Part | RoHS | Manufacturer | General IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Bandwidth | Maximum Supply Current | Channel Separation | Maximum Reading Time | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Gain | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Nominal Output Power | Maximum Seated Height | Width | Qualification | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Nominal Noise Figure | Length | Demodulation Type |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
CONSUMER CIRCUIT |
INDUSTRIAL |
BALL |
9 |
VFBGA |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
.022 mA |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,20 |
Other Consumer ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-XBGA-B9 |
1 |
5.5 V |
.69 mm |
1.52 mm |
Not Qualified |
2.7 V |
e0 |
1.52 mm |
|||||||||||||||
|
Analog Devices |
CONSUMER CIRCUIT |
INDUSTRIAL |
BALL |
9 |
VFBGA |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
.022 mA |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,20 |
Other Consumer ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-XBGA-B9 |
1 |
5.5 V |
.69 mm |
1.52 mm |
Not Qualified |
2.7 V |
e1 |
30 |
260 |
1.52 mm |
||||||||||||
|
Onsemi |
CONSUMER CIRCUIT |
OTHER |
BALL |
9 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-30 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B9 |
1 |
.63 mm |
1.14 mm |
e1 |
30 |
260 |
1.14 mm |
||||||||||||||||||||
Nte Electronics |
CONSUMER CIRCUIT |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
9 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
8.5 mA |
IN-LINE |
80 Cel |
-25 Cel |
SINGLE |
R-PSIP-T9 |
16 V |
Not Qualified |
3.5 V |
|||||||||||||||||||||||||||
|
Nte Electronics |
CONSUMER CIRCUIT |
OTHER |
THROUGH-HOLE |
9 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
12 mA |
IN-LINE |
70 Cel |
-25 Cel |
SINGLE |
R-PSIP-T9 |
16 V |
Not Qualified |
5.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||
Toshiba |
CONSUMER CIRCUIT |
THROUGH-HOLE |
9 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
IN-LINE |
TIN LEAD |
SINGLE |
R-PSIP-T9 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||
|
Analog Devices |
CONSUMER CIRCUIT |
INDUSTRIAL |
BALL |
9 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,16 |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B9 |
1 |
1.98 V |
.56 mm |
1.26 mm |
1.1 V |
30 |
260 |
1.26 mm |
||||||||||||||||||
|
Analog Devices |
CONSUMER CIRCUIT |
INDUSTRIAL |
BALL |
9 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,16 |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B9 |
1 |
1.98 V |
.56 mm |
1.26 mm |
1.1 V |
30 |
260 |
1.26 mm |
||||||||||||||||||
Onsemi |
CONSUMER CIRCUIT |
OTHER |
THROUGH-HOLE |
9 |
ZIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
BICMOS |
11 mA |
200 |
FLANGE MOUNT |
ZIP9,.1,100TB |
Other Consumer ICs |
2.54 mm |
85 Cel |
-20 Cel |
ZIG-ZAG |
R-XZFM-T9 |
210 V |
Not Qualified |
180 V |
|||||||||||||||||||||
Onsemi |
CONSUMER CIRCUIT |
OTHER |
BALL |
9 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-30 Cel |
BOTTOM |
S-PBGA-B9 |
20 V |
.63 mm |
1.14 mm |
6 V |
1.14 mm |
||||||||||||||||||||||||
Onsemi |
CONSUMER CIRCUIT |
OTHER |
NO LEAD |
9 |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
MOS |
UNCASED CHIP |
DIE OR CHIP |
70 Cel |
-30 Cel |
DUAL |
X-XUUC-N9 |
3.6 V |
1.64 V |
||||||||||||||||||||||||||
|
STMicroelectronics |
CONSUMER CIRCUIT |
OTHER |
BALL |
9 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
.4 mm |
85 Cel |
-30 Cel |
BOTTOM |
S-PBGA-B9 |
