7302 Computer Processors 20

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Part RoHS Manufacturer Brand Name Product Line Product Model Product Type Processor Generation Number of Monitors Supported Graphics Memory Technology Packing Limited Warranty Bus Speed L3 Cache Product Series Maximum Memory Supported Packaged Quantity Memory Technology HyperTransport Speed (GT/s) Direct Media Interface L2 Cache Model Compatibility Graphics Controller Model Thermal Specification Length Shipping Weight (Approximate) Processor Core Brand Compatibility Product Color Thermal Design Power Cooler Type Processor Technology Processor Manufacturer Intel Optane Memory Ready Environmental Certification Environmentally Friendly Maximum Cache Level Clock Speed Platform Supported Depth Process Technology Width Package Type L1 Cache HyperTransport Speed (MHz) Overclocking Speed Energy Star Processor Socket QuickPath Interconnect Graphics Controller Manufacturer Weight (Approximate) Product Condition 64-bit Processing Input Voltage Front Side Bus Processor Threads Maximum Cache Height HyperTransport Speed (MT/s) Product Name Integrated Graphics Intel Optane Memory Capacity Country of Origin

P29696-L22

Hewlett Packard Enterprise

HPE

EPYC

7302

Processor Upgrade

2nd Gen

128 MB

7002

Hexadeca-core (16 Core)

155 W

AMD

3.0 GHz

3.3 GHz

Socket SP3

32

EPYC Hexadeca-core 7302 3.0GHz Server FIO Processor Upgrade

4XG7A38047

Lenovo Group Limited

Lenovo

EPYC

7302

Processor Upgrade

2nd Gen

128 MB

7002

Hexadeca-core (16 Core)

155 W

AMD

3 GHz

3.3 GHz

Socket SP3

32

EPYC Hexadeca-core 7302 3.0GHz Server Processor Upgrade

P17540-B21

Hewlett Packard Enterprise

HPE

EPYC

7302

Processor Upgrade

128 MB

7002

Hexadeca-core (16 Core)

155 W

AMD

3 GHz

3.3 GHz

Socket SP3

32

EPYC Hexadeca-core 7302 3GHz Server Processor Upgrade

100-000000043

Advanced Micro Devices, Inc

AMD

EPYC

7302

Processor

2nd Gen

128 MB

7002

8192 KB

Hexadeca-core (16 Core)

155 W

AMD

3 GHz

7 nm

OEM

3.3 GHz

Socket SP3

Yes

32

EPYC Hexadeca-core 7302 3GHz Server Processor

P17540-L21

Hewlett Packard Enterprise

HPE

EPYC

7302

Processor Upgrade

2nd Gen

128 MB

7002

Hexadeca-core (16 Core)

155 W

AMD

3 GHz

3.3 GHz

Socket SP3

32

EPYC Hexadeca-core 7302 3GHz Server FIO Processor Upgrade

P29024-L22

Hewlett Packard Enterprise

HPE

EPYC

7302

Processor Upgrade

2nd Gen

128 MB

7002

Hexadeca-core (16 Core)

155 W

AMD

3.0 GHz

3.3 GHz

Socket SP3

32

EPYC Hexadeca-core 7302 3.0GHz Server FIO Processor Upgrade

100-100000043WOF

Advanced Micro Devices, Inc

AMD

EPYC

7302

Processor

2nd Gen

128 MB

7002

8192 KB

Hexadeca-core (16 Core)

155 W

AMD

3 GHz

7 nm

Retail

3.3 GHz

Socket SP3

Yes

32

EPYC Hexadeca-core 7302 3GHz Server Processor

P16643-B21

Hewlett Packard Enterprise

HPE

EPYC

7302

Processor Upgrade

128 MB

7002

Hexadeca-core (16 Core)

155 W

AMD

3.00 GHz

3.3 GHz

Socket SP3

Yes

32

EPYC Hexadeca-core 7302 3.00GHz Server Processor Upgrade

P16643-L21

Hewlett Packard Enterprise

HPE

EPYC

7302

Processor Upgrade

2nd Gen

128 MB

7002

Hexadeca-core (16 Core)

