NO LEAD Remote Control ICs 19

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  2. Remote Control ICs
Manufacturers
    • Diodes Incorporated
    • Holtek Semiconductor
    • Infineon Technologies
    • Linx Technologies
    • Maxim Integrated
    • NXP Semiconductors
    • Renesas Electronics
    • STMicroelectronics
    • Samsung
    • Silicon Labs
    • Texas Instruments
    • Toshiba
    • Vishay Intertechnology
General IC Type
    • RECEIVER IC
    • REMOTE CONTROL TRANSMITTER IC
    • REMOTE CONTROL TRANSMITTER/RECEIVER IC
    • SUPPORT CIRCUIT
    • TRANSMITTER IC
    • TRANSMITTER/RECEIVER IC
Temperature Grade
    • COMMERCIAL
    • COMMERCIAL EXTENDED
    • INDUSTRIAL
    • OTHER
Terminal Form (1)
    • NO LEAD
    • BALL
    • GULL WING
    • J BEND
    • THROUGH-HOLE
No. of Terminals
    • 100
    • 12
    • 14
    • 16
    • 18
    • 2
    • 20
    • 24
    • 28
    • 30
    • 36
    • 40
    • 44
    • 48
    • 7
    • 8
    • 80
    • 9
Package Code
    • BGA
    • DIE
    • DIP
    • FBGA
    • HVQCCN
    • QCCJ
    • QCCN
    • QFP
    • SDIP
    • SIP
    • SMA
    • SON
    • SOP
    • SSOP
Package Shape
    • RECTANGULAR
    • SQUARE
    • UNSPECIFIED
Package Body Material
    • PLASTIC/EPOXY
    • UNSPECIFIED
Surface Mount
    • NO
    • YES
No. of Functions
    • 1
    • 2
Transmission Media
    • INFRARED
    • INFRARED; RF; ULTRA SOUND
    • RF
Technology
    • BICMOS
    • BIPOLAR
    • CMOS
    • MOS
Maximum Supply Current
    • .6 mA
    • 1.2 mA
    • 1.9 mA
    • 10 mA
    • 12 mA
    • 2 mA
    • 2.5 mA
    • 2.8 mA
    • 3 mA
    • 3.1 mA
    • 3.2 mA
    • 3.3 mA
    • 3.5 mA
    • 355 mA
    • 65 mA
Power Supplies (V)
    • 1.5,2.5,3.3
    • 1.8/3.3
    • 15
    • 2.5/3.3
    • 2.7/15
    • 2/3.3
    • 2/5.5
    • 2/6.5
    • 3
    • 3.3/5
    • 3/10.5
    • 3/5
    • 3/6
    • 4
    • 4.5/10.5
    • 4/10
    • 4/12
    • 4/20
    • 5
    • 5/15
    • 5/16
    • 6
    • 7
    • 8
    • 8.5
    • 9
Package Style (Meter)
    • CHIP CARRIER
    • CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
    • FLATPACK
    • GRID ARRAY
    • GRID ARRAY, FINE PITCH
    • IN-LINE
    • IN-LINE, SHRINK PITCH
    • MICROELECTRONIC ASSEMBLY
    • SMALL OUTLINE
    • SMALL OUTLINE, SHRINK PITCH
    • UNCASED CHIP
Package Equivalence Code
    • BGA16,4X4,20
    • DIE OR CHIP
    • DIP14(UNSPEC)
    • DIP14,.3
    • DIP16,.3
    • DIP18(UNSPEC)
    • DIP18,.3
    • DIP20,.3
    • DIP24,.3
    • DIP24,.6
    • DIP28,.4
    • DIP28,.6
    • DIP40,.6
    • DIP8,.3
    • LCC12,.16SQ,32
    • LCC36,24SQ,20
    • LDCC44,.7SQ
    • QFP100,.63SQ,20
    • SDIP20,.3
    • SDIP24,.3
    • SIP8,.06
    • SIP9(UNSPEC)
    • SIP9,.1
    • SOP14(UNSPEC)
    • SOP14,.25
    • SOP16,.25
    • SOP16,.4
    • SOP20(UNSPEC)
    • SOP20,.3
    • SOP20,.4
    • SOP24,.3
    • SOP24,.4
    • SOP28,.5
    • SOP8,.25
    • SSOP16,.25
    • SSOP20,.3
    • TAB,40PINS,.04
    • WAFER
Sub-Category
    • Audio/Video Amplifiers
    • Other Consumer ICs
    • Remote Control ICs
Terminal Pitch
    • .5 mm
    • .635 mm
    • .8 mm
    • .95 mm
    • 1.27 mm
    • 1.778 mm
    • 1.78 mm
    • 2.54 mm
Maximum Operating Temperature
    • 105 Cel
    • 110 Cel
    • 50 Cel
    • 55 Cel
