Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Display Mode | Surface Mount | Maximum Supply Voltage | Maximum Output Current | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Built-in Protections | Interface Standard | Maximum Supply Current | No. of Digits/Characters | Output Latch/Register | Nominal Supply Voltage | Maximum Supply Voltage-1 | Turn-on Time | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | No. of Segments | Minimum Supply Voltage-1 | No. of Backplanes | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Driver No. of Bits | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Nominal Output Peak Current Limit | Width | Turn-off Time | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Maximum Receive Delay |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
General Semiconductor |
OTHER |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
SEGMENT |
NO |
CMOS |
5 V |
5 |
IN-LINE |
DIP40,.6 |
32 |
1-BP |
Other Interface ICs |
2.54 mm |
85 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T40 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.5 V |
.5 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
6 mm |
Not Qualified |
e3 |
30 |
260 |
6 mm |
||||||||||||||||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
CMOS |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.5 V |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
6 mm |
e3 |
30 |
260 |
6 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.5 V |
.5 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
6 mm |
Not Qualified |
e3 |
30 |
260 |
6 mm |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
2.5 V |
.5 mm |
85 Cel |
-30 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N40 |
2 |
1 mm |
6 mm |
e4 |
30 |
260 |
6 mm |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
NO LEAD |
40 |
QCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
2 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG |
3 V |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N40 |
1 |
.8 mm |
4 mm |
e4 |
260 |
6 mm |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
NO LEAD |
40 |
QCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
2 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG |
3 V |
.4 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N40 |
1 |
.8 mm |
4 mm |
e4 |
260 |
6 mm |
|||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SEGMENT |
YES |
5.5 V |
1 |
CMOS |
7-DIGIT |
3.3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
7 |
Display Drivers |
2.5 V |
.5 mm |
125 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
6 mm |
Not Qualified |
COMMON-ANODE |
e0 |
245 |
6 mm |
|||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SEGMENT |
YES |
5.5 V |
1 |
CMOS |
7-DIGIT |
3.3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
7 |
Display Drivers |
2.5 V |
.5 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
6 mm |
Not Qualified |
COMMON-ANODE |
e3 |
30 |
260 |
6 mm |
|||||||||||||||||||||||
|
Holt Integrated Circuits |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.47 V |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3.13 V |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
e3 |
40 |
260 |
6 mm |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
NO LEAD |
40 |
QCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
2 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG |
3 V |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N40 |
1 |
.8 mm |
4 mm |
e4 |
260 |
6 mm |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
NO LEAD |
40 |
QCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
2 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG |
3 V |
.4 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N40 |
1 |
.8 mm |
4 mm |
e4 |
260 |
6 mm |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
BICMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2SQ,16 |
1.62 V |
.4 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
5 mm |
e3 |
30 |
260 |
5 mm |
|||||||||||||||||||||||||||||||
|
Diodes Incorporated |
INTERFACE CIRCUIT |
NO LEAD |
40 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.12X.24,16 |
3 V |
.4 mm |
70 Cel |
-40 Cel |
QUAD |
R-XQCC-N40 |
.8 mm |
3 mm |
6 mm |
|||||||||||||||||||||||||||||||||||||
Holt Integrated Circuits |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.47 V |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3.13 V |
.5 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
e0 |
6 mm |
||||||||||||||||||||||||||||||||||
|
Holt Integrated Circuits |
INTERFACE CIRCUIT |
MILITARY |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.47 V |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3.13 V |
.5 mm |
125 Cel |
-55 Cel |
Matte Tin (Sn) |
QUAD |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
e3 |
40 |
260 |
6 mm |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
NO LEAD |
40 |
QCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
4 |
4 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG |
3 V |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N40 |
1 |
.8 mm |
4 mm |
e4 |
260 |
6 mm |
|||||||||||||||||||||||||||||||||
|
Holt Integrated Circuits |
INTERFACE CIRCUIT |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
SOI-CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
3 V |
.5 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N40 |
3 |
.82 mm |
6 mm |
e4 |
40 |
260 |
6 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
BICMOS |
3.3 V |
CHIP CARRIER |
2.3 V |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N40 |
1 |
e3 |
30 |
260 |
|||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
CMOS |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.5 V |
.5 mm |
125 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
6 mm |
Not Qualified |
e0 |
6 mm |
||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
CMOS |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.5 V |
.5 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
6 mm |
Not Qualified |
e3 |
30 |
260 |
6 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
CMOS |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.5 V |
.5 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
6 mm |
Not Qualified |
e3 |
30 |
260 |
6 mm |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
2.5 V |
.5 mm |
85 Cel |
-30 Cel |
QUAD |
S-PQCC-N40 |
2 |
1 mm |
6 mm |
260 |
6 mm |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
NO LEAD |
40 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
4 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.16X.24,16 |
3 V |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N40 |
1 |
.8 mm |
4 mm |
e4 |
260 |
6 mm |
||||||||||||||||||||||||||||||||
Renesas Electronics |
INTERFACE CIRCUIT |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5.25 V |
1 |
CMOS |
MIL-PRF-38535 Class Q |
5 V |
IN-LINE |
DIP40,.6 |
4.75 V |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T40 |
