30 Audio Control ICs 19

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Part	Manufacturer	General IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Maximum Supply Current	Channel Separation	Power Supplies (V)	Harmonic Distortion	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	No. of Bands	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Nominal Output Power	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Nominal Noise Figure	Length
LM4844TL	Texas Instruments	VOLUME CONTROL CIRCUIT	INDUSTRIAL	BALL	30	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1	2			84 dB			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	3	-40 Cel	TIN LEAD	BOTTOM	R-XBGA-B30	1	5.5 V		.675 mm	2.54 mm	Not Qualified	2.7 V		e0				2.949 mm
LM4844TLX/NOPB	Texas Instruments	VOLUME CONTROL CIRCUIT	INDUSTRIAL	BALL	30	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3			20 mA		3/5		GRID ARRAY, FINE PITCH	BGA30,5X6,20	Audio/Video Amplifiers	.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B30	1					Not Qualified			e1	30	260
LM49251TL/NOPB	Texas Instruments	VOLUME CONTROL CIRCUIT	INDUSTRIAL	BALL	30	VFBGA	RECTANGULAR	UNSPECIFIED	YES	3	2		6.8 mA	84 dB	3/5		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,20	Audio/Video Amplifiers	.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B30	1	5.5 V	1.37 W	.675 mm	2.8 mm	Not Qualified	2.7 V		e1	30	260	98 dB	3 mm
LM4844TL/NOPB	Texas Instruments	VOLUME CONTROL CIRCUIT	INDUSTRIAL	BALL	30	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3			20 mA		3/5		GRID ARRAY, FINE PITCH	BGA30,5X6,20	Audio/Video Amplifiers	.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B30	1					Not Qualified			e1	30	260
LM49251TLX/NOPB	Texas Instruments	VOLUME CONTROL CIRCUIT	INDUSTRIAL	BALL	30	VFBGA	RECTANGULAR	UNSPECIFIED	YES	3	2		6.8 mA	84 dB	3/5		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,20	Audio/Video Amplifiers	.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B30	1	5.5 V	1.37 W	.675 mm	2.8 mm	Not Qualified	2.7 V		e1	30	260	98 dB	3 mm
LM4844TLX	Texas Instruments	VOLUME CONTROL CIRCUIT	INDUSTRIAL	BALL	30	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1	2			84 dB			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	3	-40 Cel	TIN LEAD	BOTTOM	R-XBGA-B30	1	5.5 V		.675 mm	2.54 mm	Not Qualified	2.7 V		e0				2.949 mm
LC75348	Onsemi		OTHER	THROUGH-HOLE	30	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO			CMOS			9		IN-LINE, SHRINK PITCH	SDIP30,.4	Audio Control ICs	1.78 mm	70 Cel		-30 Cel		DUAL	R-PDIP-T30						Not Qualified
LC75348M	Onsemi		OTHER	GULL WING	30	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES			CMOS			9		SMALL OUTLINE, SHRINK PITCH	SOP30,.4,40	Audio Control ICs	1 mm	70 Cel		-30 Cel		DUAL	R-PDSO-G30						Not Qualified
STA333ISTR	STMicroelectronics	VOLUME CONTROL CIRCUIT	COMMERCIAL	BALL	30	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES				50 mA		3.3,13		GRID ARRAY, FINE PITCH	BGA30,5X6,20	Other Consumer ICs	.5 mm	70 Cel		0 Cel		BOTTOM	R-PBGA-B30						Not Qualified
STA333IS	STMicroelectronics	VOLUME CONTROL CIRCUIT	COMMERCIAL	BALL	30	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES				50 mA		3.3,13		GRID ARRAY, FINE PITCH	BGA30,5X6,20	Other Consumer ICs	.5 mm	70 Cel		0 Cel		BOTTOM	R-PBGA-B30						Not Qualified				NOT SPECIFIED	NOT SPECIFIED
TDA7439	STMicroelectronics	TONE CONTROL CIRCUIT	OTHER	THROUGH-HOLE	30	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	2	BICMOS	10 mA	100 dB	9	.01 %	IN-LINE, SHRINK PITCH	SDIP30,.4	Other Consumer ICs	1.778 mm	85 Cel	3	-10 Cel	MATTE TIN	DUAL	R-PDIP-T30		10.2 V		5.08 mm	10.16 mm	Not Qualified	6 V		e3				27.94 mm
TDA7317	STMicroelectronics	EQUALIZER CIRCUIT	INDUSTRIAL	THROUGH-HOLE	30	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	2	BICMOS	20 mA	100 dB	9	.01 %	IN-LINE, SHRINK PITCH	SDIP30,.4	Audio Control ICs	1.778 mm	85 Cel	5	-40 Cel		DUAL	R-PDIP-T30		10 V		5.08 mm	10.16 mm	Not Qualified	6 V						27.94 mm
