Part | RoHS | Manufacturer | Brand Name | Product Line | Product Model | Product Type | Processor Generation | Number of Monitors Supported | Graphics Memory Technology | Packing | Limited Warranty | Bus Speed | L3 Cache | Product Series | Maximum Memory Supported | Packaged Quantity | Memory Technology | HyperTransport Speed (GT/s) | Direct Media Interface | L2 Cache | Model Compatibility | Graphics Controller Model | Thermal Specification | Length | Shipping Weight (Approximate) | Processor Core | Brand Compatibility | Product Color | Thermal Design Power | Cooler Type | Processor Technology | Processor Manufacturer | Intel Optane Memory Ready | Environmental Certification | Environmentally Friendly | Maximum Cache Level | Clock Speed | Platform Supported | Depth | Process Technology | Width | Package Type | L1 Cache | HyperTransport Speed (MHz) | Overclocking Speed | Energy Star | Processor Socket | QuickPath Interconnect | Graphics Controller Manufacturer | Weight (Approximate) | Product Condition | 64-bit Processing | Input Voltage | Front Side Bus | Processor Threads | Maximum Cache | Height | HyperTransport Speed (MT/s) | Product Name | Integrated Graphics | Intel Optane Memory Capacity | Country of Origin |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cisco Systems, Inc |
Cisco |
Xeon |
E7-4860 v2 |
Processor Upgrade |
30 MB |
E7-4800 v2 |
3 MB |
73 °C |
Dodeca-core (12 Core) |
130 W |
Intel |
2.6 GHz |
45 mm |
22 nm |
52 mm |
3.2 GHz |
Socket R LGA-2011 |
8 GT/s |
Yes |
Xeon Dodeca-core E7-4860 v2 2.6GHz Server Processor Upgrade |
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Cisco Systems, Inc |
Cisco |
Xeon |
E7-4860 v2 |
Processor Upgrade |
30 MB |
E7-4800 v2 |
3 MB |
73 °C |
Dodeca-core (12 Core) |
130 W |
Trusted Execution Technology, Hyper-Threading Technology, Turbo Boost Technology 2.0, Extended Memory 64 Technology, Enhanced SpeedStep Technology, Thermal Monitoring Technology |
Intel |
2.6 GHz |
PC |
45 mm |
22 nm |
52 mm |
768 KB |
3.2 GHz |
Socket R LGA-2011 |
8 GT/s |
Yes |
Xeon Dodeca-core E7-4860 v2 2.6GHz Server Processor Upgrade |
|||||||||||||||||||||||||||||||||||||||
Supermicro Computer, Inc |
Supermicro |
Xeon |
E7-4860 v2 |
Processor Upgrade |
30 MB |
E7-4800 v2 |
3 MB |
73 °C |
Dodeca-core (12 Core) |
130 W |
Intel |
2.6 GHz |
45 mm |
22 nm |
52 mm |
3.2 GHz |
Socket R LGA-2011 |
8 GT/s |
Yes |
Xeon Dodeca-core E7-4860 v2 2.6GHz Server Processor Upgrade |
||||||||||||||||||||||||||||||||||||||||||
Hewlett Packard Enterprise |
HPE |
Xeon |
E7-4860 v2 |
Processor Upgrade |
30 MB |
E7-4800 v2 |
3 MB |
73 °C |
Dodeca-core (12 Core) |
130 W |
Trusted Execution Technology, Hyper-Threading Technology, Turbo Boost Technology 2.0, Extended Memory 64 Technology, Enhanced SpeedStep Technology, Thermal Monitoring Technology |
Intel |
2.6 GHz |
PC |
45 mm |
22 nm |
52 mm |
768 KB |
3.2 GHz |
Socket R LGA-2011 |
8 GT/s |
Yes |
Xeon Dodeca-core E7-4860 v2 2.6GHz Server Processor Upgrade |
|||||||||||||||||||||||||||||||||||||||
Hewlett Packard Enterprise |
HPE |
Xeon |
E7-4860 v2 |
Processor Upgrade |
30 MB |
E7-4800 v2 |
3 MB |
73 °C |
Dodeca-core (12 Core) |
130 W |
Intel |
2.6 GHz |
45 mm |
22 nm |
52 mm |
3.2 GHz |
Socket R LGA-2011 |
8 GT/s |
Yes |