.66 mm |
1.14 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
1.14 mm |
||||||||||||||||||||||
NXP Semiconductors |
CONSUMER CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
9 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
14 mA |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
SINGLE |
R-PSIP-T9 |
18 V |
10.96 mm |
3.65 mm |
Not Qualified |
5 V |
21.675 mm |
||||||||||||||||||||||
|
NXP Semiconductors |
CONSUMER CIRCUIT |
BALL |
9 |
VFBGA |
SQUARE |
UNSPECIFIED |
YES |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,16 |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-XBGA-B9 |
1 |
3.6 V |
.54 mm |
1.22 mm |
1.6 V |
260 |
1.22 mm |
|||||||||||||||||||||
NXP Semiconductors |
CONSUMER CIRCUIT |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
9 |
HSIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
70 mA |
IN-LINE, HEAT SINK/SLUG |
2.54 mm |
80 Cel |
-20 Cel |
SINGLE |
R-PSIP-T9 |
12 V |
12 mm |
Not Qualified |
4 V |
21.6 mm |
|||||||||||||||||||||||
NXP Semiconductors |
CONSUMER CIRCUIT |
INDUSTRIAL |
BALL |
9 |
VFBGA |
SQUARE |
UNSPECIFIED |
YES |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,16 |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-XBGA-B9 |
3.6 V |
.54 mm |
1.22 mm |
1.6 V |
1.22 mm |
|||||||||||||||||||||||
NXP Semiconductors |
CONSUMER CIRCUIT |
BALL |
9 |
VFBGA |
SQUARE |
UNSPECIFIED |
YES |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,16 |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-XBGA-B9 |
3.6 V |
.54 mm |
1.22 mm |
1.6 V |
1.22 mm |
||||||||||||||||||||||||
|
NXP Semiconductors |
CONSUMER CIRCUIT |
UNSPECIFIED |
9 |
UNSPECIFIED |
UNSPECIFIED |
NO |
1 |
SPECIAL SHAPE |
UNSPECIFIED |
X-XXSS-X9 |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
CONSUMER CIRCUIT |
UNSPECIFIED |
9 |
UNSPECIFIED |
UNSPECIFIED |
NO |
1 |
SPECIAL SHAPE |
UNSPECIFIED |
X-XXSS-X9 |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
CONSUMER CIRCUIT |
UNSPECIFIED |
9 |
UNSPECIFIED |
UNSPECIFIED |
NO |
1 |
SPECIAL SHAPE |
GOLD |
UNSPECIFIED |
X-XXSS-X9 |
e4 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
CONSUMER CIRCUIT |
OTHER |
THROUGH-HOLE |
9 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
30 mA |
IN-LINE |
2.54 mm |
85 Cel |
-30 Cel |
SINGLE |
R-PSIP-T9 |
18 V |
10.2 mm |
3.55 mm |
Not Qualified |
10.2 V |
21 mm |
||||||||||||||||||||||
|
Maxim Integrated |
CONSUMER CIRCUIT |
INDUSTRIAL |
BALL |
9 |
VFBGA |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
.022 mA |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,20 |
Other Consumer ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-XBGA-B9 |
1 |
5.5 V |
.69 mm |
1.52 mm |
Not Qualified |
2.7 V |
e1 |
30 |
260 |
1.52 mm |
||||||||||||
|
Maxim Integrated |
CONSUMER CIRCUIT |
INDUSTRIAL |
BALL |
9 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B9 |
1 |
5.5 V |
.67 mm |
1.52 mm |
2.7 V |
e1 |
30 |
260 |
1.52 mm |
|||||||||||||||||
Maxim Integrated |
CONSUMER CIRCUIT |
INDUSTRIAL |
BALL |
9 |
VFBGA |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
.022 mA |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,20 |
Other Consumer ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-XBGA-B9 |
1 |
5.5 V |
.69 mm |
1.52 mm |
Not Qualified |
2.7 V |
e0 |
1.52 mm |
|||||||||||||||
Toshiba |
CONSUMER CIRCUIT |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
9 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
27 mA |
9 |
IN-LINE |
SIP9,.05 |
Remote Control ICs |
2.54 mm |
75 Cel |
-25 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
