32 Receiver ICs 67

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Part RoHS Manufacturer General IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Maximum Supply Current Power Supplies (V) Harmonic Distortion Nominal Output Voltage (FM) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Width Nominal Signal to Noise Ratio (FM) Qualification Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Nominal Output Voltage (AM) Demodulation Type

TEA5768HL/V2,157

NXP Semiconductors

AUDIO SINGLE CHIP RECEIVER

COMMERCIAL EXTENDED

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

.5 %

75 mV

FLATPACK, LOW PROFILE

.8 mm

75 Cel

-10 Cel

QUAD

S-PQFP-G32

5 V

1.6 mm

7 mm

Not Qualified

2.5 V

7 mm

FM

TEA5712TD-T

NXP Semiconductors

AUDIO SINGLE CHIP RECEIVER

GULL WING

32

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

.8 %

SMALL OUTLINE

1.27 mm

DUAL

R-PDSO-G32

12 V

2.65 mm

7.5 mm

26 dB

Not Qualified

2 V

20.5 mm

AM/FM

TEA5711T/N2,112

NXP Semiconductors

AUDIO SINGLE CHIP RECEIVER

COMMERCIAL

GULL WING

32

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIMOS

20.2 mA

.8 %

61 mV

SMALL OUTLINE

1.27 mm

60 Cel

-15 Cel

DUAL

R-PDSO-G32

12 V

2.65 mm

7.5 mm

Not Qualified

1.8 V

40

250

20.5 mm

45 mV

AM/FM

TEA5711T/N2,118

NXP Semiconductors

AUDIO SINGLE CHIP RECEIVER

COMMERCIAL

GULL WING

32

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIMOS

20.2 mA

.8 %

61 mV

SMALL OUTLINE

1.27 mm

60 Cel

-15 Cel

DUAL

R-PDSO-G32

12 V

2.65 mm

7.5 mm

Not Qualified

1.8 V

40

250

20.5 mm

45 mV

AM/FM

TEA5711

NXP Semiconductors

AUDIO SINGLE CHIP RECEIVER

COMMERCIAL

THROUGH-HOLE

32

SDIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

BIMOS

20.2 mA

.8 %

61 mV

IN-LINE, SHRINK PITCH

1.778 mm

60 Cel

-15 Cel

MATTE TIN

DUAL

R-PDIP-T32

12 V

4.7 mm

10.16 mm

61 dB

Not Qualified

1.8 V

e3

28.95 mm

45 mV

AM/FM

TEA5712PN

NXP Semiconductors

AUDIO SINGLE CHIP RECEIVER

THROUGH-HOLE

32

SDIP

RECTANGULAR

PLASTIC/EPOXY

NO

.8 %

IN-LINE, SHRINK PITCH

1.778 mm

TIN/NICKEL PALLADIUM GOLD

DUAL

R-PDIP-T32

12 V

4.7 mm

10.16 mm

26 dB

Not Qualified

2 V

e3/e4

28.95 mm

AM/FM

TEA5711P

NXP Semiconductors

AUDIO SINGLE CHIP RECEIVER

COMMERCIAL

THROUGH-HOLE

32

SDIP

RECTANGULAR

PLASTIC/EPOXY

NO

.8 %

65 mV

IN-LINE, SHRINK PITCH

1.778 mm

60 Cel

-15 Cel

TIN/NICKEL PALLADIUM GOLD

DUAL

R-PDIP-T32

12 V

4.7 mm

10.16 mm

26 dB

Not Qualified

2 V

e3/e4

28.95 mm

45 mV

AM/FM

TEA5712T

NXP Semiconductors

AUDIO SINGLE CHIP RECEIVER

COMMERCIAL

GULL WING

32

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIMOS

.8 %

61 mV

SMALL OUTLINE

1.27 mm

60 Cel

-15 Cel

DUAL

R-PDSO-G32

12 V

2.65 mm

7.5 mm

Not Qualified

2 V

20.5 mm

45 mV

AM/FM

TEA5594

NXP Semiconductors

AUDIO SINGLE CHIP RECEIVER

INDUSTRIAL

THROUGH-HOLE

32

SDIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

.8 %

90 mV

IN-LINE, SHRINK PITCH

1.778 mm

85 Cel

-40 Cel

TIN/NICKEL PALLADIUM GOLD

DUAL

R-PDIP-T32

15 V

4.7 mm

10.16 mm

Not Qualified

2.7 V

e3/e4

28.95 mm

50 mV

AM/FM

TEA5711N

NXP Semiconductors

AUDIO SINGLE CHIP RECEIVER

COMMERCIAL

THROUGH-HOLE

32

SDIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

BIMOS

20 mA

.8 %

61 mV

IN-LINE, SHRINK PITCH

1.778 mm

60 Cel

-15 Cel

DUAL

R-PDIP-T32

12 V

4.7 mm

10.16 mm

Not Qualified

1.8 V

40

245

28.95 mm

45 mV

AM/FM

TEA5712P

NXP Semiconductors

AUDIO SINGLE CHIP RECEIVER

THROUGH-HOLE

32

SDIP

RECTANGULAR

PLASTIC/EPOXY

NO

.8 %

IN-LINE, SHRINK PITCH

1.778 mm

TIN/NICKEL PALLADIUM GOLD

DUAL

R-PDIP-T32

12 V

4.7 mm

