Part | RoHS | Manufacturer | General IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Transmission Media | Technology | Maximum Supply Current | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Silicon Labs |
SUPPORT CIRCUIT |
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Silicon Labs |
SUPPORT CIRCUIT |
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STMicroelectronics |
SUPPORT CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
2 |
INFRARED |
BIPOLAR |
2 mA |
4/20 |
IN-LINE |
DIP8,.3 |
Audio/Video Amplifiers |
2.54 mm |
105 Cel |
-40 Cel |
Matte Tin (Sn) |
DUAL |
R-PDIP-T8 |
20 V |
5.08 mm |
7.62 mm |
Not Qualified |
4 V |
e3 |
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Texas Instruments |
SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
RF |
CMOS |
2.7/15 |
SMALL OUTLINE |
SOP14,.25 |
Remote Control ICs |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G14 |
15 V |
1.75 mm |
3.9 mm |
Not Qualified |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
8.65 mm |
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Texas Instruments |
SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
RF |
CMOS |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G14 |
6 V |
1.75 mm |
3.9 mm |
Not Qualified |
2.7 V |
8.65 mm |
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Texas Instruments |
SUPPORT CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
RF |
CMOS |
3/5 |
IN-LINE |
DIP16,.3 |
Remote Control ICs |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T16 |
6 V |
5.08 mm |
7.62 mm |
Not Qualified |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
19.305 mm |
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Texas Instruments |
SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
RF |
CMOS |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G14 |
15 V |
1.75 mm |
3.9 mm |
Not Qualified |
2.7 V |
8.65 mm |
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Texas Instruments |
SUPPORT CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
RF |
CMOS |
2.7/15 |
IN-LINE |
DIP16,.3 |
Remote Control ICs |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T16 |
15 V |
5.08 mm |
7.62 mm |
Not Qualified |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
19.305 mm |
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Texas Instruments |
SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
RF |
CMOS |
3/5 |
SMALL OUTLINE |
SOP14,.25 |
Remote Control ICs |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G14 |
6 V |
1.75 mm |
3.9 mm |
Not Qualified |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
8.65 mm |
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|
STMicroelectronics |
SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
INFRARED |
BIPOLAR |
2 mA |
5 |
SMALL OUTLINE |
SOP8,.25 |
Remote Control ICs |
1.27 mm |
105 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G8 |
20 V |
1.75 mm |
3.9 mm |
Not Qualified |
4 V |
e4 |
4.9 mm |
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NXP Semiconductors |
SUPPORT CIRCUIT |
OTHER |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
INFRARED |
SMALL OUTLINE |
1.27 mm |
80 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
6.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
3 V |
10.3 mm |
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NXP Semiconductors |
SUPPORT CIRCUIT |
OTHER |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
INFRARED |
IN-LINE |
2.54 mm |
80 Cel |
-40 Cel |
DUAL |
R-PDIP-T16 |
6.5 V |
4.7 mm |
7.62 mm |
Not Qualified |
3 V |
21.68 mm |
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NXP Semiconductors |
SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
INFRARED |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
2.5 V |
12.8 mm |
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NXP Semiconductors |
SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
INFRARED |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
2.5 V |
12.8 mm |
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|
Infineon Technologies |
SUPPORT CIRCUIT |
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Maxim Integrated |
SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
SON |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
BICMOS |
1.8/3.3 |
SMALL OUTLINE |
LCC12,.16SQ,32 |
Remote Control ICs |
.8 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-N12 |
1 |
Not Qualified |
e0 |
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|
Maxim Integrated |
SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
1.8/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC12,.16SQ,32 |
Remote Control ICs |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N12 |
1 |
3.6 V |
.8 mm |
4 mm |
Not Qualified |
1.6 V |
e3 |
4 mm |
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Maxim Integrated |
SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
12 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
BICMOS |
1.8/3.3 |
GRID ARRAY |
BGA16,4X4,20 |
Remote Control ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B12 |
Not Qualified |
e0 |
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|
Maxim Integrated |
SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
1.8/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC12,.16SQ,32 |
Remote Control ICs |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N12 |
1 |
3.6 V |
.8 mm |
4 mm |
Not Qualified |
1.6 V |
e3 |
30 |
260 |
4 mm |
||||
Maxim Integrated |
SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
SON |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
BICMOS |
1.8/3.3 |
SMALL OUTLINE |
LCC12,.16SQ,32 |
Remote Control ICs |
.8 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-N12 |
Not Qualified |
e0 |
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Toshiba |
SUPPORT CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
INFRARED |
SMALL OUTLINE |
1.27 mm |
DUAL |
R-PDSO-G8 |
5.5 V |
1.9 mm |
4.4 mm |
Not Qualified |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
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Toshiba |
SUPPORT CIRCUIT |
THROUGH-HOLE |
9 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
INFRARED |
IN-LINE |
2.54 mm |
SINGLE |
R-PSIP-T9 |
5.5 V |
5.7 mm |
2.8 mm |
Not Qualified |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
22.8 mm |
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Renesas Electronics |
SUPPORT CIRCUIT |
THROUGH-HOLE |
30 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
IN-LINE, SHRINK PITCH |
1.778 mm |
DUAL |
R-PDIP-T30 |
5.06 mm |
10.16 mm |
Not Qualified |
27.1 mm |
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Samsung |
SUPPORT CIRCUIT |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
8 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
INFRARED |
3.5 mA |
8.5 |
IN-LINE |
SIP9,.1 |
Remote Control ICs |
2.54 mm |
75 Cel |
-20 Cel |
TIN LEAD |
SINGLE |
R-PSIP-T8 |
14.4 V |
7.3 mm |
3 mm |
Not Qualified |
6 V |
e0 |
21.84 mm |
|||||||
Samsung |
SUPPORT CIRCUIT |
COMMERCIAL EXTENDED |
NO LEAD |
8 |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
INFRARED |
BIPOLAR |
2.8 mA |
5 |
UNCASED CHIP |
SIP9,.1 |
Remote Control ICs |
2.54 mm |
75 Cel |
-20 Cel |
TIN LEAD |
UPPER |
X-XUUC-N8 |
5.3 V |
Not Qualified |
4.7 V |
e0 |
|||||||||
Samsung |
SUPPORT CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE |
1.27 mm |
DUAL |
R-PDSO-G8 |
1.95 mm |
3.9 mm |
Not Qualified |
4.9 mm |
|||||||||||||||||||
Samsung |
SUPPORT CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE |
1.27 mm |
DUAL |
R-PDSO-G8 |
1.95 mm |
3.9 mm |
Not Qualified |
4.9 mm |
|||||||||||||||||||
Samsung |
SUPPORT CIRCUIT |
THROUGH-HOLE |
8 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
IN-LINE |
2.54 mm |
SINGLE |
R-PSIP-T8 |
7.3 mm |
3 mm |
Not Qualified |
21.84 mm |
|||||||||||||||||||
Samsung |
SUPPORT CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE |
1.27 mm |
DUAL |
R-PDSO-G8 |
1.95 mm |
3.9 mm |
Not Qualified |
4.9 mm |
|||||||||||||||||||
Samsung |
SUPPORT CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
8 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
3.3 mA |
5 |
IN-LINE |
SIP9,.1 |
Remote Control ICs |
2.54 mm |
70 Cel |
-20 Cel |
TIN LEAD |
SINGLE |
R-PSIP-T8 |
7.3 mm |
3 mm |
Not Qualified |
e0 |
21.84 mm |
Remote control ICs are electronic components that provide the functionality to transmit and receive signals wirelessly to control electronic devices remotely. These ICs are used in a variety of applications, including television remote controls, home automation systems, and automotive systems.
Remote control ICs can be classified into several types based on the specific functions they provide. Some of the most common types of remote control ICs include:
1. IR remote control ICs - These ICs use infrared (IR) technology to transmit signals wirelessly to control electronic devices such as televisions, DVD players, and audio systems.
2. RF remote control ICs - These ICs use radio frequency (RF) technology to transmit signals wirelessly to control electronic devices such as home automation systems and automotive systems.
3. Bluetooth remote control ICs - These ICs use Bluetooth technology to transmit signals wirelessly to control electronic devices such as smartphones, tablets, and computers.
Remote control ICs can be integrated into a variety of devices, from small handheld remote controls to large home automation systems. They can also be used in combination with other components, such as microcontrollers, sensors, and displays, to provide a complete remote control solution.