Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Display Mode | Surface Mount | Maximum Supply Voltage | Maximum Output Current | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Built-in Protections | Interface Standard | Maximum Supply Current | No. of Digits/Characters | Output Latch/Register | Nominal Supply Voltage | Maximum Supply Voltage-1 | Turn-on Time | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | No. of Segments | Minimum Supply Voltage-1 | No. of Backplanes | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Driver No. of Bits | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Nominal Output Peak Current Limit | Width | Turn-off Time | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Maximum Receive Delay |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Diodes Incorporated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.2/2.5,1.5/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Other Interface ICs |
.635 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.2/2.5,1.5/3.3 |
SMALL OUTLINE |
SOLCC8,.05,16 |
Other Interface ICs |
.4 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-N8 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.2/2.5,1.5/3.3 |
SMALL OUTLINE |
SOLCC8,.05,16 |
Other Interface ICs |
.4 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-N8 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.2/2.5,1.5/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Other Interface ICs |
.635 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BIPOLAR |
-2.5/-5,3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.1 |
Other Interface ICs |
.635 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
1.2 V |
5.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.65 V |
.9 V |
.4 mm |
85 Cel |
3 V |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
R-PBGA-B8 |
1 |
.69 mm |
.837 mm |
e2 |
30 |
260 |
1.627 mm |
||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
8 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
BICMOS |
1.8/5 |
GRID ARRAY, FINE PITCH |
BGA8,3X3,20 |
Other Interface ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B8 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
1.8 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
1.2 V |
.65 mm |
85 Cel |
-40 Cel |
Nickel/Gold/Palladium (Ni/Au/Pd) |
DUAL |
R-PDSO-G8 |
1 |
1.45 mm |
1.625 mm |
30 |
260 |
2.9 mm |
|||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
BICMOS |
2.5 V |
3.2 V |
1.8/3.3 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSSOP8,.1 |
1.2 V |
Other Interface ICs |
1.65 V |
.65 mm |
85 Cel |
1.8 V |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
1.45 mm |
1.625 mm |
Not Qualified |
e0 |
245 |
2.9 mm |
||||||||||||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
1.2 V |
5.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.65 V |
.9 V |
.4 mm |
85 Cel |
3 V |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
R-PBGA-B8 |
1 |
.69 mm |
.837 mm |
e2 |
30 |
260 |
1.627 mm |
||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
8 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
BICMOS |
1.8/5 |
GRID ARRAY, FINE PITCH |
BGA8,3X3,20 |
Other Interface ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B8 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
2 |
BICMOS |
3.3 V |
5.5 V |
1.8/5 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSSOP8,.1 |
1.65 V |
Other Interface ICs |
1.2 V |
.65 mm |
85 Cel |
3.3 V |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
1.45 mm |
1.625 mm |
Not Qualified |
USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION |
e0 |
2.9 mm |
||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BICMOS |
1.8/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.1 |
Other Interface ICs |
.635 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BICMOS |
1.8/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.1 |
Other Interface ICs |
.635 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
5 V |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Other Interface ICs |
4.5 V |
.65 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e0 |
20 |
240 |
3 mm |
||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
8 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
BICMOS |
1.8/5 |
GRID ARRAY, FINE PITCH |
BGA8,3X3,20 |
Other Interface ICs |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B8 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
2 |
BICMOS |
3.3 V |
5.5 V |
1.8/5 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSSOP8,.1 |
1.65 V |
Other Interface ICs |
1.2 V |
.65 mm |
85 Cel |
3.3 V |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
1.45 mm |
1.625 mm |
Not Qualified |
USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION |
e0 |
2.9 mm |
||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
BICMOS |
2.5 V |
3.2 V |
1.8/3.3 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSSOP8,.1 |
1.2 V |
Other Interface ICs |
1.65 V |
.65 mm |
85 Cel |
1.8 V |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
1.45 mm |
1.625 mm |
Not Qualified |
e0 |
245 |
2.9 mm |
||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BICMOS |
1.8/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.1 |
Other Interface ICs |
.635 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
MILITARY |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
5 V |
SMALL OUTLINE |
4.5 V |
1.27 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
e0 |
4.9 mm |
|||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
1.2 V |
5.5 V |
1.2/5,1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA8,2X4,16 |
1.65 V |
Other Interface ICs |
.9 V |
.4 mm |
85 Cel |
3 V |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
R-PBGA-B8 |
1 |
.69 mm |
.835 mm |
Not Qualified |
e2 |
30 |
260 |
1.625 mm |
||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
8 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
BICMOS |
1.8/5 |
GRID ARRAY, FINE PITCH |
BGA8,3X3,20 |
Other Interface ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B8 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BICMOS |
1.8/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.1 |
Other Interface ICs |
.635 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
2 |
BICMOS |
3.3 V |
5.5 V |
1.8/5 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSSOP8,.1 |
1.65 V |
Other Interface ICs |
1.2 V |
.65 mm |
85 Cel |
3.3 V |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
1.45 mm |
1.625 mm |
Not Qualified |
USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION |
e0 |
2.9 mm |
||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
1.8 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
