7313 Computer Processors 11

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Part RoHS Manufacturer Brand Name Product Line Product Model Product Type Processor Generation Number of Monitors Supported Graphics Memory Technology Packing Limited Warranty Bus Speed L3 Cache Product Series Maximum Memory Supported Packaged Quantity Memory Technology HyperTransport Speed (GT/s) Direct Media Interface L2 Cache Model Compatibility Graphics Controller Model Thermal Specification Length Shipping Weight (Approximate) Processor Core Brand Compatibility Product Color Thermal Design Power Cooler Type Processor Technology Processor Manufacturer Intel Optane Memory Ready Environmental Certification Environmentally Friendly Maximum Cache Level Clock Speed Platform Supported Depth Process Technology Width Package Type L1 Cache HyperTransport Speed (MHz) Overclocking Speed Energy Star Processor Socket QuickPath Interconnect Graphics Controller Manufacturer Weight (Approximate) Product Condition 64-bit Processing Input Voltage Front Side Bus Processor Threads Maximum Cache Height HyperTransport Speed (MT/s) Product Name Integrated Graphics Intel Optane Memory Capacity Country of Origin

P38722-L23

Hewlett Packard Enterprise

HPE

EPYC

7313

Processor Upgrade

128 MB

7003

Hexadeca-core (16 Core)

155 W

AMD

3.0 GHz

3.7 GHz

Socket SP3

32

EPYC Hexadeca-core 7313 3.0GHz Server FIO Processor Upgrade

4XG7A63607

Lenovo Group Limited

Lenovo

EPYC

7313

Processor Upgrade

128 MB

7003

Hexadeca-core (16 Core)

155 W

AMD

3.0 GHz

3.7 GHz

Socket SP3

32

EPYC Hexadeca-core (16 Core) 7313 3.0GHz Server Processor Upgrade

P38722-B21

Hewlett Packard Enterprise

HPE

EPYC

7313

Processor Upgrade

3rd Gen

128 MB

7003

8192 KB

Hexadeca-core (16 Core)

155 W

AMD

3 GHz

2.3 "

7 nm

2.97 "

3.7 GHz

Socket SP3

Yes

32

EPYC Hexadeca-core 7313 3GHz Processor Upgrade

100-000000329

Advanced Micro Devices, Inc

AMD

EPYC

7313

Processor

128 MB

7003

Hexadeca-core (16 Core)

155 W

AMD

3.0 GHz

3.7 GHz

Socket SP3

32

EPYC Hexadeca-core (16 Core) 7313 3.0GHz Server Processor

P38669-B21

Hewlett Packard Enterprise

HPE

EPYC

7313

Processor Upgrade

3rd Gen

123 MB

7003

Hexadeca-core (16 Core)

155 W

AMD

3.0 GHz

3.7 GHz

Socket SP3

32

EPYC Hexadeca-core 7313 3.0GHz Server Processor Upgrade

100-100000329WOF

Advanced Micro Devices, Inc

AMD

EPYC

7313

Processor

128 MB

7003

Hexadeca-core (16 Core)

155 W

AMD

3.0 GHz

3.7 GHz

Socket SP3

32

EPYC Hexadeca-core (16 Core) 7313 3.0GHz Server Processor

4XG7A63588

Lenovo Group Limited

Lenovo

EPYC

7313

Processor Upgrade

128 MB

7003

Hexadeca-core (16 Core)

155 W

AMD

3.0 GHz

3.7 GHz

Socket SP3

32

EPYC Hexadeca-core (16 Core) 7313 3.0GHz Server Processor Upgrade

P38722-L22

Hewlett Packard Enterprise

HPE

EPYC

7313

Processor Upgrade

128 MB

7003

Hexadeca-core (16 Core)

155 W

AMD

3.0 GHz

3.7 GHz

Socket SP3

32

EPYC Hexadeca-core 7313 3.0GHz Server FIO Processor Upgrade

P41425-L22

Hewlett Packard Enterprise

HPE

EPYC

7313

Processor Upgrade

128 MB

7003

Hexadeca-core (16 Core)

155 W

AMD

3.0 GHz

3.7 GHz

Socket SP3

32

EPYC Hexadeca-core 7313 3.0GHz Server FIO Processor Upgrade

UCS-CPU-A7313

Cisco Systems, Inc

Cisco

EPYC

7313

Processor Upgrade

128 MB

7003

Hexadeca-core (16 Core)

155 W

AMD

3.0 GHz

3.7 GHz

Socket SP3

32

EPYC Hexadeca-core 7313 3.0GHz Server

P40584-B21

Hewlett Packard Enterprise

HPE

EPYC

7313

Processor Upgrade

3rd Gen

128 MB

7003

8.192 MB

Hexadeca-core (16 Core)

155 W

AMD

3.0 GHz

2.3 "

7 nm

2.97 "

3.7 GHz

Socket SP3

Yes

32

EPYC Hexadeca-core 7313 3GHz Server Processor Upgrade

Computer Processors

Computer Processors, often referred to simply as processors or CPUs (Central Processing Units), are silicon chips that serve as the brain of a computing device. These integrated circuits are responsible for executing instructions and performing calculations in computers, smartphones, tablets, and other electronic devices. Microprocessors come in various architectures and designs, each optimized for specific applications and performance requirements. They typically include features such as multiple cores, advanced instruction sets, and power-saving technologies to deliver optimal performance and efficiency.