20 Other Function Interface ICs 486

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Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

MAX3015EUP

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.2 V

8

BICMOS

1.8 V

3.6 V

1.8/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

1.65 V

Other Interface ICs

1.2 V

.65 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

DUAL

R-PDSO-G20

1

1.1 mm

4.4 mm

Not Qualified

e0

6.5 mm

MAX3022EUP

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.2 V

8

BICMOS

1.8 V

3.6 V

1.8/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

1.65 V

Other Interface ICs

1.2 V

.65 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

DUAL

R-PDSO-G20

1

1.1 mm

4.4 mm

Not Qualified

e0

6.5 mm

MAX3021EUP

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.2 V

8

BICMOS

1.8 V

3.6 V

1.8/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

1.65 V

Other Interface ICs

1.2 V

.65 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

DUAL

R-PDSO-G20

1

1.1 mm

4.4 mm

Not Qualified

e0

6.5 mm

MAX3012EUP+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

8

BICMOS

5.5 V

1.8/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

1.65 V

Other Interface ICs

1.2 V

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G20

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

6.5 mm

MAX3019EGP

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

3.2 V

8

BICMOS

1.8 V

3.6 V

1.8/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.20SQ,25

1.65 V

Other Interface ICs

1.2 V

.65 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

QUAD

S-XQCC-N20

1

1 mm

5 mm

Not Qualified

e0

5 mm

MAX3012EUP+T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

8

BICMOS

5.5 V

1.8/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

1.65 V

Other Interface ICs

1.2 V

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G20

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

6.5 mm

MAX3002EBP+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.65 V

1.2 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B20

1

.67 mm

2.03 mm

e1

30

260

2.54 mm

MAX3015EGP

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

3.2 V

8

BICMOS

1.8 V

3.6 V

1.8/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.20SQ,25

1.65 V

Other Interface ICs

1.2 V

.65 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

QUAD

S-XQCC-N20

1

1 mm

5 mm

Not Qualified

e0

5 mm

MAX3008EUP+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

8

BICMOS

5.5 V

1.8/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

1.65 V

Other Interface ICs

1.2 V

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G20

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

6.5 mm

MAX3007EUP

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5.5 V

1.8/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

1.65 V

Other Interface ICs

1.2 V

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G20

1

1.1 mm

4.4 mm

Not Qualified

e0

6.5 mm

MAX3015EBP-T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.2 V

8

BICMOS

1.8 V

3.6 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B20

1

.67 mm

2.03 mm

Not Qualified

e0

2.54 mm

MAX3019EUP

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.2 V

8

BICMOS

1.8 V

3.6 V

1.8/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

1.65 V

Other Interface ICs

1.2 V

.65 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

DUAL

R-PDSO-G20

1

1.1 mm

4.4 mm

Not Qualified

e0

6.5 mm

MAX3017EGP

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

3.2 V

8

BICMOS

1.8 V

3.6 V

1.8/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.20SQ,25

1.65 V

Other Interface ICs

1.2 V

.65 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

QUAD

S-XQCC-N20

1

1 mm

5 mm

Not Qualified

e0

5 mm

MAX3022EBP-T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.2 V

8

BICMOS

1.8 V

3.6 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B20

1

.67 mm

2.03 mm

Not Qualified

e0

2.54 mm

MAX3002ETP

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

BICMOS

5.5 V

1.8/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.20SQ,25

1.65 V

Other Interface ICs

1.2 V

.65 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N20

1

.8 mm

5 mm

Not Qualified

5 mm

MAX3014EUP

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.2 V

8

BICMOS

1.8 V

3.6 V

1.8/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

1.65 V

Other Interface ICs

1.2 V

.65 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

DUAL

R-PDSO-G20

1

1.1 mm

4.4 mm

Not Qualified

e0

6.5 mm

MAX3001EAUP/V+

Analog Devices

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

AEC-Q100

5.5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

1.65 V

1.2 V

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G20

1.1 mm

4.4 mm

NOT SPECIFIED

NOT SPECIFIED

6.5 mm

MAX3996CTP+T

Analog Devices

INTERFACE CIRCUIT

COMMERCIAL

NO LEAD

20

HVQCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-CQCC-N20

1

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

NCN6001MUTWG

Onsemi

INTERFACE CIRCUIT

OTHER

BUTT

20

VFLGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.7 V

.8 mm

85 Cel

-25 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBGA-B20

.6 mm

5 mm

e4

6 mm

NCN6001MUR2G

Onsemi

INTERFACE CIRCUIT

OTHER

BUTT

20

VFLGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3 V

CHIP CARRIER

2.7 V

.8 mm

85 Cel

-25 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B20

.6 mm

5 mm

Not Qualified

e4

6 mm

NCN6001DTB

Onsemi

INTERFACE CIRCUIT

OTHER

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.7 V

.65 mm

85 Cel

-25 Cel

DUAL

R-PDSO-G20

1.2 mm

4.4 mm

Not Qualified

6.5 mm

LV5609V-TLM-E

Onsemi

COMMERCIAL EXTENDED

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

3.3 V

3.3

SMALL OUTLINE, SHRINK PITCH

SSOP20,.25

Other Interface ICs

.635 mm

80 Cel

-20 Cel

TIN BISMUTH

DUAL

R-PDSO-G20

3

Not Qualified

