OTHER Other Function Consumer ICs 1,377

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Part RoHS Manufacturer General IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions No. of Channels Technology Screening Level Nominal Bandwidth Maximum Supply Current Channel Separation Maximum Reading Time Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Gain Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Nominal Output Power Maximum Seated Height Width Qualification Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Nominal Noise Figure Length Demodulation Type

TDA19989AET/C181,5

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

BALL

64

FBGA

SQUARE

PLASTIC/EPOXY

YES

72 mA

1.8

GRID ARRAY, FINE PITCH

BGA64,8X8,20

Other Consumer ICs

.5 mm

85 Cel

-20 Cel

BOTTOM

S-PBGA-B64

Not Qualified

TDA19989AET/C101,5

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

BALL

64

FBGA

SQUARE

PLASTIC/EPOXY

YES

72 mA

1.8

GRID ARRAY, FINE PITCH

BGA64,8X8,20

Other Consumer ICs

.5 mm

85 Cel

-20 Cel

BOTTOM

S-PBGA-B64

Not Qualified

PTN3356R1BSZ

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

0 Cel

QUAD

S-PQCC-N32

3.6 V

.85 mm

5 mm

2.8 V

SEATED HEIGHT CONSIDERED NOMINAL

5 mm

UDA1338H

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3

FLATPACK

QFP44,.5SQ,32

Other Consumer ICs

.8 mm

85 Cel

-20 Cel

MATTE TIN

QUAD

S-PQFP-G44

3.6 V

2.1 mm

10 mm

Not Qualified

2.7 V

ALSO IT REQUIRES 2.7V TO 3.6V DIGITAL SUPPLY

e3

10 mm

TDA19988BHN/C1

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-20 Cel

QUAD

S-PQCC-N64

1.9 V

1 mm

9 mm

1.7 V

9 mm

UDA1341TSDB-T

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE, SHRINK PITCH

.65 mm

85 Cel

-20 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G28

3.6 V

2 mm

5.3 mm

Not Qualified

2.4 V

e4

10.2 mm

PTN36001HX

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

NO LEAD

12

VQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

CHIP CARRIER, VERY THIN PROFILE

.4 mm

85 Cel

0 Cel

QUAD

R-PQCC-N12

1.9 V

.4 mm

1.25 mm

1.7 V

2.1 mm

TDA18291HN/C1

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Consumer ICs

.5 mm

70 Cel

-30 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

S-PQCC-N32

1

3 V

1 mm

5 mm

Not Qualified

2.6 V

IT ALSO REQUIRED 1.8V DIGITAL SUPPLY

e4

30

260

5 mm

PTN36242LBS

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

0 Cel

QUAD

R-PQCC-N32

3.6 V

1 mm

3 mm

3 V

6 mm

UDA1384H

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

1

FLATPACK

.8 mm

85 Cel

-20 Cel

MATTE TIN

QUAD

S-PQFP-G44

3.6 V

2.1 mm

10 mm

Not Qualified

2.7 V

e3

10 mm

TDA19989AET/C189,5

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

BALL

64

FBGA

SQUARE

PLASTIC/EPOXY

YES

72 mA

1.8

GRID ARRAY, FINE PITCH

BGA64,8X8,20

Other Consumer ICs

.5 mm

85 Cel

-20 Cel

BOTTOM

S-PBGA-B64

Not Qualified

PTN36241BBS,118

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

0 Cel

QUAD

S-PQCC-N24

1

3.6 V

1 mm

4 mm

3 V

30

260

4 mm

TDA19988AET/C1

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

BALL

64

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-20 Cel

BOTTOM

S-PBGA-B64

1.9 V

1.1 mm

4.5 mm

1.7 V

4.5 mm

TDA18291HN/C1,157

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Consumer ICs

.5 mm

70 Cel

-30 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

S-PQCC-N32

1

3 V

1 mm

5 mm

Not Qualified

2.6 V

IT ALSO REQUIRED 1.8V DIGITAL SUPPLY

e4

30

260

5 mm

PTN36242LBS,518

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

0 Cel

QUAD

R-PQCC-N32

3

3.6 V

1 mm

3 mm

3 V

260

6 mm

UDA1341TS/N1/N,118

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

Other Consumer ICs

.65 mm

85 Cel

-20 Cel

DUAL

R-PDSO-G28

3.6 V

2 mm

5.3 mm

Not Qualified

2.4 V

10.2 mm

TEA5760UK

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

BALL

25

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-20 Cel

BOTTOM

R-PBGA-B25

3.6 V

.64 mm

2.85 mm

Not Qualified

2.6 V

3 mm

TEA5760UK/N1,118

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

BALL

25

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-20 Cel

BOTTOM

R-PBGA-B25

3.6 V

.64 mm

2.85 mm

Not Qualified

2.6 V

3 mm

UDA1341TS/N1,118

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

Other Consumer ICs

.65 mm

85 Cel

-20 Cel

DUAL

R-PDSO-G28

3.6 V

2 mm

5.3 mm

Not Qualified

2.4 V

10.2 mm

IP4787CZ32,518

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

NO LEAD

32

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER, VERY THIN PROFILE

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

6.5 V

.85 mm

5 mm

4.5 V

5 mm

UDA1341TS/N1,112

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

Other Consumer ICs

.65 mm

85 Cel

-20 Cel

DUAL

R-PDSO-G28

3.6 V

2 mm

5.3 mm

Not Qualified

2.4 V

10.2 mm

PTN36241BBS

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

0 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N24

1

3.6 V

1 mm

4 mm

3 V

e4

4 mm

IP4788CZ32

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

1

6.5 V

.85 mm

5 mm

4.5 V

ALSO REQUIRED SUPPLY FOR LEVEL SHIFTING 3.3V, SEATED HGT-NOM

5 mm

TDA18291HN/C1,118

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

-30 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

1

3 V

1 mm

5 mm

Not Qualified

2.6 V

IT ALSO REQUIRED 1.8V DIGITAL SUPPLY

e4

5 mm

UDA1338H/N1,557

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3

FLATPACK

QFP44,.5SQ,32

Other Consumer ICs

.8 mm

85 Cel

-20 Cel

TIN

QUAD

S-PQFP-G44

3

3.6 V

2.1 mm

10 mm

Not Qualified

2.7 V

e3

10 mm

IP4787CZ32

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-25 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