    • 65 Cel
    • 70 Cel
    • 75 Cel
    • 80 Cel
    • 85 Cel
    • 95 Cel
Minimum Operating Temperature
    • -10 Cel
    • -20 Cel
    • -25 Cel
    • -40 Cel
    • 0 Cel
Terminal Finish
    • MATTE TIN
    • Matte Tin (Sn)
    • NICKEL PALLADIUM GOLD
    • Nickel/Palladium/Gold (Ni/Pd/Au)
    • TIN COPPER/TIN SILVER
    • TIN LEAD
    • TIN SILVER
    • TIN/NICKEL PALLADIUM GOLD
    • Tin/Lead (Sn/Pb)
Terminal Position
    • BOTTOM
    • DUAL
    • QUAD
    • SINGLE
    • UPPER
JESD-30 Code
    • R-PDIP-T14
    • R-PDIP-T16
    • R-PDIP-T18
    • R-PDIP-T20
    • R-PDIP-T24
    • R-PDIP-T28
    • R-PDIP-T30
    • R-PDIP-T40
    • R-PDIP-T8
    • R-PDSO-G14
    • R-PDSO-G16
    • R-PDSO-G20
    • R-PDSO-G24
    • R-PDSO-G28
    • R-PDSO-G8
    • R-PQFP-G80
    • R-PSIP-T8
    • R-PSIP-T9
    • R-XSMA-N7
    • S-PBGA-B12
    • S-PBGA-B16
    • S-PDSO-N12
    • S-PQCC-J44
    • S-PQCC-N12
    • S-PQCC-N36
    • S-PQCC-N48
    • S-PQFP-G100
    • S-PQFP-G44
    • S-XQCC-N12
    • S-XQCC-N20
    • X-XUUC-N8
Moisture Sensitivity Level (MSL)
    • 1
    • 3
    • 4
Maximum Supply Voltage (Vsup)
    • 1.8 V
    • 10 V
    • 10.5 V
    • 11 V
    • 12 V
    • 12.6 V
    • 14.4 V
    • 15 V
    • 18 V
    • 20 V
    • 3.6 V
    • 4 V
    • 5 V
    • 5.25 V
    • 5.3 V
    • 5.5 V
    • 6 V
    • 6.5 V
    • 7 V
Maximum Seated Height
    • .8 mm
    • .9 mm
    • 1 mm
    • 1.75 mm
    • 1.8 mm
    • 1.9 mm
    • 1.95 mm
    • 2.65 mm
    • 2.7 mm
    • 3 mm
    • 3.05 mm
    • 3.93 mm
    • 4.1 mm
    • 4.2 mm
    • 4.44 mm
    • 4.45 mm
    • 4.7 mm
    • 4.8 mm
    • 5.06 mm
    • 5.08 mm
    • 5.1 mm
    • 5.33 mm
    • 5.7 mm
    • 7.3 mm
    • 7.9 mm
Width
    • 1.6 mm
    • 10.16 mm
    • 14 mm
    • 15.24 mm
    • 2.8 mm
    • 3 mm
    • 3.2 mm
    • 3.9 mm
    • 4 mm
    • 4.4 mm
    • 4.9 mm
    • 5.3 mm
    • 6 mm
    • 7.5 mm
    • 7.62 mm
    • 8.8 mm
Qualification
    • Not Qualified
Minimum Supply Voltage (Vsup)
    • 1.2 V
    • 1.6 V
    • 1.8 V
    • 2 V
    • 2.2 V
    • 2.4 V
    • 2.5 V
    • 2.7 V
    • 3 V
    • 3.5 V
    • 4 V
    • 4.5 V
    • 4.7 V
    • 4.75 V
    • 6 V
    • 7 V
Additional Features
    • IT CAN ALSO OPERATE AT RANGE 2.2 TO 3.6V
    • RF AND DIRECT WIRE CAN ALSO BE USED FOR TRANSMISSION
JESD-609 Code
    • e0
    • e2
    • e3
    • e3/e4
    • e4
Maximum Time At Peak Reflow Temperature (s)
    • 20
    • 30
    • 40
    • NOT SPECIFIED
Peak Reflow Temperature (C)
    • 240
    • 260
    • NOT SPECIFIED
Length
    • 10.3 mm
    • 12.8 mm
    • 15.365 mm
    • 17.9 mm
    • 18.5 mm
    • 19.025 mm
    • 19.175 mm
    • 19.25 mm
    • 19.305 mm
    • 19.4 mm
    • 20 mm
    • 21.68 mm
    • 21.84 mm
    • 22.28 mm
    • 22.8 mm
    • 24.6 mm
    • 25.15 mm
    • 25.3 mm
    • 25.5 mm
    • 25.6 mm
    • 26.73 mm
    • 27.1 mm
    • 30.23 mm
    • 32 mm
    • 35.5 mm
    • 36.83 mm
    • 4 mm
    • 4.9 mm
    • 5 mm
    • 6 mm
    • 6.8 mm
    • 8.65 mm
    • 9.5 mm
    • 9.9 mm
Reset All
Part RoHS Manufacturer General IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Transmission Media Technology Maximum Supply Current Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Width Qualification Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

