7413 Computer Processors 11

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Part RoHS Manufacturer Brand Name Product Line Product Model Product Type Processor Generation Number of Monitors Supported Graphics Memory Technology Packing Limited Warranty Bus Speed L3 Cache Product Series Maximum Memory Supported Packaged Quantity Memory Technology HyperTransport Speed (GT/s) Direct Media Interface L2 Cache Model Compatibility Graphics Controller Model Thermal Specification Length Shipping Weight (Approximate) Processor Core Brand Compatibility Product Color Thermal Design Power Cooler Type Processor Technology Processor Manufacturer Intel Optane Memory Ready Environmental Certification Environmentally Friendly Maximum Cache Level Clock Speed Platform Supported Depth Process Technology Width Package Type L1 Cache HyperTransport Speed (MHz) Overclocking Speed Energy Star Processor Socket QuickPath Interconnect Graphics Controller Manufacturer Weight (Approximate) Product Condition 64-bit Processing Input Voltage Front Side Bus Processor Threads Maximum Cache Height HyperTransport Speed (MT/s) Product Name Integrated Graphics Intel Optane Memory Capacity Country of Origin

100-000000323

Advanced Micro Devices, Inc

AMD

EPYC

7413

Processor

128 MB

7003

Tetracosa-core (24 Core)

180 W

AMD

2.65 GHz

3.6 GHz

Socket SP3

48

EPYC Tetracosa-core (24 Core) 7413 2.65GHz Server Processor

P41427-L22

Hewlett Packard Enterprise

HPE

EPYC

7413

Processor Upgrade

128 MB

7003

Tetracosa-core (24 Core)

180 W

AMD

2.65 GHz

3.6 GHz

Socket SP3

48

EPYC Tetracosa-core 7413 2.65GHz Server FIO Processor Upgrade

P38724-B21

Hewlett Packard Enterprise

HPE

EPYC

7413

Processor Upgrade

3rd Gen

128 MB

7003

12.288 MB

Tetracosa-core (24 Core)

180 W

AMD

2.65 GHz

2.3 "

7 nm

2.97 "

3.6 GHz

Socket SP3

Yes

48

EPYC Tetracosa-core 7413 2.65GHz Server Processor Upgrade

P38675-B21

Hewlett Packard Enterprise

HPE

EPYC

7413

Processor Upgrade

3rd Gen

128 MB

7003

12.288 MB

Tetracosa-core (24 Core)

180 W

AMD

2.65 GHz

2.3 "

7 nm

2.97 "

3.6 GHz

Socket SP3

Yes

48

EPYC Tetracosa-core 7413 2.65GHz Server Processor Upgrade

P38724-L23

Hewlett Packard Enterprise

HPE

EPYC

7413

Processor Upgrade

128 MB

7003

Tetracosa-core (24 Core)

180 W

AMD

2.65 GHz

3.6 GHz

Socket SP3

48

EPYC Tetracosa-core 7413 2.65GHz Server FIO Processor Upgrade

P40586-L22

Hewlett Packard Enterprise

HPE

EPYC

7413

Processor Upgrade

128 MB

7003

Tetracosa-core (24 Core)

180 W

AMD

2.65 GHz

3.6 GHz

Socket SP3

48

EPYC Tetracosa-core 7413 2.65GHz Server FIO Processor Upgrade

100-100000323WOF

Advanced Micro Devices, Inc

AMD

EPYC

7413

Processor

128 MB

7003

Tetracosa-core (24 Core)

180 W

AMD

2.65 GHz

3.6 GHz

Socket SP3

48

EPYC Tetracosa-core (24 Core) 7413 2.65GHz Server Processor

4XG7A63590

Lenovo Group Limited

Lenovo

EPYC

7413

Processor Upgrade

128 MB

7003

Tetracosa-core (24 Core)

180 W

AMD

2.65 GHz

3.6 GHz

Socket SP3

48

EPYC Tetracosa-core (24 Core) 7413 2.65GHz Server Processor Upgrade

P38724-L22

Hewlett Packard Enterprise

HPE

EPYC

7413

Processor Upgrade

128 MB

7003

Tetracosa-core (24 Core)

180 W

AMD

2.65 GHz

3.6 GHz

Socket SP3

48

EPYC Tetracosa-core 7413 2.65GHz Server FIO Processor Upgrade

UCS-CPU-A7413

Cisco Systems, Inc

Cisco

EPYC

7413

Processor Upgrade

3rd Gen

128 MB

7003

Tetracosa-core (24 Core)

180 W

AMD

RoHS, REACH

Yes

2.6 GHz

3.6 GHz

Socket SP3

48

EPYC Tetracosa-core 7413 2.6GHz Processor Upgrade

4XG7A63609

Lenovo Group Limited

Lenovo

EPYC

7413

Processor Upgrade

128 MB

7003

Tetracosa-core (24 Core)

180 W

AMD

2.65 GHz

3.6 GHz

Socket SP3

48

EPYC Tetracosa-core (24 Core) 7413 2.65GHz Server Processor Upgrade

Computer Processors

Computer Processors, often referred to simply as processors or CPUs (Central Processing Units), are silicon chips that serve as the brain of a computing device. These integrated circuits are responsible for executing instructions and performing calculations in computers, smartphones, tablets, and other electronic devices. Microprocessors come in various architectures and designs, each optimized for specific applications and performance requirements. They typically include features such as multiple cores, advanced instruction sets, and power-saving technologies to deliver optimal performance and efficiency.