R-PSIP-T9 |
11 V |
7.9 mm |
3.2 mm |
Not Qualified |
6 V |
e0 |
22.28 mm |
||||||||||||||||
Toshiba |
CONSUMER CIRCUIT |
THROUGH-HOLE |
9 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
IN-LINE |
SINGLE |
R-PSIP-T9 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||
Toshiba |
CONSUMER CIRCUIT |
OTHER |
THROUGH-HOLE |
9 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
15 mA |
IN-LINE |
2.54 mm |
85 Cel |
-30 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
R-PSIP-T9 |
10 V |
7.9 mm |
3.2 mm |
Not Qualified |
5 V |
e0 |
22.28 mm |
|||||||||||||||||||
Toshiba |
CONSUMER CIRCUIT |
THROUGH-HOLE |
9 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
IN-LINE |
SINGLE |
R-PSIP-T9 |
16 V |
Not Qualified |
4 V |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||
Toshiba |
CONSUMER CIRCUIT |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
9 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
18 mA |
IN-LINE |
2.54 mm |
75 Cel |
-30 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
R-PSIP-T9 |
12 V |
7.9 mm |
3.2 mm |
Not Qualified |
3.5 V |
e0 |
22.28 mm |
|||||||||||||||||||
Toshiba |
CONSUMER CIRCUIT |
THROUGH-HOLE |
9 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
IN-LINE |
TIN LEAD |
SINGLE |
R-PSIP-T9 |
18 V |
Not Qualified |
7 V |
e0 |
||||||||||||||||||||||||||||
Toshiba |
CONSUMER CIRCUIT |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
9 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
6 mA |
IN-LINE |
2.54 mm |
75 Cel |
-25 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
R-PSIP-T9 |
10 V |
5.7 mm |
2.8 mm |
Not Qualified |
1.8 V |
e0 |
22.8 mm |
|||||||||||||||||||
Toshiba |
CONSUMER CIRCUIT |
THROUGH-HOLE |
9 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
IN-LINE |
SINGLE |
R-PSIP-T9 |
10 V |
Not Qualified |
3.6 V |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||
Toshiba |
CONSUMER CIRCUIT |
THROUGH-HOLE |
9 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
IN-LINE |
SINGLE |
R-PSIP-T9 |
5.5 V |
Not Qualified |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||
Renesas Electronics |
CONSUMER CIRCUIT |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
9 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
IN-LINE |
2.54 mm |
75 Cel |
-20 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
R-PSIP-T9 |
14.4 V |
5.75 mm |
2.8 mm |
Not Qualified |
8 V |
e0 |
||||||||||||||||||||||
|
Renesas Electronics |
CONSUMER CIRCUIT |
OTHER |
BALL |
9 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.65 mm |
85 Cel |
0 Cel |
BOTTOM |
S-PBGA-B9 |
5.5 V |
1.045 mm |
2.155 mm |
4.5 V |
2.155 mm |
|||||||||||||||||||||||
|
Renesas Electronics |
CONSUMER CIRCUIT |
OTHER |
BALL |
9 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.65 mm |
85 Cel |
0 Cel |
BOTTOM |
S-PBGA-B9 |
5.5 V |
1.045 mm |
2.155 mm |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
2.155 mm |
|||||||||||||||||||||
|
Renesas Electronics |
CONSUMER CIRCUIT |
BALL |
9 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.65 mm |
BOTTOM |
S-PBGA-B9 |
5.5 V |
1.045 mm |
2.155 mm |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
2.155 mm |
||||||||||||||||||||||||
|
Renesas Electronics |
CONSUMER CIRCUIT |
BALL |
9 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.65 mm |
BOTTOM |
S-PBGA-B9 |
5.5 V |
1.045 mm |
2.155 mm |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
2.155 mm |
||||||||||||||||||||||||
Samsung |
CONSUMER CIRCUIT |
THROUGH-HOLE |
9 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