2

6.5 V

.85 mm

5 mm

4.5 V

e4

5 mm

TDA19988BET/C1

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

BALL

64

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-20 Cel

BOTTOM

S-PBGA-B64

1.9 V

1.1 mm

4.5 mm

1.7 V

4.5 mm

TDA18291HN/C1,151

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

-30 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

1

3 V

1 mm

5 mm

Not Qualified

2.6 V

IT ALSO REQUIRED 1.8V DIGITAL SUPPLY

e4

5 mm

TEA5560U

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

THROUGH-HOLE

9

SIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

30 mA

IN-LINE

2.54 mm

85 Cel

-30 Cel

SINGLE

R-PSIP-T9

18 V

10.2 mm

3.55 mm

Not Qualified

10.2 V

21 mm

UDA1340M

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

Other Consumer ICs

.65 mm

85 Cel

-20 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G28

3.6 V

2 mm

5.3 mm

Not Qualified

2.7 V

e4

10.2 mm

TDA19989AETC189,55

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

BALL

64

FBGA

SQUARE

PLASTIC/EPOXY

YES

72 mA

1.8

GRID ARRAY, FINE PITCH

BGA64,8X8,20

Other Consumer ICs

.5 mm

85 Cel

-20 Cel

BOTTOM

S-PBGA-B64

Not Qualified

UDA1341TS/N1/N,112

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

Other Consumer ICs

.65 mm

85 Cel

-20 Cel

DUAL

R-PDSO-G28

3.6 V

2 mm

5.3 mm

Not Qualified

2.4 V

10.2 mm

UDA1338H/N1,518

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3

FLATPACK

QFP44,.5SQ,32

Other Consumer ICs

.8 mm

85 Cel

-20 Cel

TIN

QUAD

S-PQFP-G44

3

3.6 V

2.1 mm

10 mm

Not Qualified

2.7 V

e3

10 mm

UDA1341TSDB

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE, SHRINK PITCH

.65 mm

85 Cel

-20 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G28

3.6 V

2 mm

5.3 mm

Not Qualified

2.4 V

e4

10.2 mm

PTN36242LBS/S900

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

0 Cel

QUAD

R-PQCC-N32

3.6 V

1 mm

3 mm

3 V

6 mm

TDA19989AET/C185,5

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

BALL

64

FBGA

SQUARE

PLASTIC/EPOXY

YES

72 mA

1.8

GRID ARRAY, FINE PITCH

BGA64,8X8,20

Other Consumer ICs

.5 mm

85 Cel

-20 Cel

BOTTOM

S-PBGA-B64

Not Qualified

IP4787CZ32Y

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

32

PLASTIC/EPOXY

YES

1.2/3.3,5

LCC32,.2SQ,20

Other Consumer ICs

85 Cel

-25 Cel

Not Qualified

UDA1341TS/N1

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE, SHRINK PITCH

.65 mm

85 Cel

-20 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G28

3.6 V

2 mm

5.3 mm

Not Qualified

2.4 V

e4

10.2 mm

TDA19989AET

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

BALL

64

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-20 Cel

BOTTOM

S-PBGA-B64

1.9 V

1.1 mm

4.5 mm

Not Qualified

1.7 V

4.5 mm

TEA5760UK/N1/S21,1

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

BALL

25

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-20 Cel

BOTTOM

R-PBGA-B25

3.6 V

.64 mm

2.85 mm

Not Qualified

2.6 V

3 mm

UDA1340M-T

