SQUARE Signal Separator ICs 8

Reset All

Part	Manufacturer	General IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LMH1980MMX/NOPB	Texas Instruments	SYNC SEPARATOR IC	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		14 mA	3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Consumer ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	5 V	1.09 mm	3 mm	Not Qualified	3.3 V		e3	30	260	3 mm
LMH1980MM/NOPB	Texas Instruments	SYNC SEPARATOR IC	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		14 mA	3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Consumer ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	5 V	1.09 mm	3 mm	Not Qualified	3.3 V		e3	30	260	3 mm
LMH1980MM	Texas Instruments	SYNC SEPARATOR IC	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel		DUAL	S-PDSO-G10		5 V	1.09 mm	3 mm	Not Qualified	3.3 V					3 mm
LMH1980MMX	Texas Instruments	SYNC SEPARATOR IC	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel		DUAL	S-PDSO-G10		5 V	1.09 mm	3 mm	Not Qualified	3.3 V					3 mm
SAA7152	NXP Semiconductors	Y/C SEPARATOR IC	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5	CHIP CARRIER	LDCC44,.7SQ	Other Consumer ICs	1.27 mm	70 Cel	0 Cel		QUAD	S-PQCC-J44		5.5 V	4.57 mm	16.585 mm	Not Qualified	4.5 V					16.585 mm
SAA7152-T	NXP Semiconductors	Y/C SEPARATOR IC	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			CHIP CARRIER			1.27 mm	70 Cel	0 Cel		QUAD	S-PQCC-J44		5.5 V	4.57 mm	16.585 mm	Not Qualified	4.5 V					16.585 mm
TA8843AF	Toshiba	Y/C SEPARATOR IC		GULL WING	80	FQFP	SQUARE	PLASTIC/EPOXY	YES	1				FLATPACK, FINE PITCH			.5 mm				QUAD	S-PQFP-G80		5.25 V	1.85 mm	12 mm	Not Qualified	4.75 V			NOT SPECIFIED	NOT SPECIFIED	12 mm
TB1328FG	Toshiba	SYNC SEPARATOR IC	COMMERCIAL EXTENDED	GULL WING	64	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3,5,9	FLATPACK, FINE PITCH	QFP64,.47SQ,20	Other Consumer ICs	.5 mm	75 Cel	-20 Cel		QUAD	S-PQFP-G64		5.3 V	1.85 mm	10 mm	Not Qualified	4.7 V	IT ALSO REQUIRES 8.5V TO 9.5V SUPPLY				10 mm

Signal Separator ICs

Signal separator ICs, also known as signal isolator ICs or signal splitter ICs, are electronic components that separate and distribute signals from a single input to multiple outputs. These ICs are used in a variety of applications, including audio and video distribution systems, process control systems, and telecommunications systems.

Signal separator ICs can be classified into several types based on the specific signal they separate and the number of outputs they support. Some of the most common types of signal separator ICs include:

1. Audio signal separator ICs - These ICs separate audio signals from a single input and distribute them to multiple outputs, such as speakers or headphones.

2. Video signal separator ICs - These ICs separate video signals from a single input and distribute them to multiple outputs, such as displays or projectors.

3. Process signal separator ICs - These ICs separate process signals from a single input and distribute them to multiple outputs, such as control systems or data acquisition systems.

Signal separator ICs can also be used to isolate signals, providing protection against noise and interference. They can be integrated into a variety of devices, from small signal distribution boxes to large industrial control systems.