e6

30

260

LV5609V-HAS-TLM-E

Onsemi

COMMERCIAL EXTENDED

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

3.3 V

3.3

SMALL OUTLINE, SHRINK PITCH

SSOP20,.25

Other Interface ICs

.635 mm

80 Cel

-20 Cel

TIN BISMUTH

DUAL

R-PDSO-G20

3

Not Qualified

e6

30

260

LV5609V-MPB-E

Onsemi

COMMERCIAL EXTENDED

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

3.3 V

3.3

SMALL OUTLINE, SHRINK PITCH

SSOP20,.25

Other Interface ICs

.635 mm

80 Cel

-20 Cel

TIN BISMUTH

DUAL

R-PDSO-G20

3

Not Qualified

e6

30

260

ST2189QTR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

20

VQCCN

RECTANGULAR

UNSPECIFIED

YES

3.6 V

8

1.8 V

1.8/3.3

CHIP CARRIER

LCC20,.09X.13,16

Other Interface ICs

1.65 V

.4 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

R-XQCC-N20

1

.55 mm

1.8 mm

Not Qualified

e4

30

260

3.2 mm

L6720

STMicroelectronics

INTERFACE CIRCUIT

COMMERCIAL

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

12 V

1

12 V

-8 V

IN-LINE

-4 V

10 V

2.54 mm

70 Cel

-8 V

0 Cel

TIN LEAD

DUAL

R-PDIP-T20

5.1 mm

7.62 mm

Not Qualified

e0

HCF40109BC1

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

J BEND

20

QCCJ

SQUARE

PLASTIC/EPOXY

YES

15 V

4

CMOS

3/15

CHIP CARRIER

LDCC20,.4SQ

Other Interface ICs

3 V

1.27 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-J20

4.57 mm

8.9662 mm

Not Qualified

e3

8.9662 mm

L9864D

STMicroelectronics

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

16 V

1

12 V

SMALL OUTLINE

6 V

1.27 mm

125 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G20

2.65 mm

7.5 mm

Not Qualified

e0

12.8 mm

ST2378EBJR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

BUTT

20

VBCC

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

1.8 V

2/5

CHIP CARRIER, VERY THIN PROFILE

BGA20,4X5,20

Other Interface ICs

1.71 V

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBCC-B20

1 mm

2 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

2.46 mm

L6721

STMicroelectronics

INTERFACE CIRCUIT

COMMERCIAL

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

12 V

1

12 V

IN-LINE

10 V

2.54 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDIP-T20

5.1 mm

7.62 mm

Not Qualified

e0

ST6G3237TTR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

1.8 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

1.4 V

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.2 mm

4.4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

6.5 mm

TDA9950TT/C3,512

NXP Semiconductors

COMMERCIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.3 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

Other Interface ICs

.635 mm

70 Cel

0 Cel

DUAL

R-PDSO-G20

Not Qualified

NVT4857UK

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.9 V

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B20

.53 mm

1.7 mm

2.1 mm

TDA9950TT/C3,518

NXP Semiconductors

COMMERCIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.3 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

Other Interface ICs

.635 mm

70 Cel

0 Cel

DUAL

R-PDSO-G20

Not Qualified

MC34827A1EP

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.7 V

.4 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N20

.6 mm

3 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3 mm

MC34825EPR2

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

3.6 V

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.65 V

2.7 V

.4 mm

85 Cel

3 V

-40 Cel

QUAD

S-XQCC-N20

3

.6 mm

3 mm

Not Qualified

40

260

3 mm

MC34827A1EPR2

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.7 V

.4 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N20

3

.6 mm

3 mm

Not Qualified

40

260

3 mm

MC34827A2EP

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

5.5 V

1

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.7 V

.5 mm

85 Cel

-40 Cel

QUAD

R-XQCC-N20

.6 mm

3 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

4 mm

MC34825EP

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

3.6 V

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.65 V

2.7 V

.4 mm

85 Cel

3 V

-40 Cel

QUAD

S-XQCC-N20

.6 mm

3 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3 mm

MC34827A2EPR2

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

5.5 V

1

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.7 V

.5 mm

85 Cel

-40 Cel

QUAD

R-XQCC-N20

3

.6 mm

3 mm

Not Qualified

40

260

4 mm

PCA9518AD,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

2

CMOS

3.3 V

SMALL OUTLINE

3 V

1.27 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G20

1

2.65 mm

7.5 mm

Not Qualified

e4

30

260

12.8 mm

PCA9519PW

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G20

1

1.1 mm

4.4 mm

Not Qualified

e4

30

260

6.5 mm

PCA9559PWDH-T

NXP Semiconductors

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

3 V

.65 mm

70 Cel

0 Cel

DUAL

R-PDSO-G20

1.1 mm

4.4 mm

6.5 mm

TJA1080ATS/2/T

NXP Semiconductors

INTERFACE CIRCUIT

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

1

SMALL OUTLINE, SHRINK PITCH

4.75 V

.65 mm

DUAL

R-PDSO-G20

1

2 mm

5.3 mm

Not Qualified

30

260

7.2 mm

PCA9559PW/G,112

NXP Semiconductors

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

3 V

.65 mm

70 Cel

0 Cel

DUAL

R-PDSO-G20

1.1 mm

4.4 mm

6.5 mm

PCA9559PW-T

NXP Semiconductors

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

3 V

.65 mm

70 Cel

0 Cel

DUAL

R-PDSO-G20

1.1 mm

4.4 mm

6.5 mm

PCA9518APW-T

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

2.7 V

2

CMOS

2.5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.3 V

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.1 mm

4.4 mm

ALSO OPERATES AT 3 V TO 3.6 V

6.5 mm

PCA9519PW,112

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

1/4,3.3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

Line Driver or Receivers

.65 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G20

1

1.1 mm

4.4 mm

Not Qualified

e4

30

260

6.5 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.