TFBS4650-TR1

Vishay Intertechnology

TRANSMITTER/RECEIVER IC

NO LEAD

7

SMA

RECTANGULAR

YES

1

INFRARED

MICROELECTRONIC ASSEMBLY

.95 mm

85 Cel

-25 Cel

SINGLE

R-XSMA-N7

5.5 V

3 mm

1.6 mm

2.4 V

6.8 mm

TFBS4650-TT3

Vishay Intertechnology

TRANSMITTER/RECEIVER IC

NO LEAD

7

SMA

RECTANGULAR

YES

1

INFRARED

MICROELECTRONIC ASSEMBLY

.95 mm

85 Cel

-25 Cel

SINGLE

R-XSMA-N7

4

5.5 V

3 mm

1.6 mm

2.4 V

20

260

6.8 mm

TFBS4650-TR3

Vishay Intertechnology

TRANSMITTER/RECEIVER IC

NO LEAD

7

SMA

RECTANGULAR

YES

1

INFRARED

MICROELECTRONIC ASSEMBLY

.95 mm

85 Cel

-25 Cel

SINGLE

R-XSMA-N7

5.5 V

3 mm

1.6 mm

2.4 V

6.8 mm

TFBS4652-TT1

Vishay Intertechnology

TRANSMITTER/RECEIVER IC

NO LEAD

2

SMA

RECTANGULAR

PLASTIC/EPOXY

YES

1

INFRARED

10 mA

MICROELECTRONIC ASSEMBLY

.95 mm

85 Cel

-25 Cel

SINGLE

R-XSMA-N7

5.5 V

3 mm

1.6 mm

2.4 V

6.8 mm

TFBS4652-TR1

Vishay Intertechnology

TRANSMITTER/RECEIVER IC

NO LEAD

2

SMA

RECTANGULAR

PLASTIC/EPOXY

YES

1

INFRARED

10 mA

MICROELECTRONIC ASSEMBLY

.95 mm

85 Cel

-25 Cel

SINGLE

R-XSMA-N7

5.5 V

3 mm

1.6 mm

2.4 V

6.8 mm

TFBS4652-TR3

Vishay Intertechnology

TRANSMITTER/RECEIVER IC

NO LEAD

2

SMA

RECTANGULAR

PLASTIC/EPOXY

YES

1

INFRARED

10 mA

MICROELECTRONIC ASSEMBLY

.95 mm

85 Cel

-25 Cel

SINGLE

R-XSMA-N7

5.5 V

3 mm

1.6 mm

2.4 V

6.8 mm

SI4032-B1-FM

Silicon Labs

TRANSMITTER IC

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

RF

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N20

3.6 V

.9 mm

4 mm

1.8 V

4 mm

BQ500110RGZT

Texas Instruments

TRANSMITTER IC

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

65 mA

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

110 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N48

3

3.6 V

Not Qualified

3 V

e4

30

260

BQ500110RGZR

Texas Instruments

TRANSMITTER IC

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

65 mA

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

110 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N48

3

3.6 V

Not Qualified

3 V

e4

30

260

BGX7220HN

NXP Semiconductors

RECEIVER IC

NO LEAD

36

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

RF

355 mA

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC36,24SQ,20

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N36

5.25 V

1 mm

6 mm

4.75 V

6 mm

BGX7220HN/1,518

NXP Semiconductors

RECEIVER IC

NO LEAD

36

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

RF

355 mA

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC36,24SQ,20

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N36

3

5.25 V

1 mm

6 mm

4.75 V

260

6 mm

935295318518

NXP Semiconductors

RECEIVER IC

NO LEAD

36

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

RF

355 mA

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC36,24SQ,20

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N36

5.25 V

1 mm

6 mm

4.75 V

6 mm

MAX11041ETC

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

12

SON

SQUARE

PLASTIC/EPOXY

YES

2

BICMOS

1.8/3.3