155 W

AMD

3 GHz

3.3 GHz

Socket SP3

32

EPYC Hexadeca-core 7302 3GHz Server Processor Upgrade

P17540-B21#0D1

Hewlett Packard Enterprise

HPE

EPYC

7302

Processor Upgrade

128 MB

7002

Hexadeca-core (16 Core)

155 W

AMD

3 GHz

3.3 GHz

Socket SP3

32

EPYC Hexadeca-core 7302 3GHz Server Processor Upgrade

P39370-B21

Hewlett Packard Enterprise

HPE

EPYC

7302

Processor Upgrade

2nd Gen

128 MB

7002

8.192 MB

Hexadeca-core (16 Core)

155 W

AMD

3.0 GHz

7 nm

3.3 GHz

Socket SP3

0.899 lb

Yes

32

EPYC Hexadeca-core 7302 3GHz Server Processor Upgrade

P24264-B21

Hewlett Packard Enterprise

HPE

EPYC

7302

Processor Upgrade

2nd Gen

128 MB

7002

Hexadeca-core (16 Core)

155 W

AMD

3 GHz

3.3 GHz

Socket SP3

32

EPYC Hexadeca-core 7302 3.0GHz Server Processor Upgrade

P29024-L23

Hewlett Packard Enterprise

HPE

EPYC

7302

Processor Upgrade

2nd Gen

128 MB

7002

Hexadeca-core (16 Core)

155 W

AMD

3.0 GHz

3.3 GHz

Socket SP3

32

EPYC Hexadeca-core 7302 3.0GHz Server FIO Processor Upgrade

P16666-B21

Hewlett Packard Enterprise

HPE

EPYC

7302

Processor Upgrade

2nd Gen

128 MB

7002

Hexadeca-core (16 Core)

155 W

AMD

3 GHz

3.3 GHz

Socket SP3

32

EPYC Hexadeca-core 7302 3GHz Server Processor Upgrade

4XG7A38058

Lenovo Group Limited

Lenovo

EPYC

7302

Processor Upgrade

2nd Gen

128 MB

7002

Hexadeca-core (16 Core)

155 W

AMD

3 GHz

3.3 GHz

Socket SP3

32

EPYC Hexadeca-core 7302 3.0GHz Server Processor Upgrade

P27262-B21

Hewlett Packard Enterprise

HPE

EPYC

7302

Processor Upgrade

2nd Gen

128 MB

7002

Hexadeca-core (16 Core)

155 W

AMD

3 GHz

3.3 GHz

Socket SP3

32

EPYC Hexadeca-core 7302 3.0GHz Server Processor Upgrade

YD27BXBAM88AFH

Advanced Micro Devices, Inc

AMD

EPYC

7302

Processor

2nd Gen

128 MB

7002

Hexadeca-core (16 Core)

155 W

AMD

3 GHz

3.3 GHz

Socket SP3

32

EPYC Hexadeca-core 7302 3.0GHz Server Processor

P16643-B21#0D1

Hewlett Packard Enterprise

HPE

EPYC

7302

Processor Upgrade

128 MB

7002

Hexadeca-core (16 Core)

155 W

AMD

3.00 GHz

3.3 GHz

Socket SP3

Yes

32

EPYC Hexadeca-core 7302 3.00GHz Server Processor Upgrade

P24269-L21

Hewlett Packard Enterprise

HPE

EPYC

7302

Processor Upgrade

2nd Gen

128 MB

7002

Hexadeca-core (16 Core)

155 W

AMD

3 GHz

3.3 GHz

Socket SP3

32

EPYC Hexadeca-core 7302 3.0GHz Server FIO Processor Upgrade

P24264-L21

Hewlett Packard Enterprise

HPE

EPYC

7302

Processor Upgrade

2nd Gen

128 MB

7002

Hexadeca-core (16 Core)

155 W

AMD

3 GHz

3.3 GHz

Socket SP3

32

EPYC Hexadeca-core 7302 3.0GHz Server FIO Processor Upgrade

Computer Processors

Computer Processors, often referred to simply as processors or CPUs (Central Processing Units), are silicon chips that serve as the brain of a computing device. These integrated circuits are responsible for executing instructions and performing calculations in computers, smartphones, tablets, and other electronic devices. Microprocessors come in various architectures and designs, each optimized for specific applications and performance requirements. They typically include features such as multiple cores, advanced instruction sets, and power-saving technologies to deliver optimal performance and efficiency.