Part | RoHS | Manufacturer | Brand Name | Product Line | Product Model | Product Type | Processor Generation | Number of Monitors Supported | Graphics Memory Technology | Packing | Limited Warranty | Bus Speed | L3 Cache | Product Series | Maximum Memory Supported | Packaged Quantity | Memory Technology | HyperTransport Speed (GT/s) | Direct Media Interface | L2 Cache | Model Compatibility | Graphics Controller Model | Thermal Specification | Length | Shipping Weight (Approximate) | Processor Core | Brand Compatibility | Product Color | Thermal Design Power | Cooler Type | Processor Technology | Processor Manufacturer | Intel Optane Memory Ready | Environmental Certification | Environmentally Friendly | Maximum Cache Level | Clock Speed | Platform Supported | Depth | Process Technology | Width | Package Type | L1 Cache | HyperTransport Speed (MHz) | Overclocking Speed | Energy Star | Processor Socket | QuickPath Interconnect | Graphics Controller Manufacturer | Weight (Approximate) | Product Condition | 64-bit Processing | Input Voltage | Front Side Bus | Processor Threads | Maximum Cache | Height | HyperTransport Speed (MT/s) | Product Name | Integrated Graphics | Intel Optane Memory Capacity | Country of Origin |
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Intel Corporation |
Intel |
Core i3 |
i3-2100 |
Processor |
3 MB |
i3-2100 |
5 GT/s |
512 KB |
HD 2000 |
69.1 °C |
Dual-core (2 Core) |
65 W |
Clear Video HD Technology, InTru 3D Technology, Hyper-Threading Technology, Virtualization Technology, Extended Memory 64 Technology, Thermal Monitoring Technology, Enhanced SpeedStep Technology |
Intel |
3.1 GHz |
PC |
37.5 mm |
32 nm |
37.5 mm |
OEM |
128 KB |
Socket H2 LGA-1155 |
Intel |
0.9 oz |
Yes |
Core i3 Dual-core i3-2100 3.1GHz Desktop Processor |
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Dell Technologies |
Dell |
Core i3 |
i3-2100 |
Processor Upgrade |
2 |
3 MB |
i3-2100 |
5 GT/s |
512 KB |
HD Graphics 2000 |
69.1 °C |
Dual-core (2 Core) |
65 W |
Intel |
3.1 GHz |
32 nm |
Socket H2 LGA-1155 |
Intel |
Yes |
Core i3 Dual-core i3-2100 3.1GHz Desktop Processor Upgrade |
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HP Inc. |
HP |
Core i3 |
i3-2100 |
Processor Upgrade |
3 MB |
i3-2100 |
5 GT/s |
512 KB |
69.1 °C |
Dual-core (2 Core) |
65 W |
InTru 3D Technology, Clear Video HD Technology, Hyper-Threading Technology, Virtualization Technology, Trusted Execution Technology, Enhanced SpeedStep Technology, Thermal Monitoring Technology, Extended Memory 64 Technology |
Intel |
3.1 GHz |
PC |
3.75 cm |
32 nm |
3.75 cm |
OEM |
128 KB |
Socket H2 LGA-1155 |
Yes |
Core i3 Dual-core i3-2100 3.1GHZ Desktop Processor |
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Fujitsu |
Fujitsu |
Core i3 |
i3-2100 |
Processor Upgrade |
3 MB |
i3-2100 |
1 |
5 GT/s |
512 KB |
HD Graphics 2000 |
69.1 °C |
Dual-core (2 Core) |
65 W |
Hyper-Threading Technology, Virtualization Technology, Extended Memory 64 Technology, Enhanced SpeedStep Technology, Thermal Monitoring Technology, InTru 3D Technology, Clear Video HD Technology |
Intel |
RoHS |
Yes |
3.10 GHz |
PC |
37.5 mm |
32 nm |
37.5 mm |
128 KB |
Socket H2 LGA-1155 |
Intel |
Yes |
Core i3 Dual-Core i3-2100 3.1GHz Processor Upgrade |
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Hewlett Packard Enterprise |
HPE |
Core i3 |
i3-2100 |
Processor Upgrade |
3 MB |
i3-2100 |
5 GT/s |
512 KB |
69.1 °C |
Dual-core (2 Core) |
65 W |
Hyper-Threading Technology, Virtualization Technology, Extended Memory 64 Technology, Enhanced SpeedStep Technology |
Intel |
3.1 GHz |
PC |
37.5 mm |
32 nm |
37.5 mm |
128 KB |
Socket H2 LGA-1155 |
Yes |
Core i3 Dual-core i3-2100 3.1GHz FIO Desktop Processor Upgrade |
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HP Inc. |
HP |
Core i3 |
i3-2100 |
Processor Upgrade |
3 MB |
i3-2100 |
5 GT/s |
512 MB |
69 °C |
Dual-core (2 Core) |
65 W |
Hyper-Threading Technology, Virtualization Technology, Extended Memory 64 Technology, Enhanced SpeedStep Technology, Thermal Monitoring Technology |
Intel |
RoHS |
Yes |
3.1 GHz |
PC |
37.5 mm |
32 nm |
37.5 mm |
128 KB |
Socket H2 LGA-1155 |
Yes |
Core i3 Dual-core i3-2100 3.1GHz Desktop Processor Upgrade |
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Intel - IMSourcing Certified Pre-Owned |
Intel - IMSourcing Certified Pre-Owned |
Core i3 |
i3-2100 |
Processor |
3 MB |
i3-2100 |