SMALL OUTLINE

LCC12,.16SQ,32

Remote Control ICs

.8 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-N12

1

Not Qualified

e0

MAX11042ETC+

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

1.8/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC12,.16SQ,32

Remote Control ICs

.8 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N12

1

3.6 V

.8 mm

4 mm

Not Qualified

1.6 V

e3

4 mm

MAX11041ETC+T

Maxim Integrated

REMOTE CONTROL TRANSMITTER IC

INDUSTRIAL

NO LEAD

12

QCCN

SQUARE

PLASTIC/EPOXY

YES

BICMOS

1.8/3.3

CHIP CARRIER

LCC12,.16SQ,32

Remote Control ICs

.8 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N12

Not Qualified

30

260

MAX11041ETC+

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

1.8/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC12,.16SQ,32

Remote Control ICs

.8 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N12

1

3.6 V

.8 mm

4 mm

Not Qualified

1.6 V

e3

30

260

4 mm

MAX11042ETC

Maxim Integrated

RECEIVER IC

INDUSTRIAL

NO LEAD

12

SON

SQUARE

PLASTIC/EPOXY

YES

2

BICMOS

1.8/3.3

SMALL OUTLINE

LCC12,.16SQ,32

Remote Control ICs

.8 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-N12

Not Qualified

e0

MAX11041ETC-T

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

12

SON

SQUARE

PLASTIC/EPOXY

YES

2

BICMOS

1.8/3.3

SMALL OUTLINE

LCC12,.16SQ,32

Remote Control ICs

.8 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-N12

Not Qualified

e0

KA2184G

Samsung

SUPPORT CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

8

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

INFRARED

BIPOLAR

2.8 mA

5

UNCASED CHIP

SIP9,.1

Remote Control ICs

2.54 mm

75 Cel

-20 Cel

TIN LEAD

UPPER

X-XUUC-N8

5.3 V

Not Qualified

4.7 V

e0

Remote Control ICs

Remote control ICs are electronic components that provide the functionality to transmit and receive signals wirelessly to control electronic devices remotely. These ICs are used in a variety of applications, including television remote controls, home automation systems, and automotive systems.

Remote control ICs can be classified into several types based on the specific functions they provide. Some of the most common types of remote control ICs include:

1. IR remote control ICs - These ICs use infrared (IR) technology to transmit signals wirelessly to control electronic devices such as televisions, DVD players, and audio systems.

2. RF remote control ICs - These ICs use radio frequency (RF) technology to transmit signals wirelessly to control electronic devices such as home automation systems and automotive systems.

3. Bluetooth remote control ICs - These ICs use Bluetooth technology to transmit signals wirelessly to control electronic devices such as smartphones, tablets, and computers.

Remote control ICs can be integrated into a variety of devices, from small handheld remote controls to large home automation systems. They can also be used in combination with other components, such as microcontrollers, sensors, and displays, to provide a complete remote control solution.