NXP Semiconductors Remote Control ICs 59

Reset All

Part	Manufacturer	General IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Transmission Media	Technology	Maximum Supply Current	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Position	JESD-30 Code	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	Length
SAA3028N	NXP Semiconductors	RECEIVER IC	OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				IN-LINE		2.54 mm	85 Cel	-25 Cel	DUAL	R-PDIP-T16	5.5 V	4.7 mm	7.62 mm	Not Qualified	4.5 V
SAA3010P/S285	NXP Semiconductors	TRANSMITTER IC	OTHER	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	INFRARED			IN-LINE		2.54 mm	70 Cel	-25 Cel	DUAL	R-PDIP-T28	7 V	5.1 mm	15.24 mm	Not Qualified	2 V	35.5 mm
PCA8521FT-T	NXP Semiconductors	TRANSMITTER IC	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	INFRARED			SMALL OUTLINE		1.27 mm	50 Cel	-10 Cel	DUAL	R-PDSO-G16	5.5 V	2.65 mm	7.5 mm	Not Qualified	2 V	10.3 mm
933880680112	NXP Semiconductors	TRANSMITTER IC	OTHER	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	INFRARED			IN-LINE		2.54 mm	70 Cel	-25 Cel	DUAL	R-PDIP-T28	7 V	5.1 mm	15.24 mm	Not Qualified	2 V	35.5 mm
MC145027DW	NXP Semiconductors	RECEIVER IC		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	INFRARED; RF; ULTRA SOUND	CMOS	1.2 mA	SMALL OUTLINE	SOP16,.4	1.27 mm	85 Cel	-40 Cel	DUAL	R-PDSO-G16	18 V	2.65 mm	7.5 mm		4.5 V	10.3 mm
935295318518	NXP Semiconductors	RECEIVER IC		NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	RF		355 mA	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,24SQ,20	.5 mm	85 Cel	-40 Cel	QUAD	S-PQCC-N36	5.25 V	1 mm	6 mm		4.75 V	6 mm
MC145026D	NXP Semiconductors	TRANSMITTER IC		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	INFRARED; RF; ULTRA SOUND	CMOS	.6 mA	SMALL OUTLINE	SOP16,.25	1.27 mm	85 Cel	-40 Cel	DUAL	R-PDSO-G16	18 V	1.75 mm	4.9 mm		2.5 V	9.9 mm
MC145028P	NXP Semiconductors	RECEIVER IC		THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	INFRARED; RF; ULTRA SOUND	CMOS	1.2 mA	IN-LINE	DIP16,.3	2.54 mm	85 Cel	-40 Cel	DUAL	R-PDIP-T16	18 V	4.44 mm	7.62 mm		4.5 V	19.175 mm
MC145026P	NXP Semiconductors	TRANSMITTER IC	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	INFRARED; RF; ULTRA SOUND	CMOS	.6 mA	IN-LINE	DIP16,.3	2.54 mm	85 Cel	-40 Cel	DUAL	R-PDIP-T16	18 V	4.44 mm	7.62 mm		2.5 V	19.175 mm
MC145028DW	NXP Semiconductors	RECEIVER IC		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	INFRARED; RF; ULTRA SOUND	CMOS	1.2 mA	SMALL OUTLINE	SOP16,.4	1.27 mm	85 Cel	-40 Cel	DUAL	R-PDSO-G16	18 V	2.65 mm	7.5 mm		4.5 V	10.3 mm
MC145027P	NXP Semiconductors	RECEIVER IC	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	INFRARED; RF; ULTRA SOUND	CMOS	1.2 mA	IN-LINE	DIP16,.3	2.54 mm	85 Cel	-40 Cel	DUAL	R-PDIP-T16	18 V	4.44 mm	7.62 mm		4.5 V	19.175 mm

Remote Control ICs

Remote control ICs are electronic components that provide the functionality to transmit and receive signals wirelessly to control electronic devices remotely. These ICs are used in a variety of applications, including television remote controls, home automation systems, and automotive systems.

Remote control ICs can be classified into several types based on the specific functions they provide. Some of the most common types of remote control ICs include:

1. IR remote control ICs - These ICs use infrared (IR) technology to transmit signals wirelessly to control electronic devices such as televisions, DVD players, and audio systems.

2. RF remote control ICs - These ICs use radio frequency (RF) technology to transmit signals wirelessly to control electronic devices such as home automation systems and automotive systems.

3. Bluetooth remote control ICs - These ICs use Bluetooth technology to transmit signals wirelessly to control electronic devices such as smartphones, tablets, and computers.

Remote control ICs can be integrated into a variety of devices, from small handheld remote controls to large home automation systems. They can also be used in combination with other components, such as microcontrollers, sensors, and displays, to provide a complete remote control solution.