RECEIVER IC Remote Control ICs 46

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Part RoHS Manufacturer General IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Transmission Media Technology Maximum Supply Current Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Width Qualification Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

HT12D

Holtek Semiconductor

RECEIVER IC

HT12F

Holtek Semiconductor

RECEIVER IC

NOT SPECIFIED

NOT SPECIFIED

TRF1410DW

Texas Instruments

RECEIVER IC

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

RF

CMOS

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

5.5 V

2.65 mm

7.5 mm

Not Qualified

4.5 V

NOT SPECIFIED

NOT SPECIFIED

12.8 mm

TRF1400DW

Texas Instruments

RECEIVER IC

INDUSTRIAL

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

RF

BICMOS

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G24

5.5 V

2.65 mm

7.5 mm

Not Qualified

4.5 V

NOT SPECIFIED

NOT SPECIFIED

15.365 mm

TRF1410DWR

Texas Instruments

RECEIVER IC

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

RF

CMOS

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

5.5 V

2.65 mm

7.5 mm

Not Qualified

4.5 V

12.8 mm

TRF1400DWR

Texas Instruments

RECEIVER IC

INDUSTRIAL

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

RF

BICMOS

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G24

5.5 V

2.65 mm

7.5 mm

Not Qualified

4.5 V

NOT SPECIFIED

NOT SPECIFIED

15.365 mm

TDA8162

STMicroelectronics

RECEIVER IC

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

INFRARED

IN-LINE

2.54 mm

TIN LEAD

DUAL

R-PDIP-T14

5.25 V

5.1 mm

7.62 mm

Not Qualified

4 V

e0

M145028B1

STMicroelectronics

RECEIVER IC

INDUSTRIAL

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

RF

IN-LINE

2.54 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDIP-T16

18 V

5.1 mm

7.62 mm

Not Qualified

4.5 V

e0

TDA8160

STMicroelectronics

RECEIVER IC

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

INFRARED

IN-LINE

2.54 mm

TIN LEAD

DUAL

R-PDIP-T8

5.25 V

5.08 mm

7.62 mm

Not Qualified

4 V

e0

M145027B1

STMicroelectronics

RECEIVER IC

INDUSTRIAL

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

RF

IN-LINE

2.54 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDIP-T16

18 V

5.1 mm

7.62 mm

Not Qualified

4.5 V

e0

M145028D

STMicroelectronics

RECEIVER IC

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

RF

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G16

18 V

2.65 mm

7.5 mm

Not Qualified

4.5 V

e0

10.3 mm

M145026D

STMicroelectronics

RECEIVER IC

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

RF

CMOS

5/15

SMALL OUTLINE

SOP16,.25

Remote Control ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G16

18 V

1.75 mm

3.9 mm

Not Qualified

4.5 V

e0

9.9 mm

UAA3201

NXP Semiconductors

RECEIVER IC

1

Not Qualified

SAA3049AP

NXP Semiconductors

RECEIVER IC

INDUSTRIAL

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

INFRARED

IN-LINE

2.54 mm

85 Cel

-40 Cel

TIN/NICKEL PALLADIUM GOLD

DUAL

R-PDIP-T20

5.5 V

4.2 mm

7.62 mm

Not Qualified

2.5 V

e3/e4

26.73 mm

SAA3049P

NXP Semiconductors

RECEIVER IC

INDUSTRIAL

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

INFRARED

IN-LINE

2.54 mm

85 Cel

-40 Cel

DUAL

R-PDIP-T20

5.5 V

4.2 mm

7.62 mm

Not Qualified

2.5 V

26.73 mm

SAA3049T-T

NXP Semiconductors

RECEIVER IC

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

INFRARED

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

5.5 V

2.65 mm

7.5 mm

Not Qualified

2.5 V

e4

12.8 mm

UAA3201TD-T

NXP Semiconductors

RECEIVER IC

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

RF

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

6 V

1.75 mm

3.9 mm

Not Qualified

3.5 V

40

260

9.9 mm

SAA3009P

NXP Semiconductors

RECEIVER IC

COMMERCIAL

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

INFRARED

IN-LINE

2.54 mm

70 Cel