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE, SHRINK PITCH

.65 mm

85 Cel

-20 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G28

3.6 V

2 mm

5.3 mm

Not Qualified

2.7 V

e4

10.2 mm

UDA1341TS/N1,518

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

Other Consumer ICs

.65 mm

85 Cel

-20 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G28

2

3.6 V

2 mm

5.3 mm

Not Qualified

2.4 V

e4

260

10.2 mm

PTN3356R1BSMP

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

0 Cel

QUAD

S-PQCC-N32

3

3.6 V

.85 mm

5 mm

2.8 V

SEATED HEIGHT CONSIDERED NOMINAL

260

5 mm

TDA19988AHN/C1

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-20 Cel

QUAD

S-PQCC-N64

1.9 V

1 mm

9 mm

1.7 V

9 mm

TDA19989AET/C1,551

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

BALL

64

FBGA

SQUARE

PLASTIC/EPOXY

YES

72 mA

1.8

GRID ARRAY, FINE PITCH

BGA64,8X8,20

Other Consumer ICs

.5 mm

85 Cel

-20 Cel

BOTTOM

S-PBGA-B64

Not Qualified

PTN3356R1BS

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

0 Cel

QUAD

S-PQCC-N32

3.6 V

.85 mm

5 mm

2.8 V

SEATED HEIGHT CONSIDERED NOMINAL

5 mm

TDA19989AET/C131,5

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

BALL

64

FBGA

SQUARE

PLASTIC/EPOXY

YES

72 mA

1.8

GRID ARRAY, FINE PITCH

BGA64,8X8,20

Other Consumer ICs

.5 mm

85 Cel

-20 Cel

BOTTOM

S-PBGA-B64

Not Qualified

TDA19989AETC189,51

NXP Semiconductors

CONSUMER CIRCUIT

OTHER

BALL

64

FBGA

SQUARE

PLASTIC/EPOXY

YES

72 mA

1.8

GRID ARRAY, FINE PITCH

BGA64,8X8,20

Other Consumer ICs

.5 mm

85 Cel

-20 Cel

BOTTOM

S-PBGA-B64

Not Qualified

Other Function Consumer ICs

Other function consumer ICs are a broad category of electronic components that provide a variety of specialized functions in consumer electronics products. These ICs are used in a wide range of applications, including entertainment systems, home automation, and mobile devices.

Other function consumer ICs can be classified into several types based on the specific functions they provide. Some of the most common types of other function consumer ICs include:

1. Power management ICs - These ICs are designed to manage the power supply in electronic devices, providing a way to regulate voltage, current, and power consumption.

2. Memory ICs - These ICs are used to store and retrieve data in electronic devices, such as smartphones, computers, and digital cameras.

3. Sensor ICs - These ICs are used to detect physical phenomena, such as temperature, pressure, and motion, and convert them into electrical signals that can be processed by other electronic components.

4. Interface ICs - These ICs are used to provide a connection between different electronic components or devices, such as USB, HDMI, and Ethernet interfaces.

Other function consumer ICs can be integrated into a variety of devices, from small portable devices to large home automation systems. They can also be used in combination with other components, such as processors, amplifiers, and filters, to provide a complete electronic system.