Xeon Dodeca-core E7-4860 v2 2.6GHz FIO Server Processor Upgrade |
||||||||||||||||||||||||||||||||||||||||||
HPE-IMSourcing |
HPE-IMSourcing |
Xeon |
E7-4860 v2 |
Processor Upgrade |
30 MB |
E7-4800 v2 |
3 MB |
73 °C |
Dodeca-core (12 Core) |
130 W |
Intel |
2.6 GHz |
45 mm |
22 nm |
52 mm |
3.2 GHz |
Socket R LGA-2011 |
8 GT/s |
Yes |
Xeon Dodeca-core E7-4860 v2 2.6GHz FIO Server Processor Upgrade |
||||||||||||||||||||||||||||||||||||||||||
HP-IMSourcing |
HP-IMSourcing |
Xeon |
E7-4860 v2 |
Processor Upgrade |
30 MB |
E7-4800 v2 |
3 MB |
73 °C |
Dodeca-core (12 Core) |
130 W |
Intel |
2.6 GHz |
45 mm |
22 nm |
52 mm |
3.2 GHz |
Socket R LGA-2011 |
8 GT/s |
Yes |
Xeon Dodeca-core E7-4860 v2 2.6GHz FIO Server Processor Upgrade |
||||||||||||||||||||||||||||||||||||||||||
Hewlett Packard Enterprise |
HPE |
Xeon |
E7-4860 v2 |
Processor Upgrade |
30 MB |
E7-4800 v2 |
3 MB |
73 °C |
Dodeca-core (12 Core) |
130 W |
Intel |
2.6 GHz |
45 mm |
22 nm |
52 mm |
3.2 GHz |
Socket R LGA-2011 |
8 GT/s |
Yes |
Xeon Dodeca-core E7-4860 v2 2.6GHz Server Processor Upgrade |
||||||||||||||||||||||||||||||||||||||||||
Intel Corporation |
Intel |
Xeon |
E7-4860 v2 |
Processor |
30 MB |
E7-4800 v2 |
3 MB |
73 °C |
Dodeca-core (12 Core) |
130 W |
Trusted Execution Technology, Hyper-Threading Technology, Turbo Boost Technology 2.0, Extended Memory 64 Technology, Enhanced SpeedStep Technology, Thermal Monitoring Technology |
Intel |
2.6 GHz |
PC |
45 mm |
22 nm |
52 mm |
768 KB |
3.2 GHz |
Socket R LGA-2011 |
8 GT/s |
Yes |
Xeon Dodeca-core E7-4860 v2 2.6GHz Server Processor |
|||||||||||||||||||||||||||||||||||||||
Lenovo Group Limited |
Lenovo |
Xeon |
E7-4860 v2 |
Processor Upgrade |
30 MB |
E7-4800 v2 |
3 MB |
73 °C |
Dodeca-core (12 Core) |
130 W |
Trusted Execution Technology, Hyper-Threading Technology, Turbo Boost Technology 2.0, Extended Memory 64 Technology, Enhanced SpeedStep Technology, Thermal Monitoring Technology |
Intel |
2.6 GHz |
PC |
45 mm |
22 nm |
52 mm |
768 KB |
3.2 GHz |
Socket R LGA-2011 |
8 GT/s |
Yes |
Xeon Dodeca-core E7-4860 v2 2.6GHz Server Processor Upgrade |
|||||||||||||||||||||||||||||||||||||||
HPE - IMSourcing Certified Pre-Owned |
HPE - IMSourcing Certified Pre-Owned |
Xeon |
E7-4860 v2 |
Processor Upgrade |
30 MB |
E7-4800 v2 |
3 MB |
73 °C |
Dodeca-core (12 Core) |
130 W |
Trusted Execution Technology, Hyper-Threading Technology, Turbo Boost Technology 2.0, Extended Memory 64 Technology, Enhanced SpeedStep Technology, Thermal Monitoring Technology |
Intel |
2.6 GHz |
PC |
45 mm |
22 nm |
52 mm |
768 KB |
3.2 GHz |
Socket R LGA-2011 |
8 GT/s |
Refurbished |
Yes |
Xeon Dodeca-core E7-4860 v2 2.6GHz Server Processor Upgrade |
Computer Processors, often referred to simply as processors or CPUs (Central Processing Units), are silicon chips that serve as the brain of a computing device. These integrated circuits are responsible for executing instructions and performing calculations in computers, smartphones, tablets, and other electronic devices. Microprocessors come in various architectures and designs, each optimized for specific applications and performance requirements. They typically include features such as multiple cores, advanced instruction sets, and power-saving technologies to deliver optimal performance and efficiency.