IN-LINE |
SINGLE |
R-PSIP-T9 |
12 V |
Not Qualified |
6 V |
||||||||||||||||||||||||||||||
Samsung |
COMMERCIAL EXTENDED |
9 |
PLASTIC/EPOXY |
NO |
BIPOLAR |
28 mA |
12 |
SIP9,.1 |
Other Consumer ICs |
2.54 mm |
80 Cel |
-20 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
Not Qualified |
e0 |
||||||||||||||||||||||||||||
Samsung |
CONSUMER CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
9 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
IN-LINE |
2.54 mm |
70 Cel |
-20 Cel |
TIN LEAD |
SINGLE |
R-PSIP-T9 |
5 V |
7.3 mm |
3 mm |
Not Qualified |
1.8 V |
e0 |
21.84 mm |
|||||||||||||||||||||
Samsung |
COMMERCIAL EXTENDED |
9 |
PLASTIC/EPOXY |
NO |
BIPOLAR |
28 mA |
12 |
SIP9,.1 |
Other Consumer ICs |
2.54 mm |
80 Cel |
-20 Cel |
SINGLE |
Not Qualified |
||||||||||||||||||||||||||||||
Samsung |
CONSUMER CIRCUIT |
THROUGH-HOLE |
9 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
IN-LINE |
SINGLE |
R-PSIP-T9 |
12 V |
Not Qualified |
6 V |
||||||||||||||||||||||||||||||
Samsung |
CONSUMER CIRCUIT |
THROUGH-HOLE |
9 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
IN-LINE |
SINGLE |
R-PSIP-T9 |
10 V |
Not Qualified |
2.5 V |
||||||||||||||||||||||||||||||
Samsung |
COMMERCIAL |
9 |
PLASTIC/EPOXY |
NO |
BIPOLAR |
9 mA |
12 |
SIP9,.1 |
Other Consumer ICs |
2.54 mm |
70 Cel |
-20 Cel |
SINGLE |
Not Qualified |
||||||||||||||||||||||||||||||
Samsung |
CONSUMER CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
9 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
9 mA |
12 |
IN-LINE |
SIP9,.1 |
Audio Control ICs |
2.54 mm |
70 Cel |
-20 Cel |
TIN LEAD |
SINGLE |
R-PSIP-T9 |
Not Qualified |
e0 |
|||||||||||||||||||||
Samsung |
CONSUMER CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
9 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
IN-LINE |
2.54 mm |
70 Cel |
-20 Cel |
TIN LEAD |
SINGLE |
R-PSIP-T9 |
12 V |
7.3 mm |
3 mm |
Not Qualified |
3 V |
e0 |
21.84 mm |
|||||||||||||||||||||
Samsung |
COMMERCIAL EXTENDED |
9 |
PLASTIC/EPOXY |
NO |
BIPOLAR |
28 mA |
12 |
SIP9,.1 |
Other Consumer ICs |
2.54 mm |
80 Cel |
-20 Cel |
SINGLE |
Not Qualified |
Other function consumer ICs are a broad category of electronic components that provide a variety of specialized functions in consumer electronics products. These ICs are used in a wide range of applications, including entertainment systems, home automation, and mobile devices.
Other function consumer ICs can be classified into several types based on the specific functions they provide. Some of the most common types of other function consumer ICs include:
1. Power management ICs - These ICs are designed to manage the power supply in electronic devices, providing a way to regulate voltage, current, and power consumption.
2. Memory ICs - These ICs are used to store and retrieve data in electronic devices, such as smartphones, computers, and digital cameras.
3. Sensor ICs - These ICs are used to detect physical phenomena, such as temperature, pressure, and motion, and convert them into electrical signals that can be processed by other electronic components.
4. Interface ICs - These ICs are used to provide a connection between different electronic components or devices, such as USB, HDMI, and Ethernet interfaces.
Other function consumer ICs can be integrated into a variety of devices, from small portable devices to large home automation systems. They can also be used in combination with other components, such as processors, amplifiers, and filters, to provide a complete electronic system.