomes highly resistive, acting as an open switch or attenuator for microwave and radio frequency signals.
PIN diodes offer several advantages over other types of switches and attenuators, such as low insertion loss, high isolation, and fast switching speed. They can be used in various applications, such as radio frequency amplifiers, attenuators, switches, and phase shifters.
PIN diodes come in different package sizes and configurations, depending on the application and the required performance. They can be integrated into a circuit board or mounted in a separate enclosure, depending on the application and the space available.