Part | RoHS | Manufacturer | General IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Transmission Media | Technology | Maximum Supply Current | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Holtek Semiconductor |
RECEIVER IC |
||||||||||||||||||||||||||||||||||
|
Holtek Semiconductor |
RECEIVER IC |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||
Texas Instruments |
RECEIVER IC |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
RF |
CMOS |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
12.8 mm |
||||||||||
Texas Instruments |
RECEIVER IC |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
RF |
BICMOS |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
15.365 mm |
||||||||||
Texas Instruments |
RECEIVER IC |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
RF |
CMOS |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
4.5 V |
12.8 mm |
||||||||||||
Texas Instruments |
RECEIVER IC |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
RF |
BICMOS |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
15.365 mm |
||||||||||
STMicroelectronics |
RECEIVER IC |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
INFRARED |
IN-LINE |
2.54 mm |
TIN LEAD |
DUAL |
R-PDIP-T14 |
5.25 V |
5.1 mm |
7.62 mm |
Not Qualified |
4 V |
e0 |
|||||||||||||||
STMicroelectronics |
RECEIVER IC |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
RF |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T16 |
18 V |
5.1 mm |
7.62 mm |
Not Qualified |
4.5 V |
e0 |
||||||||||||
STMicroelectronics |
RECEIVER IC |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
INFRARED |
IN-LINE |
2.54 mm |
TIN LEAD |
DUAL |
R-PDIP-T8 |
5.25 V |
5.08 mm |
7.62 mm |
Not Qualified |
4 V |
e0 |
|||||||||||||||
STMicroelectronics |
RECEIVER IC |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
RF |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T16 |
18 V |
5.1 mm |
7.62 mm |
Not Qualified |
4.5 V |
e0 |
||||||||||||
STMicroelectronics |
RECEIVER IC |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
RF |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
18 V |
2.65 mm |
7.5 mm |
Not Qualified |
4.5 V |
e0 |
10.3 mm |
|||||||||||
STMicroelectronics |
RECEIVER IC |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
RF |
CMOS |
5/15 |
SMALL OUTLINE |
SOP16,.25 |
Remote Control ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
18 V |
1.75 mm |
3.9 mm |
Not Qualified |
4.5 V |
e0 |
9.9 mm |
|||||||
NXP Semiconductors |
RECEIVER IC |
1 |
Not Qualified |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
RECEIVER IC |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
INFRARED |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T20 |
5.5 V |
4.2 mm |
7.62 mm |
Not Qualified |
2.5 V |
e3/e4 |
26.73 mm |
|||||||||||
NXP Semiconductors |
RECEIVER IC |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
INFRARED |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T20 |
5.5 V |
4.2 mm |
7.62 mm |
Not Qualified |
2.5 V |
26.73 mm |
|||||||||||||
NXP Semiconductors |
RECEIVER IC |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
INFRARED |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
2.5 V |
e4 |
12.8 mm |
|||||||||||
|
NXP Semiconductors |
RECEIVER IC |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
RF |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
6 V |
1.75 mm |
3.9 mm |
Not Qualified |
3.5 V |
40 |
260 |
9.9 mm |
|||||||||||
NXP Semiconductors |
RECEIVER IC |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
INFRARED |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T20 |
5.5 V |
4.2 mm |
7.62 mm |
Not Qualified |
4.5 V |
26.73 mm |
|||||||||||||
NXP Semiconductors |
RECEIVER IC |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
INFRARED |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
2.5 V |
12.8 mm |
|||||||||||||
NXP Semiconductors |
RECEIVER IC |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
INFRARED |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T20 |
5.5 V |
4.2 mm |
7.62 mm |
Not Qualified |
2.5 V |
26.73 mm |
|||||||||||||
NXP Semiconductors |
RECEIVER IC |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
INFRARED |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
2.5 V |
12.8 mm |
|||||||||||||
|
NXP Semiconductors |
RECEIVER IC |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
RF |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
6 V |
1.75 mm |
3.9 mm |
Not Qualified |
3.5 V |
40 |
260 |
9.9 mm |
||||||||||
|
NXP Semiconductors |
RECEIVER IC |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
RF |
355 mA |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,24SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N36 |
5.25 V |
1 mm |
6 mm |
4.75 V |
6 mm |
||||||||||||
NXP Semiconductors |
RECEIVER IC |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
RF |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
6 V |
1.75 mm |
3.9 mm |
Not Qualified |
3.5 V |
e4 |
9.9 mm |
|||||||||||
|
NXP Semiconductors |
RECEIVER IC |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
RF |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
6 V |
1.75 mm |
3.9 mm |
Not Qualified |
3.5 V |
e4 |
9.9 mm |
||||||||||
NXP Semiconductors |
RECEIVER IC |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
INFRARED |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
2.5 V |
12.8 mm |
|||||||||||||
|
NXP Semiconductors |
RECEIVER IC |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
RF |
355 mA |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,24SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N36 |
3 |
5.25 V |
1 mm |
6 mm |
4.75 V |
260 |
6 mm |
||||||||||
NXP Semiconductors |
RECEIVER IC |
1 |
INFRARED |
Not Qualified |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
