SQUARE Remote Control ICs 19
| Part | RoHS | Manufacturer | General IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Transmission Media | Technology | Maximum Supply Current | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Silicon Labs |
TRANSMITTER IC |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
RF |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
3.6 V |
.9 mm |
4 mm |
1.8 V |
4 mm |
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|
|
Texas Instruments |
TRANSMITTER IC |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
65 mA |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
110 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N48 |
3 |
3.6 V |
Not Qualified |
3 V |
e4 |
30 |
260 |
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|
|
Texas Instruments |
TRANSMITTER IC |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
65 mA |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
110 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N48 |
3 |
3.6 V |
Not Qualified |
3 V |
e4 |
30 |
260 |
|||||||||||
|
|
NXP Semiconductors |
RECEIVER IC |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
RF |
355 mA |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,24SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N36 |
5.25 V |
1 mm |
6 mm |
4.75 V |
6 mm |
||||||||||||
|
|
NXP Semiconductors |
RECEIVER IC |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
RF |
355 mA |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,24SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N36 |
3 |
5.25 V |
1 mm |
6 mm |
4.75 V |
260 |
6 mm |
||||||||||
|
|
NXP Semiconductors |
RECEIVER IC |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
RF |
355 mA |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,24SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N36 |
5.25 V |
1 mm |
6 mm |
4.75 V |
6 mm |
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|
Infineon Technologies |
REMOTE CONTROL TRANSMITTER IC |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
Remote Control ICs |
1.27 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J44 |
Not Qualified |
e0 |
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|
Maxim Integrated |
SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
SON |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
BICMOS |
1.8/3.3 |
SMALL OUTLINE |
LCC12,.16SQ,32 |
Remote Control ICs |
.8 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-N12 |
1 |
Not Qualified |
e0 |
||||||||||||
|
|
Maxim Integrated |
SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
1.8/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC12,.16SQ,32 |
Remote Control ICs |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N12 |
1 |
3.6 V |
.8 mm |
4 mm |
Not Qualified |
1.6 V |
e3 |
4 mm |
||||||
|
Maxim Integrated |
RECEIVER IC |
INDUSTRIAL |
BALL |
12 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
BICMOS |
1.8/3.3 |
GRID ARRAY |
BGA16,4X4,20 |
Remote Control ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B12 |
Not Qualified |
e0 |
|||||||||||||
|
|
Maxim Integrated |
REMOTE CONTROL TRANSMITTER IC |
INDUSTRIAL |
NO LEAD |
12 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
BICMOS |
1.8/3.3 |
CHIP CARRIER |
LCC12,.16SQ,32 |
Remote Control ICs |
.8 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N12 |
Not Qualified |
30 |
260 |
|||||||||||||
|
Maxim Integrated |
SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
12 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
BICMOS |
1.8/3.3 |
GRID ARRAY |
BGA16,4X4,20 |
Remote Control ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B12 |
Not Qualified |
e0 |
|||||||||||||
|
|
Maxim Integrated |
SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
1.8/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC12,.16SQ,32 |
Remote Control ICs |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N12 |
1 |
3.6 V |
.8 mm |
4 mm |
Not Qualified |
1.6 V |
e3 |
30 |
260 |
4 mm |
||||
|
Maxim Integrated |
REMOTE CONTROL TRANSMITTER IC |
INDUSTRIAL |
BALL |
16 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
BICMOS |
1.8/3.3 |
GRID ARRAY, FINE PITCH |
BGA16,4X4,20 |
Remote Control ICs |
.5 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
S-PBGA-B16 |
Not Qualified |
e0 |
||||||||||||||
|
Maxim Integrated |
RECEIVER IC |
INDUSTRIAL |
NO LEAD |
12 |
SON |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
BICMOS |
1.8/3.3 |
SMALL OUTLINE |
LCC12,.16SQ,32 |
Remote Control ICs |
.8 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-N12 |
Not Qualified |
e0 |
|||||||||||||
|
Maxim Integrated |
SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
SON |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
BICMOS |
1.8/3.3 |
SMALL OUTLINE |
LCC12,.16SQ,32 |
Remote Control ICs |
.8 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-N12 |
Not Qualified |
e0 |
|||||||||||||
|
Toshiba |
TRANSMITTER IC |
GULL WING |
44 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
FLATPACK |
QUAD |
S-PQFP-G44 |
4 V |
Not Qualified |
2 V |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||
|
|
Toshiba |
TRANSMITTER IC |
COMMERCIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
1.5,2.5,3.3 |
FLATPACK |
QFP100,.63SQ,20 |
Other Consumer ICs |
.5 mm |
70 Cel |
-10 Cel |
QUAD |
S-PQFP-G100 |
Not Qualified |
|||||||||||||||
|
Toshiba |
TRANSMITTER IC |
GULL WING |
44 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
FLATPACK |
QUAD |
S-PQFP-G44 |
1.8 V |
Not Qualified |
1.2 V |
IT CAN ALSO OPERATE AT RANGE 2.2 TO 3.6V |
NOT SPECIFIED |
240 |
Remote control ICs are electronic components that provide the functionality to transmit and receive signals wirelessly to control electronic devices remotely. These ICs are used in a variety of applications, including television remote controls, home automation systems, and automotive systems.
Remote control ICs can be classified into several types based on the specific functions they provide. Some of the most common types of remote control ICs include:
1. IR remote control ICs - These ICs use infrared (IR) technology to transmit signals wirelessly to control electronic devices such as televisions, DVD players, and audio systems.
2. RF remote control ICs - These ICs use radio frequency (RF) technology to transmit signals wirelessly to control electronic devices such as home automation systems and automotive systems.
3. Bluetooth remote control ICs - These ICs use Bluetooth technology to transmit signals wirelessly to control electronic devices such as smartphones, tablets, and computers.
Remote control ICs can be integrated into a variety of devices, from small handheld remote controls to large home automation systems. They can also be used in combination with other components, such as microcontrollers, sensors, and displays, to provide a complete remote control solution.