48 Other Function Interface ICs 137

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Display Mode	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Nominal Negative Supply Voltage	Package Style (Meter)	Package Equivalence Code	No. of Segments	Minimum Supply Voltage-1	No. of Backplanes	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ISO1I811TXUMA1	Infineon Technologies	Digital I/P Module	INDUSTRIAL	GULL WING	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1				3.3 V	35 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			9.6 V			2.85 V	.5 mm	85 Cel	24 V	-40 Cel	TIN	DUAL	R-PDSO-G48	3	1.1 mm	6.1 mm		e3			12.5 mm
HT1621B(48LQFP-A)	Holtek Semiconductor		INDUSTRIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	SEGMENT	YES			CMOS		.6 mA			3/5		FLATPACK	QFP48,.35SQ,20	32		4-BP	Other Interface ICs		.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G48				Not Qualified
TLE9263BQXV33XUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	28 V	1		AEC-Q100		13.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						5.5 V	.5 mm				TIN	QUAD	S-XQCC-N48	3	.9 mm	7 mm		e3			7 mm
TLE9263BQXXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	28 V	1		AEC-Q100		13.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						5.5 V	.5 mm				TIN	QUAD	S-XQCC-N48	3	.9 mm	7 mm		e3			7 mm
TLE92623BQXV33XUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	28 V	1		AEC-Q100		13.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						5.5 V	.5 mm				TIN	QUAD	S-XQCC-N48	3	.9 mm	7 mm		e3			7 mm
TLE9263QXXUMA2	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	28 V	1		AEC-Q100		13.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						5.5 V	.5 mm				TIN	QUAD	S-PQCC-N48	3	.9 mm	7 mm		e3			7 mm
TLE9263QXXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	28 V	1		AEC-Q100		13.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						5.5 V	.5 mm					QUAD	S-PQCC-N48		.9 mm	7 mm					7 mm
MC33CD1030AER2	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	36 V	1	SMARTMOS			16 V				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH						4.5 V	.5 mm	125 Cel		-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
TLE9263QXV33XUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	28 V	1		AEC-Q100		13.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						5.5 V	.5 mm					QUAD	S-PQCC-N48	3	.9 mm	7 mm					7 mm
TLE9262QXXUMA2	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	28 V	1		AEC-Q100		13.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						5.5 V	.5 mm				TIN	QUAD	S-PQCC-N48	3	.9 mm	7 mm		e3			7 mm
TLE9274QXXUMA2	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	28 V	1		AEC-Q100		13.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20					4.5 V	.5 mm	150 Cel		-40 Cel	TIN	QUAD	S-XQCC-N48	3	.9 mm	7 mm		e3			7 mm
TLE92633BQXXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	28 V	1		AEC-Q100		13.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						5.5 V	.5 mm				TIN	QUAD	S-XQCC-N48	3	.9 mm	7 mm		e3			7 mm
TLE9262BQXV33XUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	28 V	1		AEC-Q100		13.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						5.5 V	.5 mm				TIN	QUAD	S-XQCC-N48	3	.9 mm	7 mm		e3			7 mm
TLE9262BQXXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	28 V	1		AEC-Q100		13.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						5.5 V	.5 mm				TIN	QUAD	S-XQCC-N48	3	.9 mm	7 mm		e3			7 mm
TLE92633BQXV33XUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	28 V	1		AEC-Q100		13.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						5.5 V	.5 mm				TIN	QUAD	S-XQCC-N48	3	.9 mm	7 mm		e3			7 mm
CCE4510_QFN48	Renesas Electronics	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	32 V	1	HVCMOS			24 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						8 V	.5 mm	85 Cel		-40 Cel		QUAD	S-XQCC-N48		1 mm	7 mm					7 mm
CCE451048QFN	Renesas Electronics	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	32 V	1	HV-CMOS			24 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20					8 V	.5 mm	85 Cel		-40 Cel		QUAD	S-XQCC-N48	3	1 mm	7 mm					7 mm
TLE9260QXXUMA2	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	28 V	1		AEC-Q100		13.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						5.5 V	.5 mm					QUAD	S-PQCC-N48	3	.9 mm	7 mm					7 mm
MD1711K6-G	Microchip Technology	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1		TS 16949		3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20					1.8 V	.5 mm	125 Cel		0 Cel	MATTE TIN	QUAD	S-XQCC-N48		1 mm	7 mm	Not Qualified	e3			7 mm
NCN6004AFTBR2G	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	5 V	1				3 V				FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH						2.7 V	.5 mm	85 Cel		-40 Cel	TIN	QUAD	S-PQFP-G48	3	1.1 mm	7 mm	Not Qualified	e3		260	7 mm
TLE9262QXV33XUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	28 V	1		AEC-Q100		13.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						5.5 V	.5 mm					QUAD	S-PQCC-N48		.9 mm	7 mm			NOT SPECIFIED	NOT SPECIFIED	7 mm
TLE9262QXXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	28 V	1		AEC-Q100		13.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						5.5 V	.5 mm					QUAD	S-PQCC-N48		.9 mm	7 mm					7 mm
TLE92623BQXXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	28 V	1		AEC-Q100		13.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						5.5 V	.5 mm				TIN	QUAD	S-XQCC-N48	3	.9 mm	7 mm		e3			7 mm
ISO1I813TXUMA1	Infineon Technologies	Digital I/P Module	INDUSTRIAL	GULL WING	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1				3.3 V	35 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.3,20		9.6 V			2.85 V	.5 mm	85 Cel	24 V	-40 Cel	MATTE TIN	DUAL	R-PDSO-G48	3	1.1 mm	6.1 mm		e3			12.5 mm