RECEIVER IC |
OTHER |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
IN-LINE |
2.54 mm |
85 Cel |
-25 Cel |
DUAL |
R-PDIP-T16 |
5.5 V |
4.7 mm |
7.62 mm |
Not Qualified |
4.5 V |
|||||||||||||||
NXP Semiconductors |
RECEIVER IC |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
INFRARED; RF; ULTRA SOUND |
CMOS |
1.2 mA |
SMALL OUTLINE |
SOP16,.4 |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
18 V |
2.65 mm |
7.5 mm |
4.5 V |
10.3 mm |
||||||||||||
|
NXP Semiconductors |
RECEIVER IC |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
RF |
355 mA |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,24SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N36 |
5.25 V |
1 mm |
6 mm |
4.75 V |
6 mm |
||||||||||||
NXP Semiconductors |
RECEIVER IC |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
INFRARED; RF; ULTRA SOUND |
CMOS |
1.2 mA |
IN-LINE |
DIP16,.3 |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T16 |
18 V |
4.44 mm |
7.62 mm |
4.5 V |
19.175 mm |
||||||||||||
NXP Semiconductors |
RECEIVER IC |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
INFRARED; RF; ULTRA SOUND |
CMOS |
1.2 mA |
SMALL OUTLINE |
SOP16,.4 |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
18 V |
2.65 mm |
7.5 mm |
4.5 V |
10.3 mm |
||||||||||||
NXP Semiconductors |
RECEIVER IC |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
INFRARED; RF; ULTRA SOUND |
CMOS |
1.2 mA |
IN-LINE |
DIP16,.3 |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T16 |
18 V |
4.44 mm |
7.62 mm |
4.5 V |
19.175 mm |
|||||||||||
Maxim Integrated |
RECEIVER IC |
INDUSTRIAL |
BALL |
12 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
BICMOS |
1.8/3.3 |
GRID ARRAY |
BGA16,4X4,20 |
Remote Control ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B12 |
Not Qualified |
e0 |
|||||||||||||
Maxim Integrated |
RECEIVER IC |
INDUSTRIAL |
NO LEAD |
12 |
SON |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
BICMOS |
1.8/3.3 |
SMALL OUTLINE |
LCC12,.16SQ,32 |
Remote Control ICs |
.8 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-N12 |
Not Qualified |
e0 |
|||||||||||||
Toshiba |
RECEIVER IC |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
28 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
INFRARED |
CMOS |
IN-LINE, SHRINK PITCH |
1.778 mm |
75 Cel |
-25 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
5.5 V |
4.1 mm |
10.16 mm |
Not Qualified |
4.5 V |
e0 |
25.6 mm |
||||||||||
Toshiba |
RECEIVER IC |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
IN-LINE |
2.54 mm |
TIN LEAD |
DUAL |
R-PDIP-T24 |
5.5 V |
4.8 mm |
15.24 mm |
Not Qualified |
4.5 V |
e0 |
32 mm |
|||||||||||||||
Toshiba |
RECEIVER IC |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
INFRARED |
CMOS |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T20 |
5.5 V |
4.45 mm |
7.62 mm |
Not Qualified |
4.5 V |
e0 |
24.6 mm |
||||||||||
Toshiba |
RECEIVER IC |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
INFRARED |
CMOS |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T20 |
5.5 V |
4.45 mm |
7.62 mm |
Not Qualified |
4.5 V |
e0 |
24.6 mm |
||||||||||
Toshiba |
RECEIVER IC |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
IN-LINE |
2.54 mm |
TIN LEAD |
DUAL |
R-PDIP-T16 |
5.5 V |
4.45 mm |
7.62 mm |
Not Qualified |
4.5 V |
e0 |
19.25 mm |
|||||||||||||||
Samsung |
RECEIVER IC |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
INFRARED |
CMOS |
IN-LINE |
2.54 mm |
75 Cel |
-20 Cel |
DUAL |
R-PDIP-T24 |
5.5 V |
5.33 mm |
10.16 mm |
Not Qualified |
4.5 V |
30.23 mm |
||||||||||||
Samsung |
RECEIVER IC |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
INFRARED |
CMOS |
IN-LINE |
2.54 mm |
75 Cel |
-20 Cel |
DUAL |
R-PDIP-T16 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
4.5 V |
19.4 mm |
||||||||||||
Samsung |
RECEIVER IC |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
INFRARED |
CMOS |
IN-LINE |
2.54 mm |
75 Cel |
-20 Cel |
DUAL |
R-PDIP-T16 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
4.5 V |
19.4 mm |
||||||||||||
Samsung |
RECEIVER IC |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
INFRARED |
CMOS |
IN-LINE |
2.54 mm |
75 Cel |
-20 Cel |
DUAL |
R-PDIP-T16 |
5 V |
5.08 mm |
7.62 mm |
Not Qualified |
2 V |
19.4 mm |
||||||||||||
Samsung |
RECEIVER IC |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
INFRARED |
CMOS |
IN-LINE |
2.54 mm |
75 Cel |
-20 Cel |
DUAL |
R-PDIP-T24 |
5.5 V |
5.33 mm |
10.16 mm |
Not Qualified |
4.5 V |
30.23 mm |
Remote control ICs are electronic components that provide the functionality to transmit and receive signals wirelessly to control electronic devices remotely. These ICs are used in a variety of applications, including television remote controls, home automation systems, and automotive systems.
Remote control ICs can be classified into several types based on the specific functions they provide. Some of the most common types of remote control ICs include:
1. IR remote control ICs - These ICs use infrared (IR) technology to transmit signals wirelessly to control electronic devices such as televisions, DVD players, and audio systems.
2. RF remote control ICs - These ICs use radio frequency (RF) technology to transmit signals wirelessly to control electronic devices such as home automation systems and automotive systems.
3. Bluetooth remote control ICs - These ICs use Bluetooth technology to transmit signals wirelessly to control electronic devices such as smartphones, tablets, and computers.
Remote control ICs can be integrated into a variety of devices, from small handheld remote controls to large home automation systems. They can also be used in combination with other components, such as microcontrollers, sensors, and displays, to provide a complete remote control solution.