Part | RoHS | Manufacturer | Brand Name | Product Line | Product Model | Product Type | Processor Generation | Number of Monitors Supported | Graphics Memory Technology | Packing | Limited Warranty | Bus Speed | L3 Cache | Product Series | Maximum Memory Supported | Packaged Quantity | Memory Technology | HyperTransport Speed (GT/s) | Direct Media Interface | L2 Cache | Model Compatibility | Graphics Controller Model | Thermal Specification | Length | Shipping Weight (Approximate) | Processor Core | Brand Compatibility | Product Color | Thermal Design Power | Cooler Type | Processor Technology | Processor Manufacturer | Intel Optane Memory Ready | Environmental Certification | Environmentally Friendly | Maximum Cache Level | Clock Speed | Platform Supported | Depth | Process Technology | Width | Package Type | L1 Cache | HyperTransport Speed (MHz) | Overclocking Speed | Energy Star | Processor Socket | QuickPath Interconnect | Graphics Controller Manufacturer | Weight (Approximate) | Product Condition | 64-bit Processing | Input Voltage | Front Side Bus | Processor Threads | Maximum Cache | Height | HyperTransport Speed (MT/s) | Product Name | Integrated Graphics | Intel Optane Memory Capacity | Country of Origin |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
HP-IMSourcing |
HP-IMSourcing |
Xeon |
E3-1220V2 |
Processor Upgrade |
8 MB |
E3-1200 |
5 GT/s |
1 MB |
Quad-core (4 Core) |
69 W |
Intel |
3.1 GHz |
37.5 mm |
22 nm |
37.5 mm |
Socket H2 LGA-1155 |
Yes |
Xeon Quad-core E3-1220V2 3.1GHz FIO Processor Upgrade |
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Hewlett Packard Enterprise |
HPE |
Xeon |
E3-1220V2 |
Processor Upgrade |
8 MB |
E3-1200 |
5 GT/s |
1 MB |
Quad-core (4 Core) |
69 W |
Turbo Boost Technology, vPro Technology, Virtualization Technology, Trusted Execution Technology, Extended Memory 64 Technology, Enhanced SpeedStep Technology, Demand Based Switching, Thermal Monitoring Technology |
Intel |
3.1 GHz |
PC |
37.5 mm |
22 nm |
37.5 mm |
256 KB |
Socket H2 LGA-1155 |
Yes |
Xeon Quad-core E3-1220V2 3.1GHz FIO Processor Upgrade |
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Intel Corporation |
Intel |
Xeon |
E3-1220V2 |
Processor |
8 MB |
E3-1200 |
5 GT/s |
1 MB |
Quad-core (4 Core) |
69 W |
Turbo Boost Technology 2.0, Virtualization Technology, vPro Technology, Trusted Execution Technology, Extended Memory 64 Technology, Enhanced SpeedStep Technology, Demand Based Switching, Thermal Monitoring Technology |
Intel |
3.1 GHz |
PC |
37.5 mm |
22 nm |
37.5 mm |
Retail |
256 KB |
3.5 GHz |
Socket H2 LGA-1155 |
Yes |
Xeon Quad-core E3-1220V2 3.1GHz Processor |
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Supermicro Computer, Inc |
Supermicro |
Xeon |
E3-1220V2 |
Processor Upgrade |
8 MB |
E3-1200 |
5 GT/s |
1 MB |
Quad-core (4 Core) |
69 W |
Turbo Boost Technology 2.0, Extended Memory 64 Technology, Trusted Execution Technology, Thermal Monitoring Technology, Virtualization Technology, Demand Based Switching, vPro Technology, Enhanced SpeedStep Technology |
Intel |
3.1 GHz |
PC |
37.5 mm |
22 nm |
37.5 mm |
256 KB |
Socket H2 LGA-1155 |
Yes |
Xeon Quad-core E3-1220V2 3.1GHz Server Processor Upgrade |
|||||||||||||||||||||||||||||||||||||||||
Intel Corporation |
Intel |
Xeon |
E3-1220V2 |
Processor |
8 MB |
E3-1200 |
5 GT/s |
1 MB |
Quad-core (4 Core) |
69 W |
Turbo Boost Technology 2.0, vPro Technology, Virtualization Technology, Trusted Execution Technology, Extended Memory 64 Technology, Demand Based Switching, Thermal Monitoring Technology, Enhanced SpeedStep Technology |
Intel |
3.1 GHz |
PC |
37.5 mm |
22 nm |
37.5 mm |
OEM |
256 KB |
Socket H2 LGA-1155 |
Yes |
Xeon Quad-core E3-1220V2 3.1GHz Processor |
||||||||||||||||||||||||||||||||||||||||
HP-IMSourcing DS |
HP-IMSourcing DS |
Xeon |
E3-1220V2 |
Processor Upgrade |
8 MB |
E3-1200 |
5 GT/s |
1 MB |
Quad-core (4 Core) |
69 W |
Turbo Boost Technology 2.0, vPro Technology, Virtualization Technology, Trusted Execution Technology, Enhanced SpeedStep Technology, Extended Memory 64 Technology, Demand Based Switching, Thermal Monitoring Technology |
Intel |
3.1 GHz |
PC |
37.5 mm |
22 nm |
37.5 mm |
256 KB |
Socket H2 LGA-1155 |
Yes |
Xeon Quad-core E3-1220V2 3.1GHz FIO Processor Upgrade |
|||||||||||||||||||||||||||||||||||||||||
Intel - IMSourcing Certified Pre-Owned |