ISO1I811T	Infineon Technologies	Digital I/P Module	INDUSTRIAL	GULL WING	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1				3.3 V	35 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			9.6 V			2.85 V	.5 mm	85 Cel	24 V	-40 Cel		DUAL	R-PDSO-G48	3	1.1 mm	6.1 mm					12.5 mm
MC33CD1030AE	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	36 V	1	SMARTMOS			16 V				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH						4.5 V	.5 mm	125 Cel		-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MD1712FG-G	Microchip Technology	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5 V	1				3.3 V	12.6 V		-10 V	FLATPACK, LOW PROFILE, FINE PITCH	SPQFP48,.28SQ,20		8 V			1.8 V	.5 mm	70 Cel	10 V	0 Cel	MATTE TIN	QUAD	S-PQFP-G48		1.6 mm	7 mm		e3			7 mm
LMH0376SQ	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED		YES	2.625 V	1				2.5 V				CHIP CARRIER						2.375 V		85 Cel		-40 Cel		QUAD	S-XQCC-N48
LM4312SM	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	2 V	1				1.8 V				CHIP CARRIER						1.6 V	.4 mm	85 Cel		-40 Cel		QUAD	S-XQCC-N48		.4 mm	6 mm	Not Qualified				6 mm
ADSYS8401JPCZ	Analog Devices	INTERFACE CIRCUIT	OTHER	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1				3.3 V	18 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						3 V	.5 mm	85 Cel	15.5 V	0 Cel	TIN LEAD	QUAD	S-XQCC-N48		1 mm	7 mm	Not Qualified	e0			7 mm
MAX9406ETM+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	4	BIPOLAR			3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20				Other Interface ICs	3 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX9406ETM+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	4	BIPOLAR			3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						3 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N48	1	.8 mm	7 mm		e3	30	260	7 mm
ADN2841ACPZ-48-RL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1				5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						4.5 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e3	30	260	7 mm
ADN2840	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1				5 V		5		FLATPACK, THIN PROFILE, FINE PITCH	QFP48,.35SQ,20				Display Drivers	4.5 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQFP-G48		1.2 mm	7 mm	Not Qualified	e0			7 mm
ADN2841ACP-48	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1				5 V		5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20				Display Drivers	4.5 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e0		240	7 mm
ADN2847ACP-48	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1				3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20				Display Drivers	3 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N48		1 mm	7 mm	Not Qualified	e0			7 mm
ADN2841ACP-48-REEL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1				5 V		5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20				Display Drivers	4.5 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e0		240	7 mm
ADN2847ACPZ-48	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1				3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20				Display Drivers	3 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e3		260	7 mm
ADN2841ACPZ-48	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1				5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						4.5 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e3	30	260	7 mm
ADN2847ACP-48-RL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1				3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20				Display Drivers	3 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e0		240	7 mm
ADN2841ACP-48-RL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1				5 V		5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20				Display Drivers	4.5 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e0		240	7 mm
MAX20091ATM/V+	Analog Devices		AUTOMOTIVE	NO LEAD	48	QCCN	SQUARE	PLASTIC/EPOXY		YES			BICMOS	AEC-Q100		14 V		14		CHIP CARRIER	LCC48,.27SQ,20				Other Interface ICs		.5 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQCC-N48	1			Not Qualified	e3	30	260
MAX3783UCM+	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	BIPOLAR			3.3 V				FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH						3 V	.5 mm	85 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G48	3	1.2 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX20091ATM/V+T	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	28 V	1	BICMOS			14 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						7.5 V	.5 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N48	1	.8 mm	7 mm		e3	30	260	7 mm
MAX3783UCM+D	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	BIPOLAR			3.3 V				FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH						3 V	.5 mm	85 Cel		0 Cel	MATTE TIN	QUAD	S-PQFP-G48	3	1.2 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX3783UCM+TD	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	BIPOLAR			3.3 V				FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH						3 V	.5 mm	85 Cel		0 Cel	MATTE TIN	QUAD	S-PQFP-G48	3	1.2 mm	7 mm	Not Qualified	e3	30	260	7 mm
LC898111AXB-MH	Onsemi	INTERFACE CIRCUIT		BALL	48	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V	1	CMOS			3 V	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			2.6 V			2.6 V	.4 mm				TIN SILVER COPPER	BOTTOM	R-PBGA-B48	1	.69 mm	2.57 mm		e1	30	260	3.22 mm
LC75834E	Onsemi		INDUSTRIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	SEGMENT	YES			CMOS		.46 mA			3/5		FLATPACK	QFP48,.65SQ,40	136		4-BP	Other Interface ICs		1 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G48				Not Qualified

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.