1.2 V |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
1.45 mm |
1.625 mm |
NOT SPECIFIED |
NOT SPECIFIED |
2.9 mm |
|||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
MILITARY |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
5 V |
SMALL OUTLINE |
4.5 V |
1.27 mm |
125 Cel |
-55 Cel |
DUAL |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
|||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BICMOS |
1.8/5 |
SMALL OUTLINE |
SOLCC8,.12,25 |
Other Interface ICs |
.635 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-N8 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
8 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
BICMOS |
1.8/5 |
GRID ARRAY, FINE PITCH |
BGA8,3X3,20 |
Other Interface ICs |
.5 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn63Pb37) |
BOTTOM |
S-PBGA-B8 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
1.2 V |
5.5 V |
1.2/5,1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA8,2X4,16 |
1.65 V |
Other Interface ICs |
.9 V |
.4 mm |
85 Cel |
3 V |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
R-PBGA-B8 |
1 |
.69 mm |
.837 mm |
Not Qualified |
e2 |
30 |
260 |
1.627 mm |
||||||||||||||||||||||||
|
Toshiba |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
1.2/2.5,1.8/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.12,20 |
Other Interface ICs |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||
|
Toshiba |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC |
YES |
CMOS |
1.5/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.12,20 |
Other Interface ICs |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||
|
Toshiba |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4.5 V |
1 |
BIPOLAR |
3.6 V |
4.5 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
TSSOP8,.12,20 |
Display Drivers |
2.5 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
.9 mm |
2 mm |
Not Qualified |
e4 |
2.3 mm |
||||||||||||||||||||||||||||||
|
Toshiba |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4.5 V |
1 |
BIPOLAR |
3.6 V |
4.5 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
TSSOP8,.12,20 |
Display Drivers |
2.5 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
.9 mm |
2 mm |
Not Qualified |
e4 |
2.3 mm |
||||||||||||||||||||||||||||||
Toshiba |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4.5 V |
1 |
BIPOLAR |
3.6 V |
4.5 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
TSSOP8,.12,20 |
Display Drivers |
2.5 V |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
.9 mm |
2 mm |
Not Qualified |
2.3 mm |
|||||||||||||||||||||||||||||||||
Toshiba |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4.5 V |
1 |
BIPOLAR |
3.6 V |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
2.5 V |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
.9 mm |
2 mm |
2.3 mm |
|||||||||||||||||||||||||||||||||||||
|
Toshiba |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
1.2/2.5,1.8/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.12,20 |
Other Interface ICs |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||
Toshiba |
INDUSTRIAL |
NO LEAD |
8 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
1.2/2.5,1.8/3.3 |
SMALL OUTLINE |
SOLCC8,.05,16 |
Other Interface ICs |
.4 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-N8 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||
Toshiba |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC |
YES |
CMOS |
1.5/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.12,20 |
Other Interface ICs |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||
Toshiba |
INTERFACE CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
1 |
BIPOLAR |
83 mA |
5 V |
5 |
IN-LINE |
DIP8,.3 |
Display Drivers |
4.75 V |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T8 |
5 mm |
7.62 mm |
Not Qualified |
|||||||||||||||||||||||||||||||||
Toshiba |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4.5 V |
1 |
BIPOLAR |
3.6 V |
4.5 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
TSSOP8,.12,20 |
Display Drivers |
2.5 V |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
.9 mm |
2 mm |
Not Qualified |
2.3 mm |
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Toshiba |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
8 |
FBGA |
RECTANGULAR |
PLASTIC |
YES |
CMOS |
1.2/3.3 |
GRID ARRAY, FINE PITCH |
BGA8,2X4,16 |
Other Interface ICs |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
Not Qualified |
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Toshiba |
INTERFACE CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
8 |
RECTANGULAR |
UNSPECIFIED |
NO |
8 V |
1 |
7 V |
-4.5 V |
MICROELECTRONIC ASSEMBLY |
-3.5 V |
6 V |
70 Cel |
-4 V |
-20 Cel |
SINGLE |
R-XSMA-T8 |
Not Qualified |
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|
Renesas Electronics |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE |
SOP8,.25 |
3 V |
1.27 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
DUAL |
R-PDSO-G8 |
1 |
1.83 mm |
3.9 mm |
e4 |
NOT SPECIFIED |
NOT SPECIFIED |
4.885 mm |
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|
Renesas Electronics |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE |
SOP8,.25 |
3 V |
1.27 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
DUAL |
R-PDSO-G8 |
1 |
1.83 mm |
3.9 mm |
e4 |
NOT SPECIFIED |
NOT SPECIFIED |
4.885 mm |
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|
Renesas Electronics |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
1.73 mm |
3.94 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4.93 mm |
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|
Renesas Electronics |
DIGITAL ISOLATOR |
MILITARY |
GULL WING |
8 |
SOP |
RECTANGULAR |
30k Rad(Si) |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
EIA-485; EIA-422 |
3.3 V |
SMALL OUTLINE |
SOP8,.25 |
3 V |
1.27 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
R-PDSO-G8 |
1 |
1.83 mm |
3.9 mm |
e4 |
4.885 mm |
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Renesas Electronics |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
8 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
4.5 V |
.8 mm |
85 Cel |
0 Cel |
TIN LEAD |
DUAL |
S-XDSO-N8 |
.85 mm |
4 mm |
Not Qualified |
e0 |
4 mm |
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|
Renesas Electronics |
BUS BUFFERS |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
2.5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
2.3 V |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.
Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:
1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.
2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.
3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.
Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.