Part | RoHS | Manufacturer | General IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Bandwidth | Maximum Supply Current | Channel Separation | Maximum Reading Time | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Gain | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Nominal Output Power | Maximum Seated Height | Width | Qualification | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Nominal Noise Figure | Length | Demodulation Type |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
CONSUMER CIRCUIT |
COMMERCIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.8,3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
Color Signal Converters |
1 mm |
70 Cel |
-10 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.89 V |
1.7 mm |
17 mm |
Not Qualified |
1.71 V |
ALSO REQUIRES DIGITAL SUPPLY 1.75 TO 1.85V |
e1 |
260 |
17 mm |
|||||||||||||
|
Analog Devices |
CONSUMER CIRCUIT |
COMMERCIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.8,3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
Color Signal Converters |
1 mm |
70 Cel |
-10 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.89 V |
1.7 mm |
17 mm |
Not Qualified |
1.71 V |
ALSO REQUIRES DIGITAL SUPPLY 1.75 TO 1.85V |
e1 |
260 |
17 mm |
|||||||||||||
|
Texas Instruments |
CONSUMER CIRCUIT |
OTHER |
BALL |
256 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.2,1.8,2.5 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA256,16X16,32 |
Other Consumer ICs |
.8 mm |
85 Cel |
-20 Cel |
BOTTOM |
S-PBGA-B256 |
3 |
1.25 V |
1.46 mm |
14 mm |
Not Qualified |
1.15 V |
30 |
260 |
14 mm |
||||||||||||||||
Texas Instruments |
CONSUMER CIRCUIT |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
1 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B256 |
2.02 mm |
17 mm |
Not Qualified |
17 mm |
|||||||||||||||||||||||||
|
Texas Instruments |
CONSUMER CIRCUIT |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
1 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.26 V |
2.02 mm |
17 mm |
Not Qualified |
1.14 V |
e1 |
30 |
260 |
17 mm |
|||||||||||||||||
|
Analog Devices |
CONSUMER CIRCUIT |
OTHER |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GRID ARRAY, LOW PROFILE |
1.27 mm |
85 Cel |
-25 Cel |
BOTTOM |
S-PBGA-B256 |
3 |
2.625 V |
1.7 mm |
27 mm |
Not Qualified |
2.375 V |
30 |
260 |
27 mm |
||||||||||||||||||
Analog Devices |
CONSUMER CIRCUIT |
OTHER |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GRID ARRAY, LOW PROFILE |
1.27 mm |
85 Cel |
-25 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B256 |
3 |
2.625 V |
1.7 mm |
27 mm |
Not Qualified |
2.375 V |
e0 |
225 |
27 mm |
||||||||||||||||||
Onsemi |
CONSUMER CIRCUIT |
OTHER |
GULL WING |
256 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
1.2,3.3 |
FLATPACK |
QFP256,1.2SQ,16 |
Other Consumer ICs |
.4 mm |
70 Cel |
-30 Cel |
QUAD |
S-PQFP-G256 |
Not Qualified |
|||||||||||||||||||||||||
|
NXP Semiconductors |
CONSUMER CIRCUIT |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
GRID ARRAY |
BGA256,16X16,40 |
Other Consumer ICs |
1 mm |
BOTTOM |
S-PBGA-B256 |
Not Qualified |
||||||||||||||||||||||||||||
NXP Semiconductors |
CONSUMER CIRCUIT |
COMMERCIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
260 mA |
1.8,3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
Other Consumer ICs |
1 mm |
70 Cel |
0 Cel |
BOTTOM |
S-PBGA-B256 |
1.9 V |
1.55 mm |
17 mm |
Not Qualified |
1.7 V |
ALSO REQUIRES SUPPLY FROM 3.15 TO 3.45 |
17 mm |
||||||||||||||||||
|
NXP Semiconductors |
CONSUMER CIRCUIT |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
GRID ARRAY |
BGA256,16X16,40 |
Other Consumer ICs |
1 mm |
BOTTOM |
S-PBGA-B256 |
Not Qualified |
||||||||||||||||||||||||||||
NXP Semiconductors |
CONSUMER CIRCUIT |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
GRID ARRAY |
BGA256,16X16,40 |
Other Consumer ICs |
1 mm |
BOTTOM |
S-PBGA-B256 |
Not Qualified |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
CONSUMER CIRCUIT |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
260 mA |
