TSSOP Receiver ICs 8

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Part	Manufacturer	General IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Power Supplies (V)	Harmonic Distortion	Nominal Output Voltage (FM)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Nominal Signal to Noise Ratio (FM)	Qualification	Minimum Supply Voltage (Vsup)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Demodulation Type
SA606DK/01-T	NXP Semiconductors		INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR	4.2 mA	3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	Receiver ICs	.635 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20					Not Qualified
BH4127FV-E2	ROHM		INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	6.6 mA	3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Receiver ICs	.635 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16					Not Qualified
MC3372DTB	NXP Semiconductors	AUDIO SINGLE CHIP RECEIVER	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			4	.6 %	200 mV	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Receiver ICs	.65 mm	70 Cel	-30 Cel		DUAL	R-PDSO-G16	9 V	1.2 mm	4.4 mm	67 dB	Not Qualified	2 V				5 mm	FM
MC3371DTB	NXP Semiconductors	AUDIO SINGLE CHIP RECEIVER	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			4	.6 %	200 mV	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Receiver ICs	.65 mm	70 Cel	-30 Cel		DUAL	R-PDSO-G16	9 V	1.2 mm	4.4 mm	67 dB	Not Qualified	2 V				5 mm	FM
TDA7210XT	Infineon Technologies	AUDIO SINGLE CHIP RECEIVER	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G28	5.5 V	1.2 mm	4.4 mm			4.5 V		NOT SPECIFIED	NOT SPECIFIED	9.7 mm	AM/FM
TDA4321XS	Infineon Technologies	AUDIO DEMODULATOR	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		41 mA			550 mV	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	11 V	1.2 mm	4.4 mm	84 dB	Not Qualified	7.5 V	e0			6.5 mm	FM
UPC3226TB-E3	Renesas Electronics		INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	19.5 mA	5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	Receiver ICs	.635 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G6					Not Qualified
UPC3232TB-E3-A	Renesas Electronics		INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	32 mA	5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	Receiver ICs	.635 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G6					Not Qualified

Receiver ICs

Receiver ICs, also known as radio receiver ICs or RF receiver ICs, are electronic components that receive and demodulate radio frequency (RF) signals. These ICs are used in a variety of applications, including wireless communication systems, radio receivers, and remote control systems.

Receiver ICs can be classified into several types based on the specific frequency range they operate in and the modulation scheme they support. Some of the most common types of receiver ICs include:

1. AM/FM receiver ICs - These ICs are designed to receive and demodulate analog AM and FM radio signals. They are used in radio receivers, car audio systems, and other audio applications.

2. Bluetooth receiver ICs - These ICs are designed to receive and demodulate Bluetooth signals, allowing wireless communication between devices such as smartphones, speakers, and headphones.

3. Wi-Fi receiver ICs - These ICs are designed to receive and demodulate Wi-Fi signals, allowing wireless communication between devices such as smartphones, computers, and routers.

4. GPS receiver ICs - These ICs are designed to receive and demodulate GPS signals, allowing precise location tracking and navigation.

Receiver ICs can be integrated into a variety of devices, from small portable devices to large communication systems. They can also be used in combination with other components, such as amplifiers, filters, and oscillators, to provide a complete RF system.