9 Other Function Interface ICs 21

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX3373EEBL-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V	2	BICMOS	3.3 V	5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			1.52 mm
DRV2604YZFT	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	UNSPECIFIED	YES	5.5 V	1		3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				2.5 V	.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	S-XBGA-B9	1	.625 mm	1.44 mm			e1	30	260	1.44 mm
KA2284B	Samsung	INTERFACE CIRCUIT		THROUGH-HOLE	9	SIP	RECTANGULAR	PLASTIC/EPOXY	NO		1					IN-LINE					2.54 mm					SINGLE	R-PSIP-T9		7.3 mm	3 mm	Not Qualified					21.84 mm
TPD2S300YFFR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY	YES	4.5 V	1		3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				2.7 V	.4 mm	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	S-PBGA-B9	1	.625 mm	1.4 mm		ALSO REQUIRED VM = 2.7V TO 22V SUPPLY	e1	NOT SPECIFIED	NOT SPECIFIED	1.4 mm
DRV2604LYZFT	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	UNSPECIFIED	YES	5.2 V	1		3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				2 V	.5 mm	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	S-XBGA-B9	1	.625 mm	1.44 mm			e1	30	260	1.44 mm
DRV2604YZFR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	UNSPECIFIED	YES	5.5 V	1		3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				2.5 V	.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	S-XBGA-B9	1	.625 mm	1.44 mm			e1	30	260	1.44 mm
DRV2604LYZFR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	UNSPECIFIED	YES	5.2 V	1		3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				2 V	.5 mm	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	S-XBGA-B9	1	.625 mm	1.44 mm			e1	30	260	1.44 mm
MAX13014EBL+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	2	BICMOS	2.5 V	3.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.2 V		1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified		e1	30	260	1.52 mm
MAX13015EBL-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	2	BICMOS	2.5 V	3.2 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20	1.2 V	Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified		e0		245	1.52 mm
MAX13017EBL-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	2	BICMOS	2.5 V	3.2 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20	1.2 V	Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified		e0		245	1.52 mm
MAX13016EBL-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	2	BICMOS	2.5 V	3.2 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20	1.2 V	Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified		e0		245	1.52 mm
MAX3375EEBL-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V	2	BICMOS	3.3 V	5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			1.52 mm
MAX3372EEBL-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V	2	BICMOS	3.3 V	5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			1.52 mm
MAX3374EEBL-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V	2	BICMOS	3.3 V	5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			1.52 mm
MAX3377EEBC-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V	4	BICMOS	3.3 V	5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			1.52 mm
MAX13014EBL-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	2	BICMOS	2.5 V	3.2 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20	1.2 V	Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified		e0		245	1.52 mm
MAX3376EEBL-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V	2	BICMOS	3.3 V	5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			1.52 mm
MAX14834EWL+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	34 V	1	BICMOS	24 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				4.75 V	.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B9	1	.69 mm	1.568 mm			e2	30	260	2 mm
MAX3394EEBL	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	FBGA	SQUARE	PLASTIC/EPOXY	YES			BICMOS			1.8/5	GRID ARRAY, FINE PITCH	BGA9,3X3,20		Other Interface ICs		.5 mm	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	S-PBGA-B9				Not Qualified		e0
KA2287B	Samsung	INTERFACE CIRCUIT		THROUGH-HOLE	9	SIP	RECTANGULAR	PLASTIC/EPOXY	NO		1					IN-LINE					2.54 mm					SINGLE	R-PSIP-T9		7.3 mm	3 mm	Not Qualified					21.84 mm
KA2285B	Samsung	INTERFACE CIRCUIT		THROUGH-HOLE	9	SIP	RECTANGULAR	PLASTIC/EPOXY	NO		1					IN-LINE					2.54 mm					SINGLE	R-PSIP-T9		7.3 mm	3 mm	Not Qualified					21.84 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.