512 KB |
Dual-core (2 Core) |
65 W |
Hyper-Threading Technology, Virtualization Technology, Extended Memory 64 Technology |
Intel |
3.1 GHz |
PC |
32 nm |
Box |
128 KB |
Socket H2 LGA-1155 |
Refurbished |
Yes |
Core i3-2100 Processor |
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HP Inc. |
HP |
Core i3 |
i3-2100 |
Processor Upgrade |
2 |
3 MB |
HD Graphics 2000 |
1 °C |
Dual-core (2 Core) |
65 W |
Intel |
3.10 GHz |
37.5 mm |
32 nm |
37.5 mm |
Socket H2 LGA-1155 |
Intel |
Yes |
4 |
Core i3 Dual-core (2 Core) i3-2100 3.10 GHz Desktop Processor Upgrade |
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Intel Corporation |
Intel |
Core i3 |
i3-2100 |
Processor |
3 MB |
i3-2100 |
1 |
5 GT/s |
512 KB |
69.1 °C |
Dual-core (2 Core) |
65 W |
Hyper-Threading Technology, Virtualization Technology, Extended Memory 64 Technology, Enhanced SpeedStep Technology |
Intel |
RoHS |
Yes |
3.1 GHz |
PC |
37.5 mm |
32 nm |
37.5 mm |
OEM |
128 KB |
Socket H2 LGA-1155 |
Yes |
Core i3 Dual-core i3-2100 3.1GHz Desktop Processor |
||||||||||||||||||||||||||||||||||||
HP Inc. |
HP |
Core i3 |
i3-2100 |
Processor Upgrade |
3 MB |
i3-2100 |
5 GT/s |
512 KB |
HD Graphics 2000 |
69.1 °C |
Dual-core (2 Core) |
65 W |
InTru 3D Technology, Clear Video HD Technology, Hyper-Threading Technology, Virtualization Technology, Enhanced SpeedStep Technology, Thermal Monitoring Technology, Extended Memory 64 Technology |
Intel |
3.1 GHz |
PC |
37.5 mm |
32 nm |
37.5 mm |
128 KB |
Socket H2 LGA-1155 |
Intel |
Yes |
Core i3 Dual-core i3-2100 3.1GHz Desktop Processor Upgrade |
||||||||||||||||||||||||||||||||||||||
Intel-IMSourcing |
Intel |
Core i3 |
i3-2100 |
Processor |
3 MB |
i3-2100 |
1 |
5 GT/s |
512 KB |
69.1 °C |
Dual-core (2 Core) |
65 W |
Hyper-Threading Technology, Virtualization Technology, Extended Memory 64 Technology, Enhanced SpeedStep Technology |
Intel |
3.1 GHz |
PC |
37.5 mm |
32 nm |
37.5 mm |
OEM |
128 KB |
Socket H2 LGA-1155 |
Yes |
Core i3 Dual-core i3-2100 3.1GHz Desktop Processor |
||||||||||||||||||||||||||||||||||||||
Intel Corporation |
Intel |
Core i3 |
i3-2100 |
Processor |
3 MB |
i3-2100 |
512 KB |
Dual-core (2 Core) |
65 W |
Hyper-Threading Technology, Virtualization Technology, Extended Memory 64 Technology |
Intel |
3.1 GHz |
PC |
32 nm |
Box |
128 KB |
Socket H2 LGA-1155 |
Yes |
Core i3-2100 Processor |
|||||||||||||||||||||||||||||||||||||||||||
HP Inc. |
HP |
Core i3 |
i3-2100 |
Processor Upgrade |
3 MB |
i3-2100 |
5 GT/s |
512 KB |
69.1 °C |
Dual-core (2 Core) |
65 W |
Hyper-Threading Technology, Virtualization Technology, Extended Memory 64 Technology, Enhanced SpeedStep Technology |
Intel |
3.1 GHz |
PC |
37.5 mm |
32 nm |
37.5 mm |
128 KB |
Socket H2 LGA-1155 |
Yes |
Core i3 Dual-core i3-2100 3.1GHz FIO Processor Upgrade |
||||||||||||||||||||||||||||||||||||||||
HP Inc. |
HP |
Core i3 |
i3-2100 |
Processor Upgrade |
3 MB |
i3-2100 |
5 GT/s |
512 KB |
69.1 °C |
Dual-core (2 Core) |
65 W |
Hyper-Threading Technology, Virtualization Technology, Enhanced SpeedStep Technology, InTru 3D Technology, Clear Video HD Technology, Thermal Monitoring Technology, Extended Memory 64 Technology |
Intel |
3.1 GHz |
PC |
37.5 mm |
32 nm |
37.5 mm |
128 KB |
Socket H2 LGA-1155 |
Yes |
Core i3 Dual-core i3-2100 3.1GHz Desktop Processor Upgrade |
||||||||||||||||||||||||||||||||||||||||
HP Inc. |
HP |
Core i3 |
i3-2100 |
Processor Upgrade |
3 MB |
i3-2100 |
5 GT/s |
512 MB |
69 °C |
Dual-core (2 Core) |
65 W |
Hyper-Threading Technology, Virtualization Technology, Extended Memory 64 Technology, Enhanced SpeedStep Technology, Thermal Monitoring Technology |
Intel |
RoHS |
Yes |
3.1 GHz |
PC |
37.5 mm |
32 nm |
37.5 mm |
128 KB |
Socket H2 LGA-1155 |
Yes |
Core i3 Dual-core i3-2100 3.1GHz Desktop Processor Upgrade |
Computer Processors, often referred to simply as processors or CPUs (Central Processing Units), are silicon chips that serve as the brain of a computing device. These integrated circuits are responsible for executing instructions and performing calculations in computers, smartphones, tablets, and other electronic devices. Microprocessors come in various architectures and designs, each optimized for specific applications and performance requirements. They typically include features such as multiple cores, advanced instruction sets, and power-saving technologies to deliver optimal performance and efficiency.