5.72 mm |
15.24 mm |
Qualified |
LG-MAX |
e0 |
53.24 mm |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
40 |
HQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG |
2.5 V |
85 Cel |
-30 Cel |
QUAD |
S-PQCC-N40 |
||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
INTERFACE CIRCUIT |
COMMERCIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
1 |
5 V |
5.25 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.20SQ,16 |
4.75 V |
4.75 V |
.4 mm |
70 Cel |
5 V |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N40 |
.8 mm |
5 mm |
Not Qualified |
e4 |
5 mm |
||||||||||||||||||||||||||||||
|
Holt Integrated Circuits |
INTERFACE CIRCUIT |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
SOI-CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N40 |
3 |
.82 mm |
6 mm |
e4 |
NOT SPECIFIED |
260 |
6 mm |
|||||||||||||||||||||||||||||||
Renesas Electronics |
INTERFACE CIRCUIT |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5.25 V |
1 |
CMOS |
5 V |
IN-LINE |
DIP40,.6 |
4.75 V |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T40 |
5.72 mm |
15.24 mm |
LG-MAX |
e0 |
53.24 mm |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
INTERFACE CIRCUIT |
COMMERCIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2.7 V |
1 |
2.5 V |
5.25 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
4.75 V |
2.3 V |
.4 mm |
70 Cel |
5 V |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N40 |
.8 mm |
5 mm |
e4 |
5 mm |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.27 V |
1 |
4 |
1.1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1 V |
.4 mm |
85 Cel |
0 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N40 |
2 |
.8 mm |
5 mm |
ALSO HAVE 3 NOM AND 3.6 MAX AND 3.3 NOM INPUT AND ALSO HAVE 313 MIN AND 3.47 MAX AND 3.3 NOM INPUT |
e4 |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2 V |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.6 V |
.5 mm |
85 Cel |
-30 Cel |
TIN |
QUAD |
S-XQCC-N40 |
3 |
.4 mm |
6 mm |
Not Qualified |
e3 |
6 mm |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.27 V |
1 |
4 |
1.1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1 V |
.4 mm |
85 Cel |
0 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N40 |
2 |
.8 mm |
5 mm |
ALSO HAVE 3 NOM AND 3.6 MAX AND 3.3 NOM INPUT AND ALSO HAVE 313 MIN AND 3.47 MAX AND 3.3 NOM INPUT |
e4 |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2 V |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.6 V |
.5 mm |
85 Cel |
-30 Cel |
TIN |
QUAD |
S-XQCC-N40 |
3 |
.4 mm |
6 mm |
Not Qualified |
e3 |
6 mm |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
NO LEAD |
40 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
4 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.16X.24,16 |
3 V |
.4 mm |
85 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N40 |
1 |
.8 mm |
4 mm |
e4 |
260 |
6 mm |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
NO LEAD |
40 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
4 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.16X.24,16 |
3 V |
.4 mm |
85 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N40 |
1 |
.8 mm |
4 mm |
e4 |
260 |
6 mm |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
NO LEAD |
40 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
4 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.16X.24,16 |
3 V |
.4 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N40 |
1 |
.8 mm |
4 mm |
IT ALSO OPERATE 3.135 TO 3.465 |
e4 |
260 |
6 mm |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
NO LEAD |
40 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
4 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.16X.24,16 |
3 V |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N40 |
1 |
.8 mm |
4 mm |
e4 |
260 |
6 mm |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
NO LEAD |
40 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
4 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.16X.24,16 |
3 V |
.4 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N40 |
1 |
.8 mm |
4 mm |
IT ALSO OPERATE 3.135 TO 3.465 |
e4 |
260 |
6 mm |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
NO LEAD |
40 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
4 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.16X.24,16 |
3 V |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N40 |
1 |
.8 mm |
4 mm |
IT ALSO OPERATE 3.135 TO 3.465 |
e4 |
260 |
6 mm |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
NO LEAD |
40 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
4 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.16X.24,16 |
3 V |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N40 |
1 |
.8 mm |
4 mm |
IT ALSO OPERATE 3.135 TO 3.465 |
e4 |
260 |
6 mm |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
6 V |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.4 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N40 |
2 |
1 mm |
5 mm |
e4 |
NOT SPECIFIED |
260 |
5 mm |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
NO LEAD |
40 |
QCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
4 |
4 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG |
3 V |
.4 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N40 |
1 |
.8 mm |
4 mm |
e4 |
260 |
6 mm |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
NO LEAD |
40 |
QCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
4 |
4 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG |
3 V |
.4 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N40 |
1 |
.8 mm |
4 mm |
e4 |
260 |
6 mm |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
NO LEAD |
40 |
QCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
4 |
4 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG |
3 V |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N40 |
1 |
.8 mm |
4 mm |
e4 |
260 |
6 mm |
|||||||||||||||||||||||||||||||||
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
CMOS |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.5 V |
.4 mm |
125 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N40 |
.8 mm |
5 mm |
Not Qualified |
e0 |
5 mm |
|||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
COMMERCIAL |
NO LEAD |
40 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 V |
3.3 |
CHIP CARRIER |
LCC40,.2SQ,16 |
Display Drivers |
.4 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-N40 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
COMMERCIAL |
NO LEAD |
40 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 V |
3.3 |
CHIP CARRIER |
LCC40,.2SQ,16 |
Display Drivers |
.4 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-N40 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.
Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:
1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.
2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.
3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.
Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.