Part | RoHS | Manufacturer | General IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Maximum Supply Current | Power Supplies (V) | Harmonic Distortion | Nominal Output Voltage (FM) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Nominal Signal to Noise Ratio (FM) | Qualification | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Nominal Output Voltage (AM) | Demodulation Type |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP Semiconductors |
AUDIO SINGLE CHIP RECEIVER |
COMMERCIAL EXTENDED |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.5 % |
75 mV |
FLATPACK, LOW PROFILE |
.8 mm |
75 Cel |
-10 Cel |
QUAD |
S-PQFP-G32 |
5 V |
1.6 mm |
7 mm |
Not Qualified |
2.5 V |
7 mm |
FM |
||||||||||||||||
NXP Semiconductors |
AUDIO SINGLE CHIP RECEIVER |
GULL WING |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.8 % |
SMALL OUTLINE |
1.27 mm |
DUAL |
R-PDSO-G32 |
12 V |
2.65 mm |
7.5 mm |
26 dB |
Not Qualified |
2 V |
20.5 mm |
AM/FM |
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NXP Semiconductors |
AUDIO SINGLE CHIP RECEIVER |
COMMERCIAL |
GULL WING |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIMOS |
20.2 mA |
.8 % |
61 mV |
SMALL OUTLINE |
1.27 mm |
60 Cel |
-15 Cel |
DUAL |
R-PDSO-G32 |
12 V |
2.65 mm |
7.5 mm |
Not Qualified |
1.8 V |
40 |
250 |
20.5 mm |
45 mV |
AM/FM |
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NXP Semiconductors |
AUDIO SINGLE CHIP RECEIVER |
COMMERCIAL |
GULL WING |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIMOS |
20.2 mA |
.8 % |
61 mV |
SMALL OUTLINE |
1.27 mm |
60 Cel |
-15 Cel |
DUAL |
R-PDSO-G32 |
12 V |
2.65 mm |
7.5 mm |
Not Qualified |
1.8 V |
40 |
250 |
20.5 mm |
45 mV |
AM/FM |
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|
NXP Semiconductors |
AUDIO SINGLE CHIP RECEIVER |
COMMERCIAL |
THROUGH-HOLE |
32 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIMOS |
20.2 mA |
.8 % |
61 mV |
IN-LINE, SHRINK PITCH |
1.778 mm |
60 Cel |
-15 Cel |
MATTE TIN |
DUAL |
R-PDIP-T32 |
12 V |
4.7 mm |
10.16 mm |
61 dB |
Not Qualified |
1.8 V |
e3 |
28.95 mm |
45 mV |
AM/FM |
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NXP Semiconductors |
AUDIO SINGLE CHIP RECEIVER |
THROUGH-HOLE |
32 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
.8 % |
IN-LINE, SHRINK PITCH |
1.778 mm |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T32 |
12 V |
4.7 mm |
10.16 mm |
26 dB |
Not Qualified |
2 V |
e3/e4 |
28.95 mm |
AM/FM |
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NXP Semiconductors |
AUDIO SINGLE CHIP RECEIVER |
COMMERCIAL |
THROUGH-HOLE |
32 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
.8 % |
65 mV |
IN-LINE, SHRINK PITCH |
1.778 mm |
60 Cel |
-15 Cel |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T32 |
12 V |
4.7 mm |
10.16 mm |
26 dB |
Not Qualified |
2 V |
e3/e4 |
28.95 mm |
45 mV |
AM/FM |
|||||||||||||
NXP Semiconductors |
AUDIO SINGLE CHIP RECEIVER |
COMMERCIAL |
GULL WING |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIMOS |
.8 % |
61 mV |
SMALL OUTLINE |
1.27 mm |
60 Cel |
-15 Cel |
DUAL |
R-PDSO-G32 |
12 V |
2.65 mm |
7.5 mm |
Not Qualified |
2 V |
20.5 mm |
45 mV |
AM/FM |
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NXP Semiconductors |
AUDIO SINGLE CHIP RECEIVER |
INDUSTRIAL |
THROUGH-HOLE |
32 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
.8 % |
90 mV |
IN-LINE, SHRINK PITCH |
1.778 mm |
85 Cel |
-40 Cel |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T32 |
15 V |
4.7 mm |
10.16 mm |
Not Qualified |
2.7 V |
e3/e4 |
28.95 mm |
50 mV |
AM/FM |
|||||||||||||
|
NXP Semiconductors |
AUDIO SINGLE CHIP RECEIVER |
COMMERCIAL |
THROUGH-HOLE |
32 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIMOS |
20 mA |
.8 % |
61 mV |
IN-LINE, SHRINK PITCH |
1.778 mm |
60 Cel |
-15 Cel |
DUAL |
R-PDIP-T32 |
12 V |
4.7 mm |
10.16 mm |
Not Qualified |
1.8 V |
40 |
245 |
28.95 mm |
45 mV |
AM/FM |
||||||||||
NXP Semiconductors |
AUDIO SINGLE CHIP RECEIVER |
THROUGH-HOLE |
32 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
.8 % |