1.8,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
Other Consumer ICs |
1 mm |
70 Cel |
0 Cel |
BOTTOM |
S-PBGA-B256 |
Not Qualified |
||||||||||||||||||||||||
|
NXP Semiconductors |
CONSUMER CIRCUIT |
COMMERCIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
Other Consumer ICs |
1 mm |
70 Cel |
0 Cel |
BOTTOM |
S-PBGA-B256 |
1.95 V |
1.65 mm |
17 mm |
Not Qualified |
1.65 V |
ALSO OPERATES WITH 3.3V SUPPLY |
17 mm |
||||||||||||||||||
NXP Semiconductors |
CONSUMER CIRCUIT |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
GRID ARRAY |
BGA256,16X16,40 |
Other Consumer ICs |
1 mm |
BOTTOM |
S-PBGA-B256 |
Not Qualified |
|||||||||||||||||||||||||||||
NXP Semiconductors |
CONSUMER CIRCUIT |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
GRID ARRAY |
BGA256,16X16,40 |
Other Consumer ICs |
1 mm |
BOTTOM |
S-PBGA-B256 |
Not Qualified |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
CONSUMER CIRCUIT |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
GRID ARRAY |
BGA256,16X16,40 |
Other Consumer ICs |
1 mm |
BOTTOM |
S-PBGA-B256 |
Not Qualified |
||||||||||||||||||||||||||||
|
Toshiba |
CONSUMER CIRCUIT |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B256 |
2.7 V |
1.4 mm |
17 mm |
2.3 V |
ALSO OPERATES AT 1.4V TO 1.6V |
NOT SPECIFIED |
NOT SPECIFIED |
17 mm |
|||||||||||||||||||
|
Renesas Electronics |
CONSUMER CIRCUIT |
COMMERCIAL |
BALL |
256 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
70 Cel |
0 Cel |
BOTTOM |
S-PBGA-B256 |
1.05 V |
1.7 mm |
13.5 mm |
.95 V |
NOT SPECIFIED |
NOT SPECIFIED |
13.5 mm |
|||||||||||||||||||||
|
Renesas Electronics |
CONSUMER CIRCUIT |
INDUSTRIAL |
BALL |
256 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
4 |
GRID ARRAY, HEAT SINK/SLUG |
1 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.98 V |
2 mm |
17 mm |
1.62 V |
e1 |
17 mm |
||||||||||||||||||||
|
Renesas Electronics |
CONSUMER CIRCUIT |
INDUSTRIAL |
BALL |
256 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY, HEAT SINK/SLUG |
1 mm |
85 Cel |
-40 Cel |
TIN SILVER |
BOTTOM |
S-PBGA-B256 |
3 |
1.98 V |
2 mm |
17 mm |
1.62 V |
e2 |
17 mm |
||||||||||||||||||||
Broadcom |
CONSUMER CIRCUIT |
COMMERCIAL |
GULL WING |
256 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
3.3 |
FLATPACK |
QFP256,1.2SQ,16 |
Other Consumer ICs |
.4 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQFP-G256 |
Not Qualified |
e0 |
|||||||||||||||||||||||
Broadcom |
CONSUMER CIRCUIT |
COMMERCIAL |
GULL WING |
256 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
3.3 |
FLATPACK |
QFP256,1.2SQ,16 |
Other Consumer ICs |
.4 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQFP-G256 |
Not Qualified |
e0 |
Other function consumer ICs are a broad category of electronic components that provide a variety of specialized functions in consumer electronics products. These ICs are used in a wide range of applications, including entertainment systems, home automation, and mobile devices.
Other function consumer ICs can be classified into several types based on the specific functions they provide. Some of the most common types of other function consumer ICs include:
1. Power management ICs - These ICs are designed to manage the power supply in electronic devices, providing a way to regulate voltage, current, and power consumption.
2. Memory ICs - These ICs are used to store and retrieve data in electronic devices, such as smartphones, computers, and digital cameras.
3. Sensor ICs - These ICs are used to detect physical phenomena, such as temperature, pressure, and motion, and convert them into electrical signals that can be processed by other electronic components.
4. Interface ICs - These ICs are used to provide a connection between different electronic components or devices, such as USB, HDMI, and Ethernet interfaces.
Other function consumer ICs can be integrated into a variety of devices, from small portable devices to large home automation systems. They can also be used in combination with other components, such as processors, amplifiers, and filters, to provide a complete electronic system.