10.16 mm

26 dB

Not Qualified

2 V

e3/e4

28.95 mm

AM/FM

TEA5594PN

NXP Semiconductors

AUDIO SINGLE CHIP RECEIVER

INDUSTRIAL

THROUGH-HOLE

32

SDIP

RECTANGULAR

PLASTIC/EPOXY

NO

.8 %

90 mV

IN-LINE, SHRINK PITCH

1.778 mm

85 Cel

-40 Cel

TIN/NICKEL PALLADIUM GOLD

DUAL

R-PDIP-T32

15 V

4.7 mm

10.16 mm

Not Qualified

2.7 V

e3/e4

28.95 mm

50 mV

AM/FM

TEA5711T-T

NXP Semiconductors

AUDIO SINGLE CHIP RECEIVER

COMMERCIAL

GULL WING

32

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIMOS

20.2 mA

.8 %

61 mV

SMALL OUTLINE

1.27 mm

60 Cel

-15 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G32

12 V

2.65 mm

7.5 mm

26 dB

Not Qualified

1.8 V

e4

20.5 mm

45 mV

AM/FM

TDA7210V

Infineon Technologies

AUDIO SINGLE CHIP RECEIVER

NO LEAD

32

RECTANGULAR

UNSPECIFIED

YES

CHIP CARRIER

MATTE TIN

QUAD

R-XQCC-N32

3

Not Qualified

e3

260

TDA7210VXUMA1

Infineon Technologies

AUDIO SINGLE CHIP RECEIVER

NO LEAD

32

RECTANGULAR

UNSPECIFIED

YES

CHIP CARRIER

QUAD

R-XQCC-N32

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

TDA6931X

Infineon Technologies

AUDIO/VIDEO DEMODULATOR

OTHER

GULL WING

32

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

8.5

.35 %

SMALL OUTLINE

SOP32,.5

Other Consumer ICs

1.27 mm

85 Cel

-10 Cel

TIN LEAD

DUAL

R-PDSO-G32

10 V

2.54 mm

7.6 mm

Not Qualified

7.5 V

e0

20.9 mm

900 mV

AM

KB22688B

Samsung

AUDIO DEMODULATOR

COMMERCIAL

THROUGH-HOLE

32

SDIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

85 mA

.5 %

IN-LINE, SHRINK PITCH

1.778 mm

70 Cel

-10 Cel

DUAL

R-PDIP-T32

5.5 V

5.08 mm

10.16 mm

Not Qualified

4.5 V

29.4 mm

FM

S1A0688C01-A0B0

Samsung

AUDIO DEMODULATOR

COMMERCIAL

THROUGH-HOLE

32

SDIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

87 mA

IN-LINE, SHRINK PITCH

1.778 mm

70 Cel

-10 Cel

DUAL

R-PDIP-T32

5.5 V

5.08 mm

10.16 mm

Not Qualified

4.7 V

29.4 mm

FM

KB22688E

Samsung

AUDIO DEMODULATOR

COMMERCIAL

THROUGH-HOLE

32

SDIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

87 mA

.5 %

IN-LINE, SHRINK PITCH

1.778 mm

70 Cel

-10 Cel

DUAL

R-PDIP-T32

5.5 V

5.08 mm

10.16 mm

Not Qualified

4.7 V

29.4 mm

FM

Receiver ICs

Receiver ICs, also known as radio receiver ICs or RF receiver ICs, are electronic components that receive and demodulate radio frequency (RF) signals. These ICs are used in a variety of applications, including wireless communication systems, radio receivers, and remote control systems.

Receiver ICs can be classified into several types based on the specific frequency range they operate in and the modulation scheme they support. Some of the most common types of receiver ICs include:

1. AM/FM receiver ICs - These ICs are designed to receive and demodulate analog AM and FM radio signals. They are used in radio receivers, car audio systems, and other audio applications.

2. Bluetooth receiver ICs - These ICs are designed to receive and demodulate Bluetooth signals, allowing wireless communication between devices such as smartphones, speakers, and headphones.

3. Wi-Fi receiver ICs - These ICs are designed to receive and demodulate Wi-Fi signals, allowing wireless communication between devices such as smartphones, computers, and routers.

4. GPS receiver ICs - These ICs are designed to receive and demodulate GPS signals, allowing precise location tracking and navigation.

Receiver ICs can be integrated into a variety of devices, from small portable devices to large communication systems. They can also be used in combination with other components, such as amplifiers, filters, and oscillators, to provide a complete RF system.