IN-LINE, SHRINK PITCH |
1.778 mm |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T32 |
12 V |
4.7 mm |
10.16 mm |
26 dB |
Not Qualified |
2 V |
e3/e4 |
28.95 mm |
AM/FM |
||||||||||||||||||
NXP Semiconductors |
AUDIO SINGLE CHIP RECEIVER |
INDUSTRIAL |
THROUGH-HOLE |
32 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
.8 % |
90 mV |
IN-LINE, SHRINK PITCH |
1.778 mm |
85 Cel |
-40 Cel |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T32 |
15 V |
4.7 mm |
10.16 mm |
Not Qualified |
2.7 V |
e3/e4 |
28.95 mm |
50 mV |
AM/FM |
||||||||||||||
NXP Semiconductors |
AUDIO SINGLE CHIP RECEIVER |
COMMERCIAL |
GULL WING |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIMOS |
20.2 mA |
.8 % |
61 mV |
SMALL OUTLINE |
1.27 mm |
60 Cel |
-15 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G32 |
12 V |
2.65 mm |
7.5 mm |
26 dB |
Not Qualified |
1.8 V |
e4 |
20.5 mm |
45 mV |
AM/FM |
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|
Infineon Technologies |
AUDIO SINGLE CHIP RECEIVER |
NO LEAD |
32 |
RECTANGULAR |
UNSPECIFIED |
YES |
CHIP CARRIER |
MATTE TIN |
QUAD |
R-XQCC-N32 |
3 |
Not Qualified |
e3 |
260 |
|||||||||||||||||||||||||
|
Infineon Technologies |
AUDIO SINGLE CHIP RECEIVER |
NO LEAD |
32 |
RECTANGULAR |
UNSPECIFIED |
YES |
CHIP CARRIER |
QUAD |
R-XQCC-N32 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
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Infineon Technologies |
AUDIO/VIDEO DEMODULATOR |
OTHER |
GULL WING |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
8.5 |
.35 % |
SMALL OUTLINE |
SOP32,.5 |
Other Consumer ICs |
1.27 mm |
85 Cel |
-10 Cel |
TIN LEAD |
DUAL |
R-PDSO-G32 |
10 V |
2.54 mm |
7.6 mm |
Not Qualified |
7.5 V |
e0 |
20.9 mm |
900 mV |
AM |
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Samsung |
AUDIO DEMODULATOR |
COMMERCIAL |
THROUGH-HOLE |
32 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
85 mA |
.5 % |
IN-LINE, SHRINK PITCH |
1.778 mm |
70 Cel |
-10 Cel |
DUAL |
R-PDIP-T32 |
5.5 V |
5.08 mm |
10.16 mm |
Not Qualified |
4.5 V |
29.4 mm |
FM |
||||||||||||||||
Samsung |
AUDIO DEMODULATOR |
COMMERCIAL |
THROUGH-HOLE |
32 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
87 mA |
IN-LINE, SHRINK PITCH |
1.778 mm |
70 Cel |
-10 Cel |
DUAL |
R-PDIP-T32 |
5.5 V |
5.08 mm |
10.16 mm |
Not Qualified |
4.7 V |
29.4 mm |
FM |
|||||||||||||||||
Samsung |
AUDIO DEMODULATOR |
COMMERCIAL |
THROUGH-HOLE |
32 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
87 mA |
.5 % |
IN-LINE, SHRINK PITCH |
1.778 mm |
70 Cel |
-10 Cel |
DUAL |
R-PDIP-T32 |
5.5 V |
5.08 mm |
10.16 mm |
Not Qualified |
4.7 V |
29.4 mm |
FM |
Receiver ICs, also known as radio receiver ICs or RF receiver ICs, are electronic components that receive and demodulate radio frequency (RF) signals. These ICs are used in a variety of applications, including wireless communication systems, radio receivers, and remote control systems.
Receiver ICs can be classified into several types based on the specific frequency range they operate in and the modulation scheme they support. Some of the most common types of receiver ICs include:
1. AM/FM receiver ICs - These ICs are designed to receive and demodulate analog AM and FM radio signals. They are used in radio receivers, car audio systems, and other audio applications.
2. Bluetooth receiver ICs - These ICs are designed to receive and demodulate Bluetooth signals, allowing wireless communication between devices such as smartphones, speakers, and headphones.
3. Wi-Fi receiver ICs - These ICs are designed to receive and demodulate Wi-Fi signals, allowing wireless communication between devices such as smartphones, computers, and routers.
4. GPS receiver ICs - These ICs are designed to receive and demodulate GPS signals, allowing precise location tracking and navigation.
Receiver ICs can be integrated into a variety of devices, from small portable devices to large communication systems. They can also be used in combination with other components, such as amplifiers, filters, and oscillators, to provide a complete RF system.