Digital I/P Module Other Function Interface ICs 69

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Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

XISO1212DBQ

Texas Instruments

Digital I/P Module

ISO1211DR

Texas Instruments

Digital I/P Module

GULL WING

8

HSOP

RECTANGULAR

PLASTIC/EPOXY

YES

60 V

1

1

3 V

SMALL OUTLINE, HEAT SINK/SLUG

SOP8,.25

2.25 V

1.27 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

2

1.75 mm

3.895 mm

30

260

4.905 mm

ISO1211D

Texas Instruments

Digital I/P Module

GULL WING

8

HSOP

RECTANGULAR

PLASTIC/EPOXY

YES

60 V

1

1

3 V

SMALL OUTLINE, HEAT SINK/SLUG

SOP8,.25

2.25 V

1.27 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

2

1.75 mm

3.895 mm

30

260

4.905 mm

XISO1211D

Texas Instruments

Digital I/P Module

6ES7131-6BH01-0BA0

Siemens

Digital I/P Module

ISO1I811TXUMA1

Infineon Technologies

Digital I/P Module

INDUSTRIAL

GULL WING

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

35 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

9.6 V

2.85 V

.5 mm

85 Cel

24 V

-40 Cel

TIN

DUAL

R-PDSO-G48

3

1.1 mm

6.1 mm

e3

12.5 mm

6ES7131-6BF01-0BA0

Siemens

Digital I/P Module

MAX31911AUI+T

Analog Devices

Digital I/P Module

AUTOMOTIVE

GULL WING

28

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

36 V

1

2 mA

24 V

7/36

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

Line Driver or Receivers

7 V

.65 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G28

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

9.7 mm

750-1406

Wago

Digital I/P Module

MAX31911AUI+

Analog Devices

Digital I/P Module

AUTOMOTIVE

GULL WING

28

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

36 V

1

2 mA

24 V

7/36

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

Line Driver or Receivers

7 V

.65 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G28

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

9.7 mm

6ES7521-1BL00-0AB0

Siemens

Digital I/P Module

6ES7521-1BH00-0AB0

Siemens

Digital I/P Module

KL1114

Beckhoff Automation

Digital I/P Module

MAX22191AUT+T

Analog Devices

Digital I/P Module

Matte Tin (Sn) - annealed

1

e3

30

260

SI8380P-IUR

Silicon Labs

Digital I/P Module

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

8

CMOS

5 V

SMALL OUTLINE, SHRINK PITCH

SSOP20,.25

2.25 V

.635 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G20

1.75 mm

3.91 mm

8.66 mm

ADE1201ACCZ

Analog Devices

Digital I/P Module

AUTOMOTIVE

NO LEAD

20

SON

RECTANGULAR

PLASTIC/EPOXY

YES

3.63 V

1

CMOS

SPI

3.3 V

SMALL OUTLINE

SOLCC20,.32,20

2.97 V

.5 mm

125 Cel

-40 Cel

DUAL

R-PDSO-N20

3

1.2 mm

5 mm

30

260

8 mm

6ES7226-6BA32-0XB0

Siemens

Digital I/P Module

6ES7321-1BL00-0AA0

Siemens

Digital I/P Module

KL1408

Beckhoff Automation

Digital I/P Module

SI8388P-IUR

Silicon Labs

Digital I/P Module

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

8

CMOS

5 V

SMALL OUTLINE, SHRINK PITCH

SSOP20,.25

2.25 V

.635 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G20

1.75 mm

3.91 mm

8.66 mm

ADAM-6251-B

Advantech

Digital I/P Module

MAX22195ATJ+

Analog Devices

Digital I/P Module

Matte Tin (Sn) - annealed

1

e3

30

260

ADE1201ACCZ-RL

Analog Devices

Digital I/P Module

AUTOMOTIVE

NO LEAD

20

SON

RECTANGULAR

PLASTIC/EPOXY

YES

3.63 V

1

CMOS

SPI

3.3 V

SMALL OUTLINE

SOLCC20,.32,20

2.97 V

.5 mm

125 Cel

-40 Cel

DUAL

R-PDSO-N20

3

1.2 mm

5 mm

30

260

8 mm

750-430

Wago

Digital I/P Module

MAX22191AUT+

Analog Devices

Digital I/P Module

Matte Tin (Sn) - annealed

1

e3

30

260

750-402

Wago

Digital I/P Module

6ES7131-6BF01-0AA0

Siemens

Digital I/P Module

772001

Pilz & Kg

Digital I/P Module

EVALISO1I813TTOBO1

Infineon Technologies

Digital I/P Module

6ES7131-6BF00-0CA0

Siemens

Digital I/P Module

750-1415

Wago

Digital I/P Module

MAX22190ATJ+

Analog Devices

