56 Other Function Interface ICs 29

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Display Mode	Surface Mount	Maximum Supply Voltage	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	No. of Digits/Characters	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	No. of Segments	No. of Backplanes	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LT8500ITJ#PBF	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	BUTT	56	HVFLGA	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1		BIPOLAR				3.3 V		GRID ARRAY, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	SLGA56,11X11,22				3 V	.55 mm	125 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B56		.83 mm	6 mm		SEATED HT-CALCULATED	e3			6 mm
LT8500ETJ#PBF	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	BUTT	56	HVFLGA	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1		BIPOLAR				3.3 V		GRID ARRAY, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	SLGA56,11X11,22				3 V	.55 mm	125 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B56		.83 mm	6 mm		SEATED HT-CALCULATED	e3			6 mm
FPC402RHUT	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	RECTANGULAR	PLASTIC/EPOXY		YES	3.3 V	1								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					1.8 V	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	R-PQCC-N56	2	.8 mm	5 mm			e3	30	260	11 mm
HD3SS2522RHUR	Texas Instruments	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					3 V	.5 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQCC-N56	3	.8 mm	5 mm			e4	30	260	11 mm
PI4IOE5V96248ZLEX	Diodes Incorporated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.27SQ,16				2.3 V	.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.8 mm	7 mm				NOT SPECIFIED	NOT SPECIFIED	7 mm
PCF8536BT/1,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	SEGMENT	YES				CMOS		.13 mA	40-CHARACTER		2/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	44	8-BP	Other Interface ICs		.5 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G56	1			Not Qualified				260
PI2EQX5864DZFE	Pericom Semiconductor	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	RECTANGULAR	UNSPECIFIED		YES	1.25 V	1				800 mA		1.2 V	1.2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.19X.43,20			Other Interface ICs	1.15 V	.5 mm	70 Cel	0 Cel		QUAD	R-XQCC-N56		.8 mm	5 mm	Not Qualified					11 mm
FPC402RHUR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	RECTANGULAR	PLASTIC/EPOXY		YES	3.3 V	1								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					1.8 V	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	R-PQCC-N56	2	.8 mm	5 mm			e3	30	260	11 mm
FPC202RHUR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	RECTANGULAR	PLASTIC/EPOXY		YES	3.3 V	1								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					1.8 V	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	R-PQCC-N56	2	.8 mm	5 mm			e3	30	260	11 mm
HD3SS2522RHU	Texas Instruments	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					3 V	.5 mm	70 Cel	0 Cel		QUAD	R-PQCC-N56		.8 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	11 mm
FPC202RHUT	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	RECTANGULAR	PLASTIC/EPOXY		YES	3.3 V	1								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					1.8 V	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	R-PQCC-N56	2	.8 mm	5 mm			e3	30	260	11 mm
FPC401RHUT	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	RECTANGULAR	PLASTIC/EPOXY		YES		1								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	R-PQCC-N56	2	.8 mm	5 mm		HOST SIDE I/O SUPPLY VOLTAGE= 1.8V TO 3.3V	e3	30	260	11 mm
FPC401RHUR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	RECTANGULAR	PLASTIC/EPOXY		YES		1								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	R-PQCC-N56	2	.8 mm	5 mm		HOST SIDE I/O SUPPLY VOLTAGE= 1.8V TO 3.3V	e3	30	260	11 mm
SN75DP122ARTQT	Texas Instruments	INTERFACE CIRCUIT	OTHER	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	2					3.3 V	3.3,5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20			Other Interface ICs	3 V	.5 mm	85 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N56	3	1 mm	8 mm	Not Qualified	IT ALSO NEED 5V SUPPLY VOLTAGE	e4	30	260	8 mm
SN75DP122ARTQR	Texas Instruments	INTERFACE CIRCUIT	OTHER	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	2					3.3 V	3.3,5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20			Other Interface ICs	3 V	.5 mm	85 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N56	3	1 mm	8 mm	Not Qualified	IT ALSO NEED 5V SUPPLY VOLTAGE	e4	30	260	8 mm