0 Cel

DUAL

R-PDIP-T20

5.5 V

4.2 mm

7.62 mm

Not Qualified

4.5 V

26.73 mm

SAA3049AT-T

NXP Semiconductors

RECEIVER IC

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

INFRARED

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

5.5 V

2.65 mm

7.5 mm

Not Qualified

2.5 V

12.8 mm

SAA3049APN

NXP Semiconductors

RECEIVER IC

INDUSTRIAL

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

INFRARED

IN-LINE

2.54 mm

85 Cel

-40 Cel

DUAL

R-PDIP-T20

5.5 V

4.2 mm

7.62 mm

Not Qualified

2.5 V

26.73 mm

SAA3049T

NXP Semiconductors

RECEIVER IC

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

INFRARED

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

5.5 V

2.65 mm

7.5 mm

Not Qualified

2.5 V

12.8 mm

UAA3201T

NXP Semiconductors

RECEIVER IC

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

RF

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

6 V

1.75 mm

3.9 mm

Not Qualified

3.5 V

40

260

9.9 mm

BGX7220HN

NXP Semiconductors

RECEIVER IC

NO LEAD

36

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

RF

355 mA

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC36,24SQ,20

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N36

5.25 V

1 mm

6 mm

4.75 V

6 mm

UAA3201T-T

NXP Semiconductors

RECEIVER IC

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

RF

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G16

6 V

1.75 mm

3.9 mm

Not Qualified

3.5 V

e4

9.9 mm

UAA3201T/V1,118

NXP Semiconductors

RECEIVER IC

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

RF

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G16

1

6 V

1.75 mm

3.9 mm

Not Qualified

3.5 V

e4

9.9 mm

SAA3049AT

NXP Semiconductors

RECEIVER IC

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

INFRARED

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

5.5 V

2.65 mm

7.5 mm

Not Qualified

2.5 V

12.8 mm

BGX7220HN/1,518

NXP Semiconductors

RECEIVER IC

NO LEAD

36

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

RF

355 mA

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC36,24SQ,20

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N36

3

5.25 V

1 mm

6 mm

4.75 V

260

6 mm

SAA3049A

NXP Semiconductors

RECEIVER IC

1

INFRARED

Not Qualified

SAA3028N

NXP Semiconductors

RECEIVER IC

OTHER

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

IN-LINE

2.54 mm

85 Cel

-25 Cel

DUAL

R-PDIP-T16

5.5 V

4.7 mm

7.62 mm

Not Qualified

4.5 V

MC145027DW

NXP Semiconductors

RECEIVER IC

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

INFRARED; RF; ULTRA SOUND

CMOS

1.2 mA

SMALL OUTLINE

SOP16,.4

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

18 V

2.65 mm

7.5 mm

4.5 V

10.3 mm

935295318518

NXP Semiconductors

RECEIVER IC

NO LEAD

36

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

RF

355 mA

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC36,24SQ,20

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N36

5.25 V

1 mm

6 mm

4.75 V

6 mm

MC145028P

NXP Semiconductors

RECEIVER IC

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

INFRARED; RF; ULTRA SOUND

CMOS

1.2 mA

IN-LINE

DIP16,.3

2.54 mm

85 Cel

-40 Cel

DUAL

R-PDIP-T16

18 V

4.44 mm

7.62 mm

4.5 V

19.175 mm

MC145028DW

NXP Semiconductors

RECEIVER IC

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

INFRARED; RF; ULTRA SOUND

CMOS

1.2 mA

SMALL OUTLINE

SOP16,.4

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

18 V

2.65 mm

7.5 mm

4.5 V

10.3 mm

MC145027P

NXP Semiconductors

RECEIVER IC

INDUSTRIAL

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

INFRARED; RF; ULTRA SOUND

CMOS

1.2 mA

IN-LINE

DIP16,.3

2.54 mm

85 Cel

-40 Cel

DUAL

R-PDIP-T16

18 V

4.44 mm

7.62 mm

4.5 V

19.175 mm

MAX11042EBC-T

Maxim Integrated

RECEIVER IC

INDUSTRIAL

BALL

12

BGA

SQUARE

PLASTIC/EPOXY

YES

2

BICMOS

1.8/3.3

GRID ARRAY

BGA16,4X4,20

Remote Control ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B12

