Part | RoHS | Manufacturer | General IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Maximum Supply Current | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Application | Blanking Output | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
STMicroelectronics |
VERTICAL DEFLECTION IC |
AUTOMOTIVE |
THROUGH-HOLE |
10 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
10/30 |
FLANGE MOUNT |
SIP10,.07TB |
Deflection ICs |
2.54 mm |
150 Cel |
TV |
NO |
-40 Cel |
SINGLE |
R-PSFM-T10 |
30 V |
Not Qualified |
10 V |
|||||||||||||
Onsemi |
VERTICAL DEFLECTION IC |
10 |
PLASTIC/EPOXY |
NO |
HYBRID |
+-20,120 |
SIP10,.1 |
Deflection ICs |
2.54 mm |
SINGLE |
Not Qualified |
|||||||||||||||||||||||||
STMicroelectronics |
VERTICAL DEFLECTION IC |
THROUGH-HOLE |
10 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
35 |
FLANGE MOUNT |
SIP10,.06TB |
Deflection ICs |
2.54 mm |
TV |
NO |
TIN LEAD |
SINGLE |
R-PSFM-T10 |
35 V |
Not Qualified |
e0 |
||||||||||||||||
Toshiba |
VERTICAL DEFLECTION IC |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
10 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
FLANGE MOUNT |
75 Cel |
TV |
NO |
-20 Cel |
TIN LEAD |
SINGLE |
R-PSFM-T10 |
13 V |
Not Qualified |
9 V |
e0 |
|||||||||||||||
Toshiba |
VERTICAL DEFLECTION IC |
THROUGH-HOLE |
10 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
FLANGE MOUNT |
SINGLE |
R-PSFM-T10 |
13 V |
Not Qualified |
9 V |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||
Samsung |
VERTICAL DEFLECTION IC |
COMMERCIAL |
THROUGH-HOLE |
10 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
FLANGE MOUNT |
70 Cel |
TV; MONITOR |
NO |
-20 Cel |
SINGLE |
R-PSFM-T10 |
35 V |
Not Qualified |
15 V |
OUTPUT STAGE SUPPLY VOLTAGE 15V TO 70V |
|||||||||||||||||
Samsung |
VERTICAL DEFLECTION IC |
COMMERCIAL |
THROUGH-HOLE |
10 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
12 |
IN-LINE |
SIP10,.07TB |
Deflection ICs |
2.54 mm |
70 Cel |
TV |
-20 Cel |
TIN LEAD |
DUAL |
R-PDIP-T10 |
Not Qualified |
e0 |
|||||||||||||
Samsung |
VERTICAL DEFLECTION IC |
COMMERCIAL |
10 |
PLASTIC/EPOXY |
NO |
BIPOLAR |
24 |
SIP10,.07TB |
Deflection ICs |
2.54 mm |
70 Cel |
-20 Cel |
SINGLE |
Not Qualified |
||||||||||||||||||||||
Samsung |
VERTICAL DEFLECTION IC |
COMMERCIAL |
10 |
PLASTIC/EPOXY |
NO |
BIPOLAR |
12 |
SIP10,.07TB |
Deflection ICs |
2.54 mm |
70 Cel |
-20 Cel |
SINGLE |
Not Qualified |
Vertical deflection ICs, also known as vertical output ICs, are electronic components that provide the vertical deflection current necessary to move the electron beam in a CRT (cathode ray tube) television or monitor. These ICs are responsible for the vertical movement of the image on the screen.
Vertical deflection ICs can be classified into several types based on the specific functions they provide. Some of the most common types of vertical deflection ICs include:
1. Single chip vertical deflection ICs - These ICs integrate all necessary functions into a single chip, including vertical oscillator, output amplifier, and flyback generator.
2. Vertical output ICs - These ICs provide the vertical output drive to the deflection coil in CRT monitors or televisions.
3. Vertical deflection processors - These ICs provide advanced signal processing capabilities and can perform functions such as sync processing, dynamic convergence correction, and image processing.
Vertical deflection ICs can be integrated into a variety of devices, from small monitors to large television sets. They can also be used in combination with other components, such as horizontal deflection ICs and power supplies, to provide a complete CRT display system.