DIGITAL I/O MODULE Other Function Interface ICs 24

Reset All
Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

750-362

Wago

DIGITAL I/O MODULE

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

31.2 V

1

24 V

MICROELECTRONIC ASSEMBLY

18 V

55 Cel

0 Cel

UNSPECIFIED

R-XXMA-X

ALSO HAVE ANALOG I/O FUNCTIONALITY

ADAM-6052-D

Advantech

DIGITAL I/O MODULE

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

30 V

1

24 V

MICROELECTRONIC ASSEMBLY

10 V

70 Cel

-40 Cel

UNSPECIFIED

R-XXMA-X

ADAM-6052

Advantech

DIGITAL I/O MODULE

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

30 V

1

24 V

MICROELECTRONIC ASSEMBLY

10 V

70 Cel

-20 Cel

UNSPECIFIED

R-XXMA-X

ADAM-6066-D

Advantech

DIGITAL I/O MODULE

MAX14906ATM+T

Analog Devices

DIGITAL I/O MODULE

Matte Tin (Sn) - annealed

1

e3

30

260

MAX14906ATM+

Analog Devices

DIGITAL I/O MODULE

Matte Tin (Sn) - annealed

1

e3

30

260

750-1506

Wago

DIGITAL I/O MODULE

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

1

5 V

MICROELECTRONIC ASSEMBLY

55 Cel

0 Cel

UNSPECIFIED

R-XXMA-X

1756-IB16IK

Rockwell Automation

DIGITAL I/O MODULE

UNSPECIFIED

DMA

RECTANGULAR

UNSPECIFIED

NO

30 V

1

12 V

MICROELECTRONIC ASSEMBLY

10 V

60 Cel

0 Cel

DUAL

R-XDMA-X

CCE4502CC5L-QFN

Renesas Electronics

DIGITAL I/O MODULE

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

36 V

1

HV-CMOS

24 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

9 V

.5 mm

105 Cel

-40 Cel

QUAD

S-XQCC-N24

.8 mm

4 mm

4 mm

CCE4502CC3.3L-CSP

Renesas Electronics

DIGITAL I/O MODULE

BALL

24

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

36 V

1

HV-CMOS

24 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA24,4X6,16

9 V

.4 mm

105 Cel

-40 Cel

BOTTOM

R-PBGA-B24

.5834 mm

1.98 mm

2.572 mm

750-667/000-003

Wago

DIGITAL I/O MODULE

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

1

ATEX

5 V

MICROELECTRONIC ASSEMBLY

UNSPECIFIED

R-XXMA-X

ALSO 24VDC FIELD SUPPLY AVAILABLE

2988117

Phoenix Contact

DIGITAL I/O MODULE

INDUSTRIAL

GULL WING

64

SQUARE

PLASTIC/EPOXY

YES

3.63 V

1

3.3 V

2.97 V

85 Cel

-40 Cel

QUAD

S-PQFP-G64

CCE4502CC3.3B-CSP

Renesas Electronics

DIGITAL I/O MODULE

BALL

24

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

36 V

1

HV-CMOS

24 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA24,4X6,16

9 V

.4 mm

105 Cel

-40 Cel

BOTTOM

R-PBGA-B24

.5834 mm

1.98 mm

2.572 mm

CCE4502CC5L-CSP

Renesas Electronics

DIGITAL I/O MODULE

BALL

24

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

36 V

1

HV-CMOS

24 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA24,4X6,16

9 V

.4 mm

105 Cel

-40 Cel

BOTTOM

R-PBGA-B24

.5834 mm

1.98 mm

2.572 mm

CCE4502CC5B-CSP

Renesas Electronics

DIGITAL I/O MODULE

BALL

24

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

36 V

1

HV-CMOS

24 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA24,4X6,16

9 V

.4 mm

105 Cel

-40 Cel

BOTTOM

R-PBGA-B24

.5834 mm

1.98 mm

2.572 mm

CCE4502CC3.3B-QFN

Renesas Electronics

DIGITAL I/O MODULE

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

36 V

1

HV-CMOS

24 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

9 V

.5 mm

105 Cel

-40 Cel

QUAD

S-XQCC-N24

.8 mm

4 mm

4 mm

CCE4502CC5B-QFN

Renesas Electronics

DIGITAL I/O MODULE

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

36 V

1

HV-CMOS

24 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

9 V

.5 mm

105 Cel

-40 Cel

QUAD

S-XQCC-N24

.8 mm

4 mm

4 mm

CCE4502CC3.3L-QFN

Renesas Electronics

DIGITAL I/O MODULE

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

36 V

1

HV-CMOS

24 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

9 V

.5 mm

105 Cel

-40 Cel

QUAD

S-XQCC-N24

.8 mm

4 mm

4 mm

GRT1-ML2

Omron

DIGITAL I/O MODULE

GRT1-ROS2

Omron

DIGITAL I/O MODULE

CK3W-MD7120

Omron

DIGITAL I/O MODULE

CRT1-MD16-1

Omron

DIGITAL I/O MODULE

CRT1B-MD04JS

Omron

DIGITAL I/O MODULE

CRT1B-MD02JS

Omron

DIGITAL I/O MODULE

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.