Not Qualified

e0

MAX11042ETC

Maxim Integrated

RECEIVER IC

INDUSTRIAL

NO LEAD

12

SON

SQUARE

PLASTIC/EPOXY

YES

2

BICMOS

1.8/3.3

SMALL OUTLINE

LCC12,.16SQ,32

Remote Control ICs

.8 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-N12

Not Qualified

e0

TC9259N

Toshiba

RECEIVER IC

COMMERCIAL EXTENDED

THROUGH-HOLE

28

SDIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

INFRARED

CMOS

IN-LINE, SHRINK PITCH

1.778 mm

75 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T28

5.5 V

4.1 mm

10.16 mm

Not Qualified

4.5 V

e0

25.6 mm

TC9150P

Toshiba

RECEIVER IC

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

IN-LINE

2.54 mm

TIN LEAD

DUAL

R-PDIP-T24

5.5 V

4.8 mm

15.24 mm

Not Qualified

4.5 V

e0

32 mm

TC9285P

Toshiba

RECEIVER IC

INDUSTRIAL

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

INFRARED

CMOS

IN-LINE

2.54 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDIP-T20

5.5 V

4.45 mm

7.62 mm

Not Qualified

4.5 V

e0

24.6 mm

TC9244P

Toshiba

RECEIVER IC

INDUSTRIAL

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

INFRARED

CMOS

IN-LINE

2.54 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDIP-T20

5.5 V

4.45 mm

7.62 mm

Not Qualified

4.5 V

e0

24.6 mm

TC9149P

Toshiba

RECEIVER IC

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

IN-LINE

2.54 mm

TIN LEAD

DUAL

R-PDIP-T16

5.5 V

4.45 mm

7.62 mm

Not Qualified

4.5 V

e0

19.25 mm

KS9803

Samsung

RECEIVER IC

COMMERCIAL EXTENDED

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

INFRARED

CMOS

IN-LINE

2.54 mm

75 Cel

-20 Cel

DUAL

R-PDIP-T24

5.5 V

5.33 mm

10.16 mm

Not Qualified

4.5 V

30.23 mm

S5G9801X01-D0B0

Samsung

RECEIVER IC

COMMERCIAL EXTENDED

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

INFRARED

CMOS

IN-LINE

2.54 mm

75 Cel

-20 Cel

DUAL

R-PDIP-T16

5.5 V

5.08 mm

7.62 mm

Not Qualified

4.5 V

19.4 mm

KS9801

Samsung

RECEIVER IC

COMMERCIAL EXTENDED

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

INFRARED

CMOS

IN-LINE

2.54 mm

75 Cel

-20 Cel

DUAL

R-PDIP-T16

5.5 V

5.08 mm

7.62 mm

Not Qualified

4.5 V

19.4 mm

S5G9802X01-D0B0

Samsung

RECEIVER IC

COMMERCIAL EXTENDED

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

INFRARED

CMOS

IN-LINE

2.54 mm

75 Cel

-20 Cel

DUAL

R-PDIP-T16

5 V

5.08 mm

7.62 mm

Not Qualified

2 V

19.4 mm

S5G9803X01-D0B0

Samsung

RECEIVER IC

COMMERCIAL EXTENDED

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

INFRARED

CMOS

IN-LINE

2.54 mm

75 Cel

-20 Cel

DUAL

R-PDIP-T24

5.5 V

5.33 mm

10.16 mm

Not Qualified

4.5 V

30.23 mm

Remote Control ICs

Remote control ICs are electronic components that provide the functionality to transmit and receive signals wirelessly to control electronic devices remotely. These ICs are used in a variety of applications, including television remote controls, home automation systems, and automotive systems.

Remote control ICs can be classified into several types based on the specific functions they provide. Some of the most common types of remote control ICs include:

1. IR remote control ICs - These ICs use infrared (IR) technology to transmit signals wirelessly to control electronic devices such as televisions, DVD players, and audio systems.

2. RF remote control ICs - These ICs use radio frequency (RF) technology to transmit signals wirelessly to control electronic devices such as home automation systems and automotive systems.

3. Bluetooth remote control ICs - These ICs use Bluetooth technology to transmit signals wirelessly to control electronic devices such as smartphones, tablets, and computers.

Remote control ICs can be integrated into a variety of devices, from small handheld remote controls to large home automation systems. They can also be used in combination with other components, such as microcontrollers, sensors, and displays, to provide a complete remote control solution.