TDA7312	STMicroelectronics	TONE CONTROL CIRCUIT	COMMERCIAL	THROUGH-HOLE	30	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	2	BICMOS	11 mA	103 dB	9	.09 %	IN-LINE, SHRINK PITCH	SDIP30,.4	Audio Control ICs	1.778 mm	70 Cel	2	0 Cel	TIN LEAD	DUAL	R-PDIP-T30		10 V		5.08 mm	10.16 mm	Not Qualified	6 V		e0				27.94 mm
TFA9897UK/N1AZ	NXP Semiconductors	VOLUME CONTROL CIRCUIT		BALL	30	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,16		.4 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B30	1	1.95 V		.55 mm	2.06 mm		1.65 V				260		2.72 mm
TFA9897UK	NXP Semiconductors	VOLUME CONTROL CIRCUIT	INDUSTRIAL	BALL	30	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1					5.5 %	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,16		.4 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B30		5.3 V		.55 mm	2.06 mm		2.5 V						2.72 mm
MAX9879ERV+	Maxim Integrated	VOLUME CONTROL CIRCUIT	INDUSTRIAL	BALL	30	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	2	BICMOS	24 mA	75 dB	3.7		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,20	Audio/Video Amplifiers	.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B30	1	5.5 V		.69 mm	2.54 mm	Not Qualified	2.7 V	IT ALSO OPERATES WITH 1.7V TO 3.6V DIGITAL SUPPLY	e1	30	260		3.05 mm
MAX9879ERV+TCEP	Maxim Integrated	VOLUME CONTROL CIRCUIT		BALL	30	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	3	BICMOS	24 mA	75 dB			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,20		.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B30	1	3.6 V		.69 mm	2.54 mm		1.7 V		e1	30	260		3.05 mm
MAX9879ERV+T	Maxim Integrated	VOLUME CONTROL CIRCUIT		BALL	30	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	3	BICMOS	24 mA	75 dB			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,20		.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B30	1	3.6 V		.69 mm	2.54 mm		1.7 V		e1	30	260		3.05 mm
TA1216AN	Toshiba	TONE CONTROL CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	30	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO		3	BIPOLAR	65 mA		9	.25 %	IN-LINE, SHRINK PITCH	SDIP30,.4	Audio Control ICs	1.778 mm	75 Cel	2	-20 Cel		DUAL	R-PDIP-T30		9 V		4.45 mm	10.16 mm	Not Qualified	9 V			NOT SPECIFIED	NOT SPECIFIED		27.4 mm

Audio Control ICs

Audio control ICs, also known as audio processing ICs, are integrated circuits designed to provide a range of audio processing functions in electronic devices. These ICs are used in a variety of audio applications, including home theater systems, music players, and automotive sound systems.

Audio control ICs can be classified into several types based on the specific functions they provide. Some of the most common types of audio control ICs include:

1. Audio amplifiers - These ICs are designed to amplify the electrical signals that represent sound. They can be used to increase the volume of the audio signal, improve the quality of the sound, or provide additional functionality such as equalization or filtering.

2. Audio processors - These ICs are designed to process the audio signal in various ways, such as applying digital signal processing (DSP) algorithms to improve the sound quality or provide special effects.

3. Audio codecs - These ICs are designed to convert analog audio signals to digital signals, and vice versa. They can be used in devices such as smartphones, computers, and digital audio players to enable the recording and playback of digital audio.

4. Audio switches - These ICs are designed to switch between multiple audio inputs or outputs. They can be used in devices such as home theater receivers and automotive sound systems to allow users to switch between different audio sources.

Audio control ICs are often used in conjunction with other components, such as speakers, microphones, and amplifiers, to provide a complete audio system. They can be integrated into a variety of devices, from small portable devices to large home theater systems.