38 Other Function Interface ICs 16

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Interface Standard	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LTC2874IUHF#PBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	38	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	34 V	4	CMOS	SPI	24 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC38,.2X.28,20		8 V	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	R-PQCC-N38		.8 mm	5 mm		SEATED HT-CALCULATED	e3			7 mm
TIC12400DCPR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	38	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	24 V	1			12 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			6.5 V	.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G38	3	1.2 mm	4.4 mm		ALSO HAVE 24V MAX INPUT VOLTAGE	e4	30	260	9.7 mm
LTC2874IFE#PBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	38	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	34 V	4	CMOS	SPI	24 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP38,.25,20		8 V	.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G38		1.2 mm	4.4 mm			e3			9.7 mm
LTC2874IUHF#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	38	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	34 V	4	CMOS	SPI	24 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC38,.2X.28,20		8 V	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	R-PQCC-N38		.8 mm	5 mm		SEATED HT-CALCULATED	e3			7 mm
LTC2874IFE#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	38	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	34 V	4	CMOS	SPI	24 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP38,.25,20		8 V	.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G38		1.2 mm	4.4 mm			e3			9.7 mm
MAX31915AUI+T	Analog Devices	Digital I/P Module	AUTOMOTIVE	GULL WING	38	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	36 V	1	BICMOS		24 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			7 V	.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G38	1	1.1 mm	4.4 mm			e3	30	260	9.7 mm
MAX31915AUI+	Analog Devices	Digital I/P Module	AUTOMOTIVE	GULL WING	38	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	36 V	1	BICMOS		24 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			7 V	.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G38	1	1.1 mm	4.4 mm			e3	30	260	9.7 mm
MAX31914AUI+T	Analog Devices	Digital I/P Module	AUTOMOTIVE	GULL WING	38	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	36 V	1	BICMOS		24 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			7 V	.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G38	1	1.1 mm	4.4 mm			e3	30	260	9.7 mm
MAX31914AUI+	Analog Devices	Digital I/P Module	AUTOMOTIVE	GULL WING	38	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	36 V	1	BICMOS		24 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			7 V	.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G38	1	1.1 mm	4.4 mm			e3	30	260	9.7 mm
MAX3261E/D	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	38	DIE	SQUARE	UNSPECIFIED	YES	5.25 V	1			5 V		UNCASED CHIP			4.75 V		85 Cel	-40 Cel	TIN LEAD	UPPER	S-XUUC-N38				Not Qualified		e0
IP4776CZ38	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	38	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		1			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G38	1	1.1 mm	4.4 mm	Not Qualified		e4	30	260	9.7 mm
IP4776CZ38,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	38	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		1			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G38	1	1.1 mm	4.4 mm	Not Qualified		e4	30	260	9.7 mm
MAX3986UTU+	Maxim Integrated	INTERFACE CIRCUIT	OTHER	NO LEAD	38	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	3.6 V	1	BICMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			3 V	.5 mm	85 Cel	0 Cel	MATTE TIN	QUAD	R-XQCC-N38	1	.8 mm	5 mm			e3	30	260	7 mm
UPD16520GS-BGG-E1-A	Renesas Electronics		COMMERCIAL	GULL WING	38	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES			CMOS			2/5.5	SMALL OUTLINE, SHRINK PITCH	SSOP38,.3	Other Interface ICs		.635 mm	70 Cel	-20 Cel		DUAL	R-PDSO-G38				Not Qualified
UPD16520GS-BGG-A	Renesas Electronics		COMMERCIAL	GULL WING	38	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES			CMOS			2/5.5	SMALL OUTLINE, SHRINK PITCH	SSOP38,.3	Other Interface ICs		.635 mm	70 Cel	-20 Cel		DUAL	R-PDSO-G38				Not Qualified
UPD16520GS-BGG-E2-A	Renesas Electronics		COMMERCIAL	GULL WING	38	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES			CMOS			2/5.5	SMALL OUTLINE, SHRINK PITCH	SSOP38,.3	Other Interface ICs		.635 mm	70 Cel	-20 Cel		DUAL	R-PDSO-G38				Not Qualified

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.