LT8500ITJ#TRPBF	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	BUTT	56	HVFLGA	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1		BIPOLAR				3.3 V		GRID ARRAY, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	SLGA56,11X11,22				3 V	.55 mm	125 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B56		.83 mm	6 mm		SEATED HT-CALCULATED	e3			6 mm
LT8500IUHH#PBF	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	56	HVQCCN	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1		BIPOLAR				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.19X.35,16				3 V	.4 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	R-PQCC-N56	1	.8 mm	5 mm	Not Qualified		e3	30	260	9 mm
LT8500ETJ#TRPBF	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	BUTT	56	HVFLGA	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1		BIPOLAR				3.3 V		GRID ARRAY, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	SLGA56,11X11,22				3 V	.55 mm	125 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B56		.83 mm	6 mm		SEATED HT-CALCULATED	e3			6 mm
LT8500IUHH#TRPBF	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	56	HVQCCN	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1		BIPOLAR				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.19X.35,16				3 V	.4 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	R-PQCC-N56	1	.8 mm	5 mm	Not Qualified		e3	30	260	9 mm
LT8500EUHH#PBF	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	56	HVQCCN	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1		BIPOLAR				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.19X.35,16				3 V	.4 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	R-PQCC-N56	1	.8 mm	5 mm	Not Qualified		e3	30	260	9 mm
LT8500EUHH#TRPBF	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	56	HVQCCN	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1		BIPOLAR				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.19X.35,16				3 V	.4 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	R-PQCC-N56	1	.8 mm	5 mm	Not Qualified		e3	30	260	9 mm
PCA8536BT/Q900/1,1	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	SEGMENT	YES				CMOS	AEC-Q100	.13 mA	40-CHARACTER		2/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	320	8-BP	Other Interface ICs		.5 mm	95 Cel	-40 Cel		DUAL	R-PDSO-G56	1			Not Qualified				260
PCF8536AT/1,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	SEGMENT	YES				CMOS		.13 mA	40-CHARACTER		2/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	44	8-BP	Other Interface ICs		.5 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G56	1			Not Qualified				260
PCA8536AT/Q900/1,1	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	SEGMENT	YES				CMOS	AEC-Q100	.13 mA	40-CHARACTER		2/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	320	8-BP	Other Interface ICs		.5 mm	95 Cel	-40 Cel		DUAL	R-PDSO-G56	1			Not Qualified				260
PCF8576DT/2-T	NXP Semiconductors		INDUSTRIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	SEGMENT	YES				CMOS		.02 mA			2/5,3/6	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	40	4-BP	Other Interface ICs		.5 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G56				Not Qualified
PI2EQX5964ZFEX	Diodes Incorporated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	RECTANGULAR	UNSPECIFIED		YES	1.25 V	1				800 mA		1.2 V	1.2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.19X.43,20			Other Interface ICs	1.15 V	.5 mm	85 Cel	-40 Cel		QUAD	R-XQCC-N56		.8 mm	5 mm	Not Qualified					11 mm
PI2EQX5964ZFE	Diodes Incorporated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	RECTANGULAR	UNSPECIFIED		YES	1.25 V	1				800 mA		1.2 V	1.2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.19X.43,20			Other Interface ICs	1.15 V	.5 mm	85 Cel	-40 Cel		QUAD	R-XQCC-N56		.8 mm	5 mm	Not Qualified					11 mm
PI2EQX6874ZFE	Diodes Incorporated	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	RECTANGULAR	UNSPECIFIED		YES	1.25 V	1				800 mA		1.2 V	1.2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.19X.43,20			Other Interface ICs	1.15 V	.5 mm	70 Cel	0 Cel		QUAD	R-XQCC-N56		.8 mm	5 mm	Not Qualified					11 mm
PI2EQX6874ZFEX	Diodes Incorporated	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	RECTANGULAR	UNSPECIFIED		YES	1.25 V	1				800 mA		1.2 V	1.2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.19X.43,20			Other Interface ICs	1.15 V	.5 mm	70 Cel	0 Cel		QUAD	R-XQCC-N56		.8 mm	5 mm	Not Qualified					11 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.