Digital I/P Module

Matte Tin (Sn) - annealed

1

e3

30

260

SCLT3-8BT8

STMicroelectronics

Digital I/P Module

MATTE TIN

3

e3

40

260

MAX22190ATJ+T

Analog Devices

Digital I/P Module

Matte Tin (Sn) - annealed

1

e3

30

260

6ES7321-1BH02-0AA0

Siemens

Digital I/P Module

ISO1I813TXUMA1

Infineon Technologies

Digital I/P Module

INDUSTRIAL

GULL WING

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

35 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.3,20

9.6 V

2.85 V

.5 mm

85 Cel

24 V

-40 Cel

MATTE TIN

DUAL

R-PDSO-G48

3

1.1 mm

6.1 mm

e3

12.5 mm

SI8380S-IUR

Silicon Labs

Digital I/P Module

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

5 V

SMALL OUTLINE, SHRINK PITCH

SSOP20,.25

2.25 V

.635 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G20

1.75 mm

3.91 mm

8.66 mm

ISO1I811T

Infineon Technologies

Digital I/P Module

INDUSTRIAL

GULL WING

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

35 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

9.6 V

2.85 V

.5 mm

85 Cel

24 V

-40 Cel

DUAL

R-PDSO-G48

3

1.1 mm

6.1 mm

12.5 mm

MAX31913AUI+

Analog Devices

Digital I/P Module

AUTOMOTIVE

GULL WING

28

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

36 V

1

2.3 mA

24 V

7/36

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

Line Driver or Receivers

7 V

.65 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G28

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

9.7 mm

MAX31913AUI+T

Analog Devices

Digital I/P Module

AUTOMOTIVE

GULL WING

28

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

36 V

1

2.3 mA

24 V

7/36

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

Line Driver or Receivers

7 V

.65 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G28

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

9.7 mm

MAX31910AUI+

Analog Devices

Digital I/P Module

AUTOMOTIVE

GULL WING

28

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

36 V

1

24 V

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

7 V

.65 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G28

1

1.1 mm

4.4 mm

e3

30

260

9.7 mm

MAX31915AUI+T

Analog Devices

Digital I/P Module

AUTOMOTIVE

GULL WING

38

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

36 V

1

BICMOS

24 V

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

7 V

.5 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G38

1

1.1 mm

4.4 mm

e3

30

260

9.7 mm

MAX31915AUI+

Analog Devices

Digital I/P Module

AUTOMOTIVE

GULL WING

38

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

36 V

1

BICMOS

24 V

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

7 V

.5 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G38

1

1.1 mm

4.4 mm

e3

30

260

9.7 mm

MAX31914AUI+T

Analog Devices

Digital I/P Module

AUTOMOTIVE

GULL WING

38

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

36 V

1

BICMOS

24 V

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

7 V

.5 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G38

1

1.1 mm

4.4 mm

e3

30

260

9.7 mm

MAX31910AUI+T

Analog Devices

Digital I/P Module

AUTOMOTIVE

GULL WING

28

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

36 V

1

24 V

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

7 V

.65 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G28

1

1.1 mm

4.4 mm

e3

30

260

9.7 mm

MAX31914AUI+

Analog Devices

Digital I/P Module

AUTOMOTIVE

GULL WING

38

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

36 V

1

BICMOS

24 V

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

7 V

.5 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G38

1

1.1 mm

4.4 mm

e3

30

260

9.7 mm

MAX22192ARC+

Analog Devices

Digital I/P Module

NOT SPECIFIED

NOT SPECIFIED

CLT01-38SQ7-TR

STMicroelectronics

Digital I/P Module

3

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.