Intel - IMSourcing Certified Pre-Owned |
Xeon |
E3-1220V2 |
Processor |
8 MB |
E3-1200 |
5 GT/s |
1 MB |
Quad-core (4 Core) |
69 W |
Turbo Boost Technology 2.0, Virtualization Technology, vPro Technology, Trusted Execution Technology, Extended Memory 64 Technology, Enhanced SpeedStep Technology, Demand Based Switching, Thermal Monitoring Technology |
Intel |
3.1 GHz |
PC |
37.5 mm |
22 nm |
37.5 mm |
Retail |
256 KB |
3.5 GHz |
Socket H2 LGA-1155 |
Refurbished |
Yes |
Xeon Quad-core E3-1220V2 3.1GHz Processor |
||||||||||||||||||||||||||||||||||||||
Hewlett Packard Enterprise |
HPE |
Xeon |
E3-1220V2 |
Processor Upgrade |
8 MB |
E3-1200 |
5 GT/s |
1 MB |
Quad-core (4 Core) |
69 W |
Turbo Boost Technology 2.0, vPro Technology, Virtualization Technology, Trusted Execution Technology, Enhanced SpeedStep Technology, Extended Memory 64 Technology, Demand Based Switching, Thermal Monitoring Technology |
Intel |
3.1 GHz |
PC |
37.5 mm |
22 nm |
37.5 mm |
256 KB |
Socket H2 LGA-1155 |
Yes |
Xeon Quad-core E3-1220V2 3.1GHz FIO Processor Upgrade |
|||||||||||||||||||||||||||||||||||||||||
Intel-IMSourcing DS |
Intel-IMSourcing DS |
Xeon |
E3-1220V2 |
Processor |
8 MB |
E3-1200 |
5 GT/s |
1 MB |
Quad-core (4 Core) |
69 W |
Turbo Boost Technology 2.0, Virtualization Technology, vPro Technology, Trusted Execution Technology, Extended Memory 64 Technology, Enhanced SpeedStep Technology, Demand Based Switching, Thermal Monitoring Technology |
Intel |
3.1 GHz |
PC |
37.5 mm |
22 nm |
37.5 mm |
Retail |
256 KB |
3.5 GHz |
Socket H2 LGA-1155 |
Yes |
Xeon Quad-core E3-1220V2 3.1GHz Processor |
|||||||||||||||||||||||||||||||||||||||
Intel Corporation |
Intel |
Xeon |
E3-1220V2 |
Processor |
3 Year |
8 MB |
E3-1200 |
5 GT/s |
1 MB |
Quad-core (4 Core) |
69 W |
Turbo Boost Technology 2.0, Virtualization Technology, vPro Technology, Trusted Execution Technology, Extended Memory 64 Technology, Enhanced SpeedStep Technology, Demand Based Switching, Thermal Monitoring Technology |
Intel |
3.1 GHz |
PC |
37.5 mm |
22 nm |
37.5 mm |
Retail |
256 KB |
Socket H2 LGA-1155 |
Yes |
Xeon Quad-core E3-1220V2 3.1GHz Processor |
|||||||||||||||||||||||||||||||||||||||
Fujitsu |
Fujitsu |
Xeon |
E3-1220V2 |
Processor Upgrade |
8 MB |
E3-1200 |
5 GT/s |
1 MB |
Quad-core (4 Core) |
69 W |
Turbo Boost Technology 2.0, Virtualization Technology, vPro Technology, Enhanced SpeedStep Technology, Extended Memory 64 Technology, Thermal Monitoring Technology, Trusted Execution Technology, Demand Based Switching |
Intel |
3.1 GHz |
PC |
3.75 cm |
22 nm |
3.75 cm |
256 KB |
Socket H2 LGA-1155 |
Yes |
Xeon Quad-core E3-1220V2 3.1GHz Server Processor Upgrade |
|||||||||||||||||||||||||||||||||||||||||
HPE-IMSourcing |
HPE-IMSourcing |
Xeon |
E3-1220V2 |
Processor Upgrade |
8 MB |
E3-1200 |
5 GT/s |
1 MB |
Quad-core (4 Core) |
69 W |
Turbo Boost Technology, vPro Technology, Virtualization Technology, Trusted Execution Technology, Extended Memory 64 Technology, Enhanced SpeedStep Technology, Demand Based Switching, Thermal Monitoring Technology |
Intel |
3.1 GHz |
PC |
37.5 mm |
22 nm |
37.5 mm |
256 KB |
Socket H2 LGA-1155 |
Yes |
Xeon Quad-core E3-1220V2 3.1GHz FIO Processor Upgrade |
|||||||||||||||||||||||||||||||||||||||||
HPE-IMSourcing DS |
HPE-IMSourcing DS |
Xeon |
E3-1220V2 |
Processor Upgrade |
8 MB |
E3-1200 |
5 GT/s |
1 MB |
Quad-core (4 Core) |
69 W |
Turbo Boost Technology 2.0, vPro Technology, Virtualization Technology, Trusted Execution Technology, Enhanced SpeedStep Technology, Extended Memory 64 Technology, Demand Based Switching, Thermal Monitoring Technology |
Intel |
3.1 GHz |
PC |
37.5 mm |
22 nm |
37.5 mm |
256 KB |
Socket H2 LGA-1155 |
Yes |
Xeon Quad-core E3-1220V2 3.1GHz FIO Processor Upgrade |
Computer Processors, often referred to simply as processors or CPUs (Central Processing Units), are silicon chips that serve as the brain of a computing device. These integrated circuits are responsible for executing instructions and performing calculations in computers, smartphones, tablets, and other electronic devices. Microprocessors come in various architectures and designs, each optimized for specific applications and performance requirements. They typically include features such as multiple cores, advanced instruction sets, and power-saving technologies to deliver optimal performance and efficiency.