SDIP Remote Control ICs 4

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Manufacturers
    • Diodes Incorporated
    • Holtek Semiconductor
    • Infineon Technologies
    • Linx Technologies
    • Maxim Integrated
    • NXP Semiconductors
    • Renesas Electronics
    • STMicroelectronics
    • Samsung
    • Silicon Labs
    • Texas Instruments
    • Toshiba
    • Vishay Intertechnology
General IC Type
    • RECEIVER IC
    • REMOTE CONTROL TRANSMITTER IC
    • REMOTE CONTROL TRANSMITTER/RECEIVER IC
    • SUPPORT CIRCUIT
    • TRANSMITTER IC
    • TRANSMITTER/RECEIVER IC
Temperature Grade
    • COMMERCIAL
    • COMMERCIAL EXTENDED
    • INDUSTRIAL
    • OTHER
Terminal Form
    • BALL
    • GULL WING
    • J BEND
    • NO LEAD
    • THROUGH-HOLE
No. of Terminals
    • 100
    • 12
    • 14
    • 16
    • 18
    • 2
    • 20
    • 24
    • 28
    • 30
    • 36
    • 40
    • 44
    • 48
    • 7
    • 8
    • 80
    • 9
Package Code (1)
    • SDIP
    • BGA
    • DIE
    • DIP
    • FBGA
    • HVQCCN
    • QCCJ
    • QCCN
    • QFP
    • SIP
    • SMA
    • SON
    • SOP
    • SSOP
Package Shape
    • RECTANGULAR
    • SQUARE
    • UNSPECIFIED
Package Body Material
    • PLASTIC/EPOXY
    • UNSPECIFIED
Surface Mount
    • NO
    • YES
No. of Functions
    • 1
    • 2
Transmission Media
    • INFRARED
    • INFRARED; RF; ULTRA SOUND
    • RF
Technology
    • BICMOS
    • BIPOLAR
    • CMOS
    • MOS
Maximum Supply Current
    • .6 mA
    • 1.2 mA
    • 1.9 mA
    • 10 mA
    • 12 mA
    • 2 mA
    • 2.5 mA
    • 2.8 mA
    • 3 mA
    • 3.1 mA
    • 3.2 mA
    • 3.3 mA
    • 3.5 mA
    • 355 mA
    • 65 mA
Power Supplies (V)
    • 1.5,2.5,3.3
    • 1.8/3.3
    • 15
    • 2.5/3.3
    • 2.7/15
    • 2/3.3
    • 2/5.5
    • 2/6.5
    • 3
    • 3.3/5
    • 3/10.5
    • 3/5
    • 3/6
    • 4
    • 4.5/10.5
    • 4/10
    • 4/12
    • 4/20
    • 5
    • 5/15
    • 5/16
    • 6
    • 7
    • 8
    • 8.5
    • 9
Package Style (Meter)
    • CHIP CARRIER
    • CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
    • FLATPACK
    • GRID ARRAY
    • GRID ARRAY, FINE PITCH
    • IN-LINE
    • IN-LINE, SHRINK PITCH
    • MICROELECTRONIC ASSEMBLY
    • SMALL OUTLINE
    • SMALL OUTLINE, SHRINK PITCH
    • UNCASED CHIP
Package Equivalence Code
    • BGA16,4X4,20
    • DIE OR CHIP
    • DIP14(UNSPEC)
    • DIP14,.3
    • DIP16,.3
    • DIP18(UNSPEC)
    • DIP18,.3
    • DIP20,.3
    • DIP24,.3
    • DIP24,.6
    • DIP28,.4
    • DIP28,.6
    • DIP40,.6
    • DIP8,.3
    • LCC12,.16SQ,32
    • LCC36,24SQ,20
    • LDCC44,.7SQ
    • QFP100,.63SQ,20
    • SDIP20,.3
    • SDIP24,.3
    • SIP8,.06
    • SIP9(UNSPEC)
    • SIP9,.1
    • SOP14(UNSPEC)
    • SOP14,.25
    • SOP16,.25
    • SOP16,.4
    • SOP20(UNSPEC)
    • SOP20,.3
    • SOP20,.4
    • SOP24,.3
    • SOP24,.4
    • SOP28,.5
    • SOP8,.25
    • SSOP16,.25
    • SSOP20,.3
    • TAB,40PINS,.04
    • WAFER
Sub-Category
    • Audio/Video Amplifiers
    • Other Consumer ICs
    • Remote Control ICs
Terminal Pitch
    • .5 mm
    • .635 mm
    • .8 mm
    • .95 mm
    • 1.27 mm
    • 1.778 mm
    • 1.78 mm
    • 2.54 mm
Maximum Operating Temperature
    • 105 Cel
    • 110 Cel
    • 50 Cel
    • 55 Cel
    • 65 Cel
    • 70 Cel
    • 75 Cel
    • 80 Cel
    • 85 Cel
    • 95 Cel
Minimum Operating Temperature
    • -10 Cel
    • -20 Cel
    • -25 Cel
    • -40 Cel
    • 0 Cel
Terminal Finish
    • MATTE TIN
    • Matte Tin (Sn)
    • NICKEL PALLADIUM GOLD
    • Nickel/Palladium/Gold (Ni/Pd/Au)
    • TIN COPPER/TIN SILVER
    • TIN LEAD
    • TIN SILVER
    • TIN/NICKEL PALLADIUM GOLD
    • Tin/Lead (Sn/Pb)
Terminal Position
    • BOTTOM
    • DUAL
    • QUAD
    • SINGLE
    • UPPER
JESD-30 Code
    • R-PDIP-T14
    • R-PDIP-T16
    • R-PDIP-T18
    • R-PDIP-T20
    • R-PDIP-T24
    • R-PDIP-T28
    • R-PDIP-T30
    • R-PDIP-T40
    • R-PDIP-T8
    • R-PDSO-G14
    • R-PDSO-G16
    • R-PDSO-G20
    • R-PDSO-G24
    • R-PDSO-G28
    • R-PDSO-G8
    • R-PQFP-G80
    • R-PSIP-T8
    • R-PSIP-T9
    • R-XSMA-N7
    • S-PBGA-B12
    • S-PBGA-B16
    • S-PDSO-N12
    • S-PQCC-J44
    • S-PQCC-N12
    • S-PQCC-N36
    • S-PQCC-N48
    • S-PQFP-G100
    • S-PQFP-G44
    • S-XQCC-N12
    • S-XQCC-N20
    • X-XUUC-N8
Moisture Sensitivity Level (MSL)
    • 1
    • 3
    • 4
Maximum Supply Voltage (Vsup)
    • 1.8 V
    • 10 V
    • 10.5 V
    • 11 V
    • 12 V
    • 12.6 V
    • 14.4 V
    • 15 V
    • 18 V
    • 20 V
    • 3.6 V
    • 4 V
    • 5 V
    • 5.25 V
    • 5.3 V
    • 5.5 V
    • 6 V
    • 6.5 V
    • 7 V
Maximum Seated Height
    • .8 mm
    • .9 mm
    • 1 mm
    • 1.75 mm
    • 1.8 mm
    • 1.9 mm
    • 1.95 mm
    • 2.65 mm
    • 2.7 mm
    • 3 mm
    • 3.05 mm
    • 3.93 mm
    • 4.1 mm
    • 4.2 mm
    • 4.44 mm
    • 4.45 mm
    • 4.7 mm
    • 4.8 mm
    • 5.06 mm
    • 5.08 mm
    • 5.1 mm
    • 5.33 mm
    • 5.7 mm
    • 7.3 mm
    • 7.9 mm
Width
    • 1.6 mm
    • 10.16 mm
    • 14 mm
    • 15.24 mm
    • 2.8 mm
    • 3 mm
    • 3.2 mm
    • 3.9 mm
    • 4 mm
    • 4.4 mm
    • 4.9 mm
    • 5.3 mm
    • 6 mm
    • 7.5 mm
    • 7.62 mm
    • 8.8 mm
Qualification
    • Not Qualified
Minimum Supply Voltage (Vsup)
    • 1.2 V
    • 1.6 V
    • 1.8 V
    • 2 V
    • 2.2 V
    • 2.4 V
    • 2.5 V
    • 2.7 V
    • 3 V
    • 3.5 V
    • 4 V
    • 4.5 V
    • 4.7 V
    • 4.75 V
    • 6 V
    • 7 V
Additional Features
    • IT CAN ALSO OPERATE AT RANGE 2.2 TO 3.6V
    • RF AND DIRECT WIRE CAN ALSO BE USED FOR TRANSMISSION
JESD-609 Code
    • e0
    • e2
    • e3
    • e3/e4
    • e4
Maximum Time At Peak Reflow Temperature (s)
    • 20
    • 30
    • 40
    • NOT SPECIFIED
Peak Reflow Temperature (C)
    • 240
    • 260
    • NOT SPECIFIED
Length
    • 10.3 mm
    • 12.8 mm
    • 15.365 mm
    • 17.9 mm
    • 18.5 mm
    • 19.025 mm
    • 19.175 mm
    • 19.25 mm
    • 19.305 mm
    • 19.4 mm
    • 20 mm
    • 21.68 mm
    • 21.84 mm
    • 22.28 mm
    • 22.8 mm
    • 24.6 mm
    • 25.15 mm
    • 25.3 mm
    • 25.5 mm
    • 25.6 mm
    • 26.73 mm
    • 27.1 mm
    • 30.23 mm
    • 32 mm
    • 35.5 mm
    • 36.83 mm
    • 4 mm
    • 4.9 mm
    • 5 mm
    • 6 mm
    • 6.8 mm
    • 8.65 mm
    • 9.5 mm
    • 9.9 mm
Reset All
Part RoHS Manufacturer General IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Transmission Media Technology Maximum Supply Current Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Width Qualification Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

TC9259N

Toshiba

RECEIVER IC

COMMERCIAL EXTENDED

THROUGH-HOLE

28

SDIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

INFRARED

CMOS

IN-LINE, SHRINK PITCH

1.778 mm

75 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T28

5.5 V

4.1 mm

10.16 mm

Not Qualified

4.5 V

e0

25.6 mm

UPD6127CS

Renesas Electronics

REMOTE CONTROL TRANSMITTER IC

COMMERCIAL

THROUGH-HOLE

20

SDIP

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

3

IN-LINE, SHRINK PITCH

SDIP20,.3

Remote Control ICs

1.78 mm

70 Cel

-20 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T20

Not Qualified

e0

HA11510NT

Renesas Electronics

SUPPORT CIRCUIT

THROUGH-HOLE

30

SDIP

RECTANGULAR

PLASTIC/EPOXY

NO

IN-LINE, SHRINK PITCH

1.778 mm

DUAL

R-PDIP-T30

5.06 mm

10.16 mm

Not Qualified

27.1 mm

UPD6129CS

Renesas Electronics

REMOTE CONTROL TRANSMITTER IC

COMMERCIAL

THROUGH-HOLE

24

SDIP

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

3

IN-LINE, SHRINK PITCH

SDIP24,.3

Remote Control ICs

1.78 mm

70 Cel

-20 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T24

Not Qualified

e0

Remote Control ICs

Remote control ICs are electronic components that provide the functionality to transmit and receive signals wirelessly to control electronic devices remotely. These ICs are used in a variety of applications, including television remote controls, home automation systems, and automotive systems.

Remote control ICs can be classified into several types based on the specific functions they provide. Some of the most common types of remote control ICs include:

1. IR remote control ICs - These ICs use infrared (IR) technology to transmit signals wirelessly to control electronic devices such as televisions, DVD players, and audio systems.

2. RF remote control ICs - These ICs use radio frequency (RF) technology to transmit signals wirelessly to control electronic devices such as home automation systems and automotive systems.

3. Bluetooth remote control ICs - These ICs use Bluetooth technology to transmit signals wirelessly to control electronic devices such as smartphones, tablets, and computers.

Remote control ICs can be integrated into a variety of devices, from small handheld remote controls to large home automation systems. They can also be used in combination with other components, such as microcontrollers, sensors, and